Call for Papers

Please click 4M2008 Call for papers if you wish to print a copy for your information and use. The 4M2007 Call for Papers includes information as follows

• Conference Scope
• Themes
• Submission of Full Papers
• Paper Review
• Oral and Poster presentation
• Important dates
• Venue/Location
• Proceedings
• Organising Committee
• Contact details

Important Deadlines

Important Deadlines

event	date
Submission site will open	2 January 2008
Submission deadline of full papers	10 February 2008
Feed back from the peer review to authors	27 March 2008
Submission of revised paper	13 April 2008
Notification of acceptance in Final Publication	19 May 2008
Submission of Final paper	1 June 2008
Authors Final Registration	1 June 2008
Public Final Registration	1 September 2008

Invited speakers

Prof. Richard Leach



Prof. Richard Leach is an internationally recognised principal research scientist with nineteen years research and project leadership experience at NPL in various aspects of micro- and nanometrology. His main areas of research have been the measurement of surface texture, 3D metrology of microstructures and low force measurement. Richard gained a BSc in Applied Physics from Kingston University, an MSc in Industrial Measurement Systems from Brunel University and a PhD in Surface Metrology from University of Warwick. He is a member of BSI,
ISO and SEMI committees and is the chair of the UK MNT Measurement Club. He has authored over 80 technical publications in the field of nanometrology including six keynote addresses.




Prof. Karl Böhringer



Karl F. Böhringer received his Dipl.-Inform. degree from the University of Karlsruhe, Germany in 1990 and his M.S. / Ph.D. degrees in computer science from Cornell University, Ithaca, NY in 1993 / 1997. He was a Visiting Scholar at Stanford University in 1994-5 and a Postdoctoral Researcher at the University of California, Berkeley from 1996 to 1998. He joined the Electrical Engineering Department at the University of Washington in Seattle, WA in 1998, where he is professor in microsystems technology. He also held visiting faculty positions at the Universities of Tohoku, Tokyo, Kyoto (Japan), and São Paulo (Brazil). His research interests include microelectromechanical systems (MEMS), manipulation and assembly from macro to nano scales, microfluidic systems for the life sciences, and microrobotics. He has created, among others, multi-batch selfassembling systems, massively parallel microactuator arrays, and a walking microrobot.

Karl F. Böhringer is a member of the IEEE, the Society for Nanoscale Science, Computing and Engineering (ISNSCE), the American Society for Engineering Education (ASEE), and the German Society for Information Sciences (GI). He was awarded a Long-term Invitational Fellowship for Research in Japan by the Japan Society for the Promotion of Science (JSPS) in 2004, an IEEE Robotics & Automation Society Academic Early Career Award in 2004, an NSF CAREER Award in 1999, and an NSF Postdoctoral Associateship in 1997. His work was listed among the “Top 100 Science Stories of 2002” in Discover magazine. He is an editor of the ASME/IEEE Journal of Microelectromechanical Systems and IEEE and he has served, among others, on the technical program committees for the IEEE MEMS and Transducers conferences.




Dr. Peter T. Tang



Peter T. Tang holds an M.Sc. in chemical engineering and a Ph.D. in electrochemical engineering and microtechnology. He has worked for more than 15 years with electroplating and electrochemistry. Currently employed by IPU as senior consultant, he is project leader of several national research projects as well as contract research projects for Danish and international companies.Peter T. Tang has worked with pulse plating of nickel, copper, silver, zinc and various alloys - both for purely scientific studies but also for specific application, lately mainly within the field of micro-technology. He is the author of more than 65 scientific journal and international conference papers and holds seven patents in the field of electrochemistry, electroforming, pulse plating and selective metallisation.




Dr Bill O'Neill

Current situation
Bill is a lecturer in production processes within the Cambridge University Engineering Department. He has written over 70 scientific papers on the subject of laser-matter interactions, optical engineering and manufacturing process technologies, he is a member of a number of government and industrial advisory boards, a member of EPSRC peer review college, and is a non-executive director of Advanced Laser Solutions Ltd.

Background
Bill obtained a B.Sc in Applied Physics from the University of Essex in 1985 and an M.Sc in Laser Physics in 1986. On moving to the John Percy Group, Royal School of Mines, Imperial College, he studied the interaction phenomena of dual-wavelength laser materials processing and obtained a PhD in 1990. He then moved to the University of Liverpool where he continued his research and supported Prof W M Steen in establishing one of the world's largest university based laser research groups.

He was appointed Royal Society Research Fellow, 1990-4, in order to study the gas dynamics of laser cutting and examined rate-limiting affects on the iron-oxygen combustion reactions. This resulted in a number of international patents for new methods of cutting thick section steels with low power lasers, laser machining techniques and optical system design.

