| 09:00h - 10:15h |
Keynote Speakers (Auditorium)
Chair: W. Menz, Germany
09:00h Engineered Self-assembly From Nano to Milli Scales
Prof. Karl Boehringer, University of Washington, USA
09:30h Microfluidic chips for biochemical and cell analysis
Prof. Michiel Vellekoop, Vienna University of Technology, Austria
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| 10:15h - 11:15h |
| Poster Session/Coffee break (Exhibition area) |
| 11:15h - 12:30h |
Session 5
Novel materials (Auditorium)
Chair: P. Johander, IVF, Sweden
11:15h Micromachined silicon electrodes for electrochemical micromachining
C. Blattert, Hahn-Schickard-Gesellschaft e. V. Institute for Micromachining and Information Technology, Germany
C. Müller, University of Freiburg, Germany
H. Reinecke, Hahn-Schickard-Gesellschaft e. V. Institute for Micromachining and Information Technology and University of Freiburg, Germany
11:30h Machining of polystyrene by UV laser radiation for patch clamping device fabrication
S. Wilson, Forschungszentrum Karlsruhe, Germany and Cranfield University, UK
P.Kirby, Cranfield University, UK
W.Pfleging, A. Welle, Forschungszentrum Karlsruhe, Germany
M.Przylbyski, ATL Lasertechnik GmbH, Germany
11:45h DRIE of non-conventional materials: first results
S. Queste, G. Ulliac, J-C Jeannot, C. Khan Malek, Institute FEMTO-ST/Dpt. France
12:00h Micro-extrusion of ultrafine grained copper
S. Geißdörfer, U. Engel, University of Erlangen-Nuremberg, Germany
A. Rosochowski, University of Strathclyde, UK
L. Olejnikc, Warsaw University of Technology, Poland
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Session 6
Process Modelling/simulation (Room: 0.31)
Chair: U. Engel, Erlangen, Germany
11:15h Micro injection moulding: simulation of melt flow behaviour
C.A. Griffiths, S.S. Dimov, E. B. Brousseau, M. S. Packianather, Cardiff University, UK
11:30h Numerical modelling and experimental characterization of short pulse laser microforming of thin metal sheets
J.L. Ocaña, M. Morales, C. Molpeceres, O. García, J.A. Porro, J.J. García-Ballesteros, Centro Láser UPM, Spain
11:45h Modelling the Solidification-Structure of Al Micro-Castings as a function of their Aspect Ratio and Mould Pouring Temperature
J-F. Charmeuxa, R. Mineva, S. Dimova, E. Mineva, Cardiff University, UK
12:00h Simulation of Microforming Processes by Applying a Mesoscopic Model
S. Geißdörfera, U. Engela, M. Geigera, University of Erlangen-Nuremberg, Germany
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| 12:30h - 14:00h |
| Lunch |
| 14:00h - 15:30h |
Q2M Special Session (Auditorium)
Chair: W. Wijngaart, KTH, Sweden
14:00h The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications
F. Zimmer, M. Friedrichs, M. Mueller, H. Schenk, H. Lakner, Fraunhofer Institute for Photonic Microsystems (IPMS), Germany
T. Bakke, SINTEF Department of Mikrosystems and Nanotechnology, Norway
M. Lapisa, F. Niklaus, KTH-The Royal Institute of Technology, Sweden
14:15h Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies
T. Grund, M. Heckele, M. Kohl, Forschungszentrum Karlsruhe GmbH, Germany
14:30h Wafer-scale manufacturing of robust trimorph bulk SMA microactuators
N. Sandström, S. Braun, G. Stemme, W. van der Wijngaart, KTH-Royal Institute of Technology, SWEDEN
T. Grund, M. Kohl, Forschungszentrum Karlsruhe GmbH, GERMANY
14:45h Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development
D. Bhattacharyya, R. V. Wright, Q. Zhang, P.B. Kirby, Cranfield University, UK
R. Guerre, U. Drechsler, M. Despont, IBM Research Gmbh, Switzerland
F. Saharil, J. Oberhammer, KTH – Royal Institute of Technology, Sweden
15:00h Towards Batch Integration of SMA into Microsystems: an Actuator Prototype
D. Clausi, J. Peirs, D. Reynaerts, Katholieke Universiteit Leuven, Belgium
15:15h Fabrication of piezoelectric thick-film bimorph micro-actuators from bulk ceramics using batch-scale methods
R.P.Jourdain, S. A.Wilson, Cranfield University, UK
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| 15:30h - 16:00h |
| Coffee Break/Poster Session |
| 16:00h - 17:15 |
Session 7
Process-material interactions (Auditorium)
Chair: P. Bolt, TNO, The Netherland
16:00h Influence of process parameter variation on ceramic feedstock flow behaviour
J. Aroni, Forschungszentrum Karlsruhe, Germany
T. Hanemann, Forschungszentrum Karlsruhe, Germany and Albert-Ludwigs-Universität Freiburg, Germany
16:15h Micro Electrical Discharge Machining of Si3N4-based Ceramic Composites
K. Liu, J. Peirs, E. Ferraris, B. Lauwers, D. Reynaerts, Katholieke Universiteit Leuven, Belgium
16:30h Investigation of the mechanical behaviour of thin metal sheets using the hydraulic bulge test
A. Diehl, D. Staud, U. Engel, University of Erlangen-Nuremberg, Germany
16:45h An analysis of the effects of nanolayered nitride coatings on the lifetime and wear of tungsten carbide micromilling tools
D. Zdebski, D.M. Allen, D.J.Stephenson, J. Hedge, Cranfield University, UK
C. Ducros, F. Sanchette, CEA Grenoble, France
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Session 8
Novel processes and process chains (Room 0.31)
Chair:
16:00h Wafer-scale transfer of nanoimprinted pattern into silicon substrates
G. Hubbard, S.J. Abbott, MacDermid Autotype Ltd, UK
Q. Chen, D.W.E. Allsopp, W.N. Wang, C.R. Bowen, R. Stevens, University of Bath, UK
A. Satka D. Hasko, F, Uherek and J. Kovac, International Laser Center, Slovakia
16:15h A new tool for aligned embossing and nano-imprinting
T.Rogers, I.Malmros, Applied Microengineering Limited, UK
16:30h Microfabrication of Components for a Novel Biomimetic Neurological Endoscope
A. Schneider, S. E. Huq, Rutherford Appleton Laboratory, UK
L. Frasson, F. M. Rodriguez Y Baena, B. L. Davies, Depart. of Mechanical Engineering., Imperial College, UK
T. Parittotokkapornc, Institute of Biomedical Engineering, UK
16:45h Single- and multi-layer conductive patterns fabricated using M3D technology
B. Obliers-Hommrich, A. Fischerb, H. Willeck, W. Eberhardt, Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Germany
H. Kück, University of Stuttgart, Germany
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| 19:00h - 20.30h |
| A Cocktail Reception |
