switches

Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development

D. Bhattacharyya (a), R. V. Wright (a), Q. Zhang (a), P.B. Kirby (a), R. Guerre (b), U. Drechsler (b), M. Despont (b),
F. Saharil (c), J.Oberhammer (c)
(a) Materials Department, Cranfield University, Bedford MK43 0AL, UK
(b) IBM Research Gmbh, Zurich Research Laboratory, Rueschlikon, Switzerland
(c) Microsystem Technology Lab, KTH – Royal Institute of Technology, Stockholm, Sweden

Abstract

Transfer bonding is a reliable cost-efficient and low-temperature CMOS compatible technique which allows batch integration of materials whose incompatibility with Si makes them unsuitable for monolithic integration. In this heterogeneous device integration method the material and process incompatibilities inherent in Si IC technology are overcome by fabricating devices on separate substrates and then transferring them onto target (e.g. CMOS) wafers. Transfer bonding has great potential for integrating RF-MEMS devices incorporating, for example, high thermal budget materials such as PZT and PST or non-ferroelectric piezoelectrics such as AlN and ZnO into microwave ICs for enhanced systems performance. This paper presents an overview of technology developments within the EU sponsored project Q2M for the realization of transfer bonded piezoelectrically actuated RF MEMS switches and other components focusing in particular on material factors relating to growth of the piezoelectric films, in this case sol-gel deposited PZT, that restricts the choice of device layers and impact on PZT properties such as microstructure, film orientation and piezoelectric coefficients. New process developments such as hard masking of PZT pattern during RIE etching and its compatibility with polymer transfer bonding are discussed.

Submitted on July 29, 2008 - 12:20.

KTH - Microsystem Technology & Cleanroom fabrication facility


our research and advisory potential: http://www.s3.kth.se/mst/research/index.shtml.
For our cleanroom facilities: http://www.electrumlaboratoriet.se/.

The Microsystem Technology lab (MST) is a part of the department of Signals, Sensors and Systems (S3). Our research is mainly centered around Microelectromechanical Systems (MEMS) and its applications, with a focus on silicon-based applied sensor and actuator technology. Our research staff has developed a significant number of devices with promising performance. The group fabricates its silicon structures and devices at the KTH microelectronics laboratory, comprising 1200m2 of cleanroom area with all the facilities of small-scale microelectronics and for research on and development of special purpose structures and components in silicon. The group works on applications in the medical field (MedMEMS), the biotechnology field (BioMEMS), optical components (OptoMEMS) and radio frequency signal components (RFMEMS).


wouter
Submitted on May 19, 2005 - 15:20.

Cranfield University


The activity at Cranfield University will involve the integration of activities in two areas: Nanotechnology and Precision Engineering. The Nanotechnology Group at Cranfield University, specialises in fusing micro-engineering and nanotechnology with the industrial application and development of functional materials (especially ferroelectric) to produce novel devices.


Paul B Kirby
Submitted on April 7, 2005 - 08:54.

IMTEK


The Institute for Microsystem Technology (IMTEK), founded in 1995, is one of the largest academic institutions in this field. As it was created completely from scratch as part of the new-founded Faculty of Applied Sciences we share a new campus with modern teaching and training facilities together with the Institute of Computer Science. The foundation of a new technical faculty provided the chance not only to use new facilities but also to create a novel engineering course which differs significantly from traditional engineering disciplines. So the basis for the specification of the course has been the questions for the indispensable skills of a ‘universal’ engineer of the 21st century. The curriculum was inaugurated in October 1996 when the first classes started in the course microsystem technology. The first graduations have been in spring 2001. Between 1998 and 2001 about 90 freshmen started studying Microsystem Technology every year. The curriculum has been modified several times since 1996 in order to comply more and more with our initial goals.


Andreas Schoth
Submitted on March 10, 2005 - 08:08.
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