surface activation

T.Rogers & I.Malmros
Applied Microengineering Limited, Unit 8 Library Avenue, Didcot, Oxon.,OX11 0SG, UK

Abstract

A new multi-purpose MEMS fabrication tool is described. The tool enables in-situ aligned embossing and nanoimprinting, in addition to surface activation and aligned wafer bonding. De-embossing is also included in-situ via the use of vacuum chucks and chamber pressurisation. The multi-purpose tool enables the fabrication of bonded, embossed, multi-layer, micro-fluidic devices, for example PDMS structures on silicon, including the alignment of the embossed structure to any pre-existing patterning on the silicon. Examples are presented of various structures that have been made using the tool along with a description of the principles of operation.