Cross-Divisional Projects
The following cross-divisional Projects have either been completed or are currently in progress:
Cross-divisional Projects
- 3D Electronic Packaging and Interconnection
- Multi Material Micro Manufacturing of Microwave Components (4M MW)
- Analysis and Development of Metrology Solutions for Deep High-Aspect Ratio Micro-Features
- Biocompatibility Evaluation of Encapsulation Materials
- Ceramic Hybrid Gravure Printing
- Future Tooling: Tooling Technology vs Application Requirement
- High-throughput Replication Technologies for Organic Electronics and Photonics
- Integrated Biophotonics Polymer Chip
- Micro- and Nano-structured Surfaces for Liquid and Gas Management in Microstructured Flowfields
- Micro-Chip
- Micromilling
- Micro-Pump
- Micro-Scale Batch Self-Assembly of Microparts
- Microfluidics on Foil
- Nanomembrane Technology and Nanomembrane Based Devices
- Next Generation Micro/Nano Metrology Equipment
- Planar Micromanipulation
- Progress towards 3D Structured Composite Nanomembranes
- Sensor Systems on Foil
Submitted on July 25, 2006 - 10:42.
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