Micro EDM

A. Rees (a), E. Brousseau (a), S.S. Dimov (a), H. Gruber (b), I. Paganetti (b)

(a) Manufacturing Engineering Centre, Cardiff University, CF24 3AA, UK
(b) AGIE AG für Industrielle Elektronik, Losone, Switzerland

Abstract

This paper investigates the technological capabilities of a micro machining process for performing Wire Electro Discharge Grinding (WEDG). In particular, micro Wire Electrical Discharge Machining (μWEDM) is employed in combination with a rotating submergible spindle to perform WEDG. In this paper, the effects of different factors on the achievable surface finish after WEDG are investigated. In particular, an experimental study employing the Taguchi parameter design method is conducted to identify the most important main cut machining parameters that affect the surface quality of the machined parts. Then, the obtained results are used to analyse the effects of the investigated parameters on the achievable surface roughness, and ultimately to select the optimum technological parameters for performing WEDG. The process parameters that statistically have a significant influence on the surface finish are presented. The study shows that by optimising the main cut machining parameters of WEDG a level of surface finish comparable to that of μWEDM can be achieved.