Task 4.3.1

Advanced LIGA Technology.

The work of this task will involve: analysing the experience of partners in using UV-LIGA (MIs) for hot embossing and injection moulding; identifying critical layouts and quality parameters in SU-8 processing; evaluating of beneficial and adverse effects of such critical layouts on SU-8 structures and structures from these moulds by e.g electrodeposition; carrying out of experiments on LIGA-test-layouts (provisionally categorised as easy to process, critical form stability, critical transfer of structures) comparing also different substrates (for instance bass plates, nickel plates, thick Si wafer and Si/glass bonded wafers) in order to identify their viability for hot embossing and injection moulding processes; proposing new solutions for reducing the delivery time for UV-LIGA Mis by identifying a possible fabrication chain of LIGA MIs within Polymer partners and the 4M consortium and aiming for an improved / reliable SU-8 process, which fulfils the requirements of microstructure applications in the field of microfluidics, microptics and S&A.