Utilising Electrochemical Deposition for Micro Manufacturing

Peter T. Tang IPU Manufacturing, Kemitorvet 204, 2800 Kgs. Lyngby, Denmark

Abstract

Electrochemical deposition, comprising both electroplating and electroless plating, plays an important role as an indispensable process family utilised in many micro manufacturing process chains. Advantages of electrochemical deposition, such as deposition speed, relatively inexpensive equipment, reliability, the large amount of available processes as well as the almost atom-by-atom replication of a given substrate, has given the technology its present position within microelectronics, surface treatment and recently also micro- and nano-manufacturing. The present paper will briefly describe all the major disciplines of electrochemical deposition, as well as some of the problems and challenges that are usually associated with the different deposition processes. Finally are two applications, an all-nickel AFM cantilever and a new process chain for fabrication of tool inserts for injections moulding, described in some detail.