In 1995 Bill was appointed Lecturer in the Department of Industrial Studies, University of Liverpool where he continued his research and the development of teaching materials on advanced manufacturing systems and technology, in addition to establishing a research base in laser based rapid production technologies.

In 1998 Bill was appointed to a 5 year EPSRC Advanced Research Fellow with a view to carrying out research and development in the field of laser based micro engineering. Having completed his advanced fellowship in September 2003 and established a £5M EPSRC Innovative Manufacturing Research Centre in 2002, Bill was appointed to a lectureship in production processes within the Cambridge University Engineering Department in 2003.




Prof. Thomas Wirth

Diplom University of Bonn (1989). PhD Technical University of Berlin (1992, S. Blechert); JSPS Fellow, Kyoto University (1993, K. Fuji). Habilitation, University of Basel (1999, B. Giese). Visiting Scientist, University of Toronto (1999). Visiting Scientist, Chuo University, Tokyo (2000). Visiting Scientist, Osaka University (2004); Werner Prize, New Swiss Chemical Society (2000). Appointed as Professor of Organic Chemistry, Cardiff, in 2000.

Research Interests
Design and Synthesis of New Chiral Selenium Electrophiles: high stereoselectivities are obtained with very simple and easily accessible reagents. Efficient polymer-bound selenium electrophiles with all the advantages in handling and work-up have been synthesized and used in various applications towards natural product synthesis.

Development of New Hypervalent Iodine Reagents: hypervalent iodine compounds are versatile alternative reagents in reactions traditionally employing heavy metal complexes. The development of chiral reagents led to various new stereoselective reactions. Due to their high reactivity, even the functionalization of alkanes can be achieved under mild reaction conditions.

Coordination of Chiral Ligands towards Electrophiles: we have developed a reagent-controlled stereoselective iodolactonization reaction applying a new method using a combination of ICl and a primary amine.
Electrochemical Methods: The selective functionalization of alkenes by combining electrochemical methods with electrophilic reagents leads to promising catalytic reactions. The direct electron transfer at electrode surfaces is frequently referred to as one of the prototypical green technologies of the future.

Microreactor Technology: The translation of both traditional flask-based chemistry and entirely new procedures on to chipbased platforms becomes more challenging as complexity of operation increases. We are developing new microreactors for reactions under segmented-flow conditions.

Computational Chemistry: The evaluation of reaction pathways, transition states, intermediates and mechanisms by close interaction of theory and experiment on various levels is supporting many of the research areas mentioned above.

In many areas of Synthetic Organic Chemistry reactions are needed, which produce in good yields stereochemically uniform compounds. In this respect many remarkable efforts have been undertaken and a variety of efficient as well as elegant stereochemical transformations using prochiral substrates are known. However, there are certain classes of compounds which cannot be efficiently used in these reactions. Only a few useful methods are known for the stereoselective functionalization of not or only weakly activated C-H bonds or C=C bonds. In our research projects we are investigating and developing stoichiometric and catalytic reactions leading to products with new stereogenic centers.




Prof. Michael Vellekoop

Michael J. Vellekoop was born in Amsterdam, the Netherlands. He received the B.Sc. degree in Physics in 1982 and the Ph.D. degree in Electrical Engineering in 1994. In 1988 he co-founded Xensor Integration B.V. where he was managing director until 1996. In that year he initiated a new research group on the topic of physical chemosensors at the DIMES Electronic Instrumentation Laboratory of the Delft University of Technology, where in 1997 he became an associated professor. Since 2001 he is a full professor of Industrial Sensor Systems at the Institute of Sensor and Actuator Systems of the Vienna University of Technology, Austria. In 2002 he became head of this institute. In 2005 he received the Eurosensors Fellow Award and he was elected as a corresponding and full member of the Austrian Academy of Sciences in 2005 and 2007, respectively. He authored or co-authored 160 publications in peer reviewed Journals and International Conferences. Keywords of research are physical chemosensors, biochips, sensor systems, micro & nanofluidics, and technology.

