Home
»
4M Conference 2005
»
4M2005 presentations
Assembly & Packaging Session
Your subscription was activated.
Micro laser welding of polymer microstructures using low power laser diodes
Multifunctional Packages by Assembly of Bare Dies and SMD on Molded Interconnect Devices (MID)
previous
next
up
Microfluidic Devices with Micronozzles Fabricated by Injection Moulding
Micro laser welding of polymer microstructures using low power laser diodes
Submitted on August 15, 2005 - 10:12.
categories
general
printer-friendly version
| 1439 reads
Copyright© 4M Network of Excellence.
quick links
Navigation
About 4M
Research Divisions
Cross-Divisional Projects
Publications
Advisory Service
Contact Us - Join Us
Partners Area (Login)
Micro-Nano Links
groups
categories
4M association news
4M2005 Conference on Multi-Material Micro Manufacture
4M2006 2nd Call for Papers
Accommodation
Conference Themes
Invited Talks
Presentation Guidelines
Travel Directions
Submission of Abstracts and Full Papers
Important Dates
Book of Abstracts
Proceedings
Programme Committee
Conference Programme
Registration Information
4M 2005 Presentations
Invited Talks
Polymer Processing Workshop
Polymer Processing Session
Ceramics Session
Metals Session
Sensors & Actuators Session
Tooling Technologies Session
Micro Fluidics Session
Assembly & Packaging Session
Micro laser welding of polymer microstructures using low power laser diodes
Multifunctional Packages by Assembly of Bare Dies and SMD on Molded Interconnect Devices (MID)
Metrology Session
Post-Conference Half-day Workshops
Around Karlsruhe
