Classification of micro-metal processing technologies
Classification table
The method chosen in this approach classifies the different micro processes by the physical principles and the process or material interaction on the one hand, and the usability for either small quantity production or serial production on the other hand. In the table, an overview on the described processes is given, classified by means of the physical principle and the material interaction.
| physical principle | Process/Material Interaction | |||
|---|---|---|---|---|
| subtractive | additive | mass containing | joining | |
| mechanical force | Micromilling Microturning Fly cutting Microdrilling Microgrinding Ultrasonic machining ECF |
Rolling* Forging* Deep drawing* Bending* Blanking* Embossing* Cold forging* Patterning |
||
| melting/vaporization/ablation | Wet etching Reactive Ion Etching EDM ELID Laser Micromachining |
CVD PVD |
Laser bending | Resistance welding/soldering* Laser welding/soldering* Bonding |
| dissolution | ECM Lithography and Etching |
|||
| solidification | Casting* Injection molding* |
|||
| recomposition | Electroplating Chemical plating Pulse plating Multilayered deposits Electroforming |
|||
| sintering | ||||
| LIGA | Combination of dissolution (x-ray lithography), recomposition (electroforming), and mass containing (molding) | |||
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Fly Cutting
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Patterning
There are an increasing number of metal surfaces, which are deliberately structured using some regular array of surface height features, which can be referred to as geometrical patterns. The periodic character of those features implies that they are deliberately designed in order to achieve a required performance gain. Different applications will require different geometrical features of patterns. These can be groves, pyramidal recesses, circular or elliptical dimples, squares, etc. In any case they are usually small enough to use the term micro-patterns. Macro patterns and stochastic
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Micromachining
Since micromachining implies removal of material, a substrate is required. The substrate must be well defined, since even small defects can disturb the microstructures. Si makes an excellent substrate in the form of the commercially available wafers. Being a single-crystal material, the structure and surface is well defined, and the price for each wafer is acceptable. The thickness of a wafer is usually in the order of from 300 to 1000 µm but other thicknesses are available on request.
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