Classification of micro-metal processing technologies

Classification table

Tue, 03 Jul 2007 12:55:00 +0000

The method chosen in this approach classifies the different micro processes by the physical principles and the process or material interaction on the one hand, and the usability for either small quantity production or serial production on the other hand. In the table, an overview on the described processes is given, classified by means of the physical principle and the material interaction.

physical principle	Process/Material Interaction
physical principle	subtractive	additive	mass containing	joining
mechanical force	Micromilling Microturning Fly cutting Microdrilling Microgrinding Ultrasonic machining ECF		Rolling* Forging* Deep drawing* Bending* Blanking* Embossing* Cold forging* Patterning
melting/vaporization/ablation	Wet etching Reactive Ion Etching EDM ELID Laser Micromachining	CVD PVD	Laser bending	Resistance welding/soldering* Laser welding/soldering* Bonding
dissolution	ECM Lithography and Etching
solidification			Casting* Injection molding*
recomposition		Electroplating Chemical plating Pulse plating Multilayered deposits Electroforming
sintering
LIGA	Combination of dissolution (x-ray lithography), recomposition (electroforming), and mass containing (molding)

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Tue, 13 Nov 2007 10:53:17 +0000

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Fly Cutting

Fri, 13 Jul 2007 13:18:24 +0000

This is some dummy test to test the system. Now try a new paragraph

new pharagraph starts here

Patterning

Tue, 03 Jul 2007 14:19:10 +0000

There are an increasing number of metal surfaces, which are deliberately structured using some regular array of surface height features, which can be referred to as geometrical patterns. The periodic character of those features implies that they are deliberately designed in order to achieve a required performance gain. Different applications will require different geometrical features of patterns. These can be groves, pyramidal recesses, circular or elliptical dimples, squares, etc. In any case they are usually small enough to use the term micro-patterns. Macro patterns and stochastic

Micromachining

Tue, 03 Jul 2007 13:15:24 +0000

Since micromachining implies removal of material, a substrate is required. The substrate must be well defined, since even small defects can disturb the microstructures. Si makes an excellent substrate in the form of the commercially available wafers. Being a single-crystal material, the structure and surface is well defined, and the price for each wafer is acceptable. The thickness of a wafer is usually in the order of from 300 to 1000 µm but other thicknesses are available on request.