Grinding/pulverizing technology applicable to silicon

Confidential

The collaborating company is looking to recycle silicon wafer by dispersing silicon particulate through a polymer carrier.
They have a supply chain available for the used silicon in flat pieces (0.6mm thick, various sizes), but have not secured a technology/process or supplier who can grind the silicon into fine granules;
- the required particle size is around 30micron,
- the finished dry 'powder' will have to be 99% pure silicon,

There is significant potential for follow up projects once this can be achieved.

A request for information was circulated to All-Partners via the RAS.

Two different possible technologies for granulating the silicon wafers to the required particle size were proposed by two partners, CEA and Ljubljana. The customer opted to carry out trials using Abrasive Water Jetting (AWJ) as proposed by Ljubljana. Sample material was sent to Ljubljana for processing and the resulting powder was returned to the customer. The grain size, quality and consistency achieved was acceptable for the proposed application. The customer is now able to incorporate the powder into the proposed new product - trials are underway.