transfer bonding
Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development
D. Bhattacharyya (a), R. V. Wright (a), Q. Zhang (a), P.B. Kirby (a), R. Guerre (b), U. Drechsler (b), M. Despont (b),
F. Saharil (c), J.Oberhammer (c)
(a) Materials Department, Cranfield University, Bedford MK43 0AL, UK
(b) IBM Research Gmbh, Zurich Research Laboratory, Rueschlikon, Switzerland
(c) Microsystem Technology Lab, KTH – Royal Institute of Technology, Stockholm, Sweden
Abstract
Transfer bonding is a reliable cost-efficient and low-temperature CMOS compatible technique which allows batch integration of materials whose incompatibility with Si makes them unsuitable for monolithic integration. In this heterogeneous device integration method the material and process incompatibilities inherent in Si IC technology are overcome by fabricating devices on separate substrates and then transferring them onto target (e.g. CMOS) wafers. Transfer bonding has great potential for integrating RF-MEMS devices incorporating, for example, high thermal budget materials such as PZT and PST or non-ferroelectric piezoelectrics such as AlN and ZnO into microwave ICs for enhanced systems performance. This paper presents an overview of technology developments within the EU sponsored project Q2M for the realization of transfer bonded piezoelectrically actuated RF MEMS switches and other components focusing in particular on material factors relating to growth of the piezoelectric films, in this case sol-gel deposited PZT, that restricts the choice of device layers and impact on PZT properties such as microstructure, film orientation and piezoelectric coefficients. New process developments such as hard masking of PZT pattern during RIE etching and its compatibility with polymer transfer bonding are discussed.
categories
Adhesive bonding | Assembly & packaging | PZT | RF MEMS switches | sol-gel | switches | transfer bonding
| 145 reads | Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies
T. Grund, M. Heckele and M. Kohl
Forschungszentrum Karlsruhe GmbH, Institute for Microstructure Technology (IMT),Postfach 3640, 76021 Karlsruhe, Germany
Abstract
A batch compatible process flow to overcome the costly piece by piece assembly of hybrid microsystems is shown. Hot embossing is used to fabricate microstructured polymer layers. Wafer scale compatible bonding tasks are carried out by ultrasonic welding and heat activated bonding with micromachined bonding foils. As demonstrator device, a shape memory alloy (SMA) actuated polymer microvalve is introduced. The valve concept, fabrication technologies and device characteristics are discussed.
categories
Assembly & packaging | batch fabrication | polymer microvalve | polymers | shape memory alloy | TiNi actuator | transfer bonding
Copyright© 4M Network of Excellence.