Fraunhofer IZM
All kinds of Assembly and Packaging Technologies and Equipment suitable for the microsystem implementation
Erik Jung
Submitted on March 31, 2005 - 15:13.
categories
Aerospace | Agriculture | Assembly & packaging | Automotive | Communications | consultancy | design for manufacture | dies | Focussed Ion Beam (FIB) | general | Hot/UV embossing | Injection moulding | Medical | moulds | positioning / fixing | Scientific / Academic Community | small scale production | Space science | stereolithography900 reads
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