Geometric properties
A New Method for Directly Determining the Adhesive Strength of Conductors on Microstructured MID
H. Willeck(a), W. Eberhardt(a), H. Kück(b)
a: Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Stuttgart, Germany
b: University of Stuttgart, Institute of Micro and Precision Engineering, Germany
Abstract
Through miniaturisation and 3D capability moulded interconnect devices (MID) offer great opportunities for various applications in a broad industrial field. Especially, when applying the laser-direct-structuring process of the company LPKF (LPKF-LDS® process) fine conductors can be fabricated on thermoplastic substrates. A main criterion for the industrial application is the adhesive strength of the conductors. As for LDS MID there is currently no suitable test method for directly determining the adhesive strength of conductors. Therefore, a measuring device consisting of a sensor and peel off unit has been developed at HSG-IMAT. It has been used to investigate a measuring principle utilising a peel off chisel for adhesion determination. Promising and repeatable results have been obtained by testing conductors on thermoplastic substrates.
Non-Destructive Characterization of Multilayer Structures by Low-Coherence Interferometry
Z.V. Djinovic(a)(b), L. Manojlovic(b), M.C. Tomic(c)
a: Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna 1040, Austria
b: Integrated Microsystems Austria, Wiener Neustadt 2700, Austria
c: Institut Bezbednosti, Belgrade 11000, Serbia
Abstract
We present here a non-destructive technique for characterization of multilayer structures based on low-coherence interferometry. This technique is capable to give information of physical thickness and index of refraction of the subjected sample regardless of how many different layers exist along the optical trip. The main limitation is if the investigated materials are transparent for the used optical wavelength. We performed sensing set up in the form of single-mode fiber-optic Michelson interferometer composed of one 2×2 optical coupler. There were tested three and five layers foils composed of sandwich structure made by alternation of polyarilate (PAR) and glue layer. We achieved a success discriminate the interface between the two different materials with accuracy of about 40 nm by analyzing low-coherence interferograms.
Characterization of Pulses in Micro EDM Milling Based on Wear and Material Removal
G. Bissacco(a), J. Valentincic(b), B.D. Wiwe(a), H.N. Hansen(a)
a: Department of Manufacturing Engineering and Management (IPL), Technical University of Denmark (DTU), Produktionstorvet 2800 Kgs. Lyngby, Denmark
b: Laboratory for Alternative Technologies, Faculty of Mechanical Engineering, University of Ljubljana
Abstract
This paper presents an investigation on wear and material removal in micro EDM milling for selected process parameters combinations typical of rough and finish machining of micro features in steel using state of the art equipment. Based on discharge counting and volume measurements, electrode wear unit and material removal unit are measured for several energy levels. The influence of the accuracy of volume measurements on the electrode wear unit and material removal unit are discussed and the issues limiting the applicability of real time wear sensing in micro EDM milling are presented.
Dimensional Metrology in Micro Manufacturing
H.N. Hansen
Department of Manufacturing Engineering and Management, Produktionstorvet, Building 427S, Technical University of Denmark, 2800 Kgs. Lyngby, Denmark
Abstract
The need for dimensional metrology at micro and nano scale is evident both in terms of quality assurance of components and products and in terms of process control. As critical dimensions are scaled down and geometrical complexity of objects is increased, the available measurement technologies appear not sufficient. New solutions for measuring principles and instrumentation, tolerancing rules and procedures as well as traceability and calibration are necessary if micro manufacturing is to develop into industrial manufacturing solutions. The current paper describes issues and challenges in dimensional metrology at micro scale by reviewing typical measurement tasks and the measuring capability of available instrumentation. Traceability and calibration issues are discussed subsequently. Finally needs and gaps are identified based on these observations.
Copyright© 4M Network of Excellence.