Invited Talks

The Conference Programme will include six invited keynote speakers:

Invited speakers

• Utilising Electrochemical Deposition for Micro Manufacturing
  Dr Peter Torben Tang, IPU Manufacturing, Denmark





• Mircofabrication using a Single Mode Yb Fiber Laser
  Dr Bill O'Neill, University of Cambridge, UK





• Traceable measurement of areal surface texture
  Prof. Richard Leach, NPL, UK





• Biphasic reactions in microreactors
  Prof. Thomas Wirth, Cardiff University, UK





• Engineered Self-assembly From Nano to Milli Scales
  Prof. Karl Boehringer, University of Washington, USA





• Microfluidic chips for biochemical and cell analysis
  Prof. Michael Vellekoop, Vienna University of Technology, Austria

License Agreement

Cardiff University requests a formal written License agreement from the copyright owners for each article published. To avoid any delay in the publication of your article, please read the terms of this agreement, sign in the space provided and return the complete form to us by 1st June 2008.

Please click here for the License agreement

4M2008 Proceedings

4M2008 Proceedings will be published by Whittles Publishing. The Proceedings plus a CD-ROM will be available in September 2008.

Edited by

• S. Dimov, Manufacturing Engineering Centre, Cardiff University, UK
• W. Menz, Germany

With the accepted papers and six keynote contributions, the volume details the state-of-the-art with regard to numerous aspects of advanced micro technologies with respect to metals, polymers, and ceramics, and the development of new production platforms for micro systems-based products.

The contributions from leading authors from universities, independent research and corporate organizations provide an invaluable overview of this rapidly moving subject and an insight into key developmental areas. This comprehensive collection of indexed and peer reviewed articles is also contained on a CD with search functionality.

Contents

Keynote speakers

• Utilising Electrochemical Deposition for Micro Manufacturing
  Dr Peter Torben Tang, IPU Manufacturing, Denmark
• Mircofabrication using a Single Mode Yb Fiber Laser
  Dr Bill O'Neill, University of Cambridge, UK
• Traceable measurement of areal surface texture
  Dr Richard Leach, NPL, UK
• Biphasic reactions in microreactors
  Prof. Thomas Wirth, Cardiff University, UK
• Engineered Self-assembly From Nano to Milli Scales
  Prof. Karl Boehringer, University of Washington, USA
• Microfluidic chips for biochemical and cell analysis
  Prof. Michael Vellekoop, Vienna University of Technology, Austria

and sections on:

Readership
The volume will be of interest to all engineers and scientists, whether in academia or industry, working in the field of nanotechnology and micro manufacture.

Programme

Day 1: Tuesday, 9-Sept-08

Time
08:00h to 09:00h	Registration
09:00h to 09:30h	Opening Rhodri Morgan, First Minister for Wales David Grant, Vice-Chancellor Stefan Dimov, 4M2008 Conference Chair
09:30h to 10:45h	Invited Talks
10:45h to 11:15h	Coffee Break/Poster Session
11:15h to 12:30h	Thematic Session 1 & 2
12:30h to 14:00h	Lunch
14:00h to 15:30h	Panel Discussion
15:30h to 16:00h	Coffee Break/Poster Session
16:00h to 17:30h	Thematic Session 3 & 4
19:00h to 22:30h	Banquet

Day 2: Wednesday, 10-Sept-08

Time
09:00h to 10.15h	Invited Talks
10:15h to 11:15h	Poster Session/Coffee break
11:15h to 12:30h	Thematic Session 5 & 6
12:30h to 14:00h	Lunch
14:00h to 15:30h	Q2M Special Session
15:30h to 16:00h	Coffee break/Poster Session
16:00h to 17:15h	Thematic Session 7 & 8
19:00h to 20:30h	Cocktail

Day 3: Thursday, 11-Sept-08

Time
09:00h to 10:15h	Invited Talks
10:15h to 10:45h	Coffee Break
10:45h to 12:00h	Thematic Session 9 & 10
12:00h to 13:00h	Lunch

Please note that the Posters will be displayed from Tuesday 9th to Thursday 11th September 2008. In addition a poster session have been organised

