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Q2M Special Session
Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies
Fabrication of piezoelectric thick-film bimorph micro-actuators from bulk ceramics using batch-scale methods
Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development
The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications
Towards Batch Integration of SMA into Microsystems: An Actuator Prototype
Wafer-scale manufacturing of robust trimorph bulk SMA microactuators
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Utilising Electrochemical Deposition for Micro Manufacturing
Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies
Submitted on July 29, 2008 - 10:07.
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Q2M Special Session
Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies
Fabrication of piezoelectric thick-film bimorph micro-actuators from bulk ceramics using batch-scale methods
Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development
The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications
Towards Batch Integration of SMA into Microsystems: An Actuator Prototype
Wafer-scale manufacturing of robust trimorph bulk SMA microactuators
Components: fabrication and assembly technologies
Metrology: inspection and characterisation methods
Novel materials: characterisation and processing
Process characterisation including process chains
Process modelling and simulation
Systems: novel product and system designs
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