micro-electronic component
Micro-stamping of Molybdenum Rhenium Components
N. Boudeaua (b), S. Thibauda (b), J.F. Michel (a)
a Department LMARC, FEMTO-ST Institute, 25000 Besançon, France
b ENSMM, 25030 Besançon cedex, France
Abstract
Optimizing productivity, parts quality, reducing production costs are objectives that companies must perpetually satisfy to remain competitive. An efficient solution, but complex to implement, consists in modifying completely the manufacturing process. That is the goal of these research works : it consists in manufacturing micro-electronic components by deep drawing which are currently rolled and welded leading to a strong rate of reject.
The objective of this work is to study the feasibility of skirts of Molybdenum Rhenium cathodes by micro-stamping. First, various nuances of Molybdenum Rhenium to low thickness (< 100 μm) have been characterized in their (large) plastic range of deformation.
Secondly, a forming process leading to no folds and no tears has been defined by means of finite element simulations.
Finally, a modular micro-stamping tool has been developed ; it includes the blanking process and the forming procedures. The different forming stages are determined from numerical simulations. The two first stages have been investigated experimentally and are presented.
categories
metals | micro-electronic component | Micro-fabrication | micro-stamping | Molybdenum Rhenium
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