Day 1: Tuesday, 9-Sept-08

08:00h - 09:00h
Registration
09:00h to 09:30h
Opening (Auditorium) Rhodri Morgan, First Minister for Wales David Grant, Vice-Chancellor Stefan Dimov, 4M2008 Conference Chair
09:30h to 10:45h
Keynote Speakers (Auditorium) Chair: S. Dimov, MEC, UK 09.30h Traceable measurement of areal surface texture Prof Richard Leach, NPL, UK 10:00h Mircofabrication using a Single Mode Yb Fiber Laser Dr Bill O'Neill, University of Cambridge, UK
10:45h to 11:15h
Coffee Break/Poster Session
11:15h to 12:30h
Session 1 Process Characterisation (Auditorium) Chair: A. Schoth, IMTEK, Germany 11:15h Hot embossing of high aspect ratio sub-µm structured surfaces for micro fluidic applications M. Heckele, M. Worgull, Forschungszentrum Karlsruhe, Germany T. Mappes, University of Karlsruhe, Germany G. Tosello, H. N. Hansen, Technical University of Denmark, Denmark T. Metz, P. Koltayd, University of Freiburg, Germany J. Gavillet,French Atomic Energy Commission (CEA), France 11:30h Micro injection moulding: an experimental study on the relationship between the filling of micro parts and runner designs C. Griffiths, S. Dimov, E.Brousseau, Cardiff University, UK 11:45h A study of factors affecting the performance of micro square endmills in milling of hardened tool steels P. Li, H.H. Langen, R.H. Munnig Schmidt, Delft University of Technology, The Netherlands P. Aristimuno, P. Arrazola, Mondragon University, Spain A.M. Hoogstrate, J.A.J. Oosterling, TNO Science and Industry, The Netherlands 12:00h Manufacturing and verification of tools for ECF K. Hofmann,Institute of Micro- and Precision Engineering (IZFM), Germany L. Staemmler, Greiner Bio-One GmbH, Germany H. Kücka, Hahn-Schickard-Institute for Micro Assembly Technology, Germany	Session 2 Components (Room 0.31) Chair: E. Jung, FZK, Germany 11.15 Manufacturing of Versatile Ceramic or Metal Micro Components by Powder Injection Moulding V. Piotter, K. Plewa, J. Prokop, A. Ruh, H.-J. Ritzhaupt-Kleissl, J. Hausselt Forschungszentrum Karlsruhe, Germany 11.30 Large-area metal-coated dielectric nanopillar array for excitation of surface plasmon resonance X. Chen, K. Jiang, University of Birmingham, UK 11:45h Concept for packaging of a silicon based biochip T. Velten, M. Biehl, T. Knoll, W. Haberer Fraunhofer Institute for Biomedical Engineering, Germany 12:00h Flexible microfluidics based on commercial SU8 foils C. Khan Malek, L. Robert, Institute FEMTO-ST/Dpt. FRANCE
12:30h to 14:00h
Lunch
14:00h to 15:30h
"FP7 Infrastructures' Discussion(Auditorium) Chair: W. Menz, Germany and S. Dimov, MEC, UK 4M Industrial Board C. Hanisch, Festo, Germany D. Ulieru, Romes - SA, Romania F. Bartels, Bartels Microtechnologies, Germany M. Ganz, Martin Ganz, Austria R. Wimberger-Friedl, Phillips Research Laboratories, The Netherlands U. Ljungblad, ARCAM, Sweden
15:30h to 16:00h
Coffee Break/Poster Session
16:00h to 17:30h
Session 3 Systems (Auditorium) Chair: M. Richter, IZM, Germany 16:00h An integrated all-optical microfluidic cell sorter S. Valkai, H. I. Kirei, L. Oroszi, P. Ormos, Hungarian Academy of Sciences, Hungary 16:15h Feasibility of polymers for wafer scale capping of RF MEMS P. Bolt, J. Bullema, R. Korbee, R. Kusters, TNO Science and Industry, The Netherlands 16:30h Active microvalves for micro-fluidic networks in plastics – selecting suitable actuation schemes A.Boustheen, F. Homburg, Eindhoven University of Technology, The Netherlands J. Bullema, TNO Science and Industry, The Netherlands A. Dietzela, Holst Center, The Netherlands 16:45h Low-power humidity sensor for RFID applications L. Löfgren, B. Löfving, T. Pettersson, B. Ottosson, C. Rusu, S. Haasl, K. Persson, The Imego Institute, Sweden O. Vermesan, SINTEF ICT, Norway N. Pesonen, VTT, Finland P. Enoksson, Chalmers University of Technology, Sweden	Session 2 Metrology (Room 0.31) Chair: L. Mattsson, KTH, Sweden 16:00h Measurement of frequency response of the bone ossicles in the sheep middle ear by the fiber-optic microphone Z.V. Djinovic, Vienna University of Technology and Integrated Microsystems Austria, Austria L. Manojlovic, D. Vujanic, Integrated Microsystems Austria, Austria R. Pavelka, Schwerpunktkrankenhaus, Austria M.C. Tomic, Institut Bezbednosti, Serbia 16:15h How reliable are surface roughness measurements of micro-features? - Experiences of a Round Robin test within nine 4M laboratories L. Mattsson, A. Temuna, KTH – the Royal Institute of Technology, Sweden P. J. Bolt , E. Gelink, TNO Science and Industry, The Netherlands S. Azcarate, A. Retolaza, Tekniker Technological Center. Spain E. Brousseau, C. Griffiths, Cardiff University, UK B. Fillon, P. Tiquet, French Atomic Energy Commission (CEA), France C. Fowler, A. Schneider, Rutherford Appleton Laboratory (RAL), UK C. Khan Malek, FEMTO-ST Institute, France S. Marson, Cranfield University, UK A. Schoth, University of Freiburg, Germany G. Tosello, Technical University of Denmark, Denmark 16:30h Micro-Ultrasonic Metrology of Multi-Material Electronic Devices R. Teti, P. De Santo, University of Naples Federico II, Italy 16:45h Approaching a sub-micron capability index using a Werth Fibre Probe System WFP R. Thelena, J. Schulza, P. Meyera, V. Sailea, Research Centre Karlsruhe, Germany
19:00h to 22:00h
Banquet (Bayside Brasserie, Cardiff Bay)

