MiNaT: 4M HotSpot on integration in microcomponents

The 4M Network, in conjunction with the MINAM EG on Micro-components and Microsapient, has been awarded a slot in the HotSpots programme and is therefore organising a workshop on integration in micro-components.

Topic of the workshop is the need for integration technologies in the field of multifunctional components manufacturing.
Such components will allow further miniaturization and enhanced device functionality as well as less assembly and packaging steps. For example by embedding ICs or MEMS structures in 3D products (e.g. sensors) without intermediate boards. This requires integration on both product and production side. Assembly avoiding technologies such as local patterning, moulding or layering techniques have to be integrated into one economic process flow.

Provisional programme
- General introduction
- Integration in manufacturing of polymer based devices (Pieter Bolt, TNO)
- MID Technologies for polymer based multifunctional 3D packages (Wolfgang Eberhardt, HSG-IMAT)
- Ceramic 3D electronics packaging (Per Johander, Swerea IVF)
- Interactive discussion
- Conclusions and wrap up.