Ultrasonics

R. Teti, P. De Santo
Department of Materials and Production Engineering, University of Naples Federico II, Naples, Italy

Abstract

The main objective of this work is the investigation on micro-nondestructive evaluation (micro-NDE) metrology for dimensional measurement and quality control of multi-material electronic devices consisting of chipset tablet assemblies. The micro-NDE approach is based on ultrasonic (US) sensors in pulse-echo testing mode applied according to the full-volume immersion scan method that provides for the US axial tomography of the chipset tablet. The thickness of the multi-material chipset tablet assembly layers was evaluated through micro-US 2½ D geometrical measurements and the chipset tablet inter-layer integrity was critically assessed via micro feature US image analysis.