Day 2: Wednesday, 10-Sept-08

09:00h - 10:15h

Keynote Speakers (Auditorium) Chair: W. Menz, Germany 09:00h Engineered Self-assembly From Nano to Milli Scales Prof. Karl Boehringer, University of Washington, USA 09:30h Microfluidic chips for biochemical and cell analysis Prof. Michiel Vellekoop, Vienna University of Technology, Austria

10:15h - 11:15h

Poster Session/Coffee break (Exhibition area)

11:15h - 12:30h

Session 5 Novel materials (Auditorium) Chair: P. Johander, IVF, Sweden 11:15h Micromachined silicon electrodes for electrochemical micromachining C. Blattert, Hahn-Schickard-Gesellschaft e. V. Institute for Micromachining and Information Technology, Germany C. Müller, University of Freiburg, Germany H. Reinecke, Hahn-Schickard-Gesellschaft e. V. Institute for Micromachining and Information Technology and University of Freiburg, Germany 11:30h Machining of polystyrene by UV laser radiation for patch clamping device fabrication S. Wilson, Forschungszentrum Karlsruhe, Germany and Cranfield University, UK P.Kirby, Cranfield University, UK W.Pfleging, A. Welle, Forschungszentrum Karlsruhe, Germany M.Przylbyski, ATL Lasertechnik GmbH, Germany 11:45h DRIE of non-conventional materials: first results S. Queste, G. Ulliac, J-C Jeannot, C. Khan Malek, Institute FEMTO-ST/Dpt. France 12:00h Micro-extrusion of ultrafine grained copper S. Geißdörfer, U. Engel, University of Erlangen-Nuremberg, Germany A. Rosochowski, University of Strathclyde, UK L. Olejnikc, Warsaw University of Technology, Poland

Session 6 Process Modelling/simulation (Room: 0.31) Chair: U. Engel, Erlangen, Germany 11:15h Micro injection moulding: simulation of melt flow behaviour C.A. Griffiths, S.S. Dimov, E. B. Brousseau, M. S. Packianather, Cardiff University, UK 11:30h Numerical modelling and experimental characterization of short pulse laser microforming of thin metal sheets J.L. Ocaña, M. Morales, C. Molpeceres, O. García, J.A. Porro, J.J. García-Ballesteros, Centro Láser UPM, Spain 11:45h Modelling the Solidification-Structure of Al Micro-Castings as a function of their Aspect Ratio and Mould Pouring Temperature J-F. Charmeuxa, R. Mineva, S. Dimova, E. Mineva, Cardiff University, UK 12:00h Simulation of Microforming Processes by Applying a Mesoscopic Model S. Geißdörfera, U. Engela, M. Geigera, University of Erlangen-Nuremberg, Germany

12:30h - 14:00h

Lunch

14:00h - 15:30h

Q2M Special Session (Auditorium) Chair: W. Wijngaart, KTH, Sweden 14:00h The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications F. Zimmer, M. Friedrichs, M. Mueller, H. Schenk, H. Lakner, Fraunhofer Institute for Photonic Microsystems (IPMS), Germany T. Bakke, SINTEF Department of Mikrosystems and Nanotechnology, Norway M. Lapisa, F. Niklaus, KTH-The Royal Institute of Technology, Sweden 14:15h Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies T. Grund, M. Heckele, M. Kohl, Forschungszentrum Karlsruhe GmbH, Germany 14:30h Wafer-scale manufacturing of robust trimorph bulk SMA microactuators N. Sandström, S. Braun, G. Stemme, W. van der Wijngaart, KTH-Royal Institute of Technology, SWEDEN T. Grund, M. Kohl, Forschungszentrum Karlsruhe GmbH, GERMANY 14:45h Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development D. Bhattacharyya, R. V. Wright, Q. Zhang, P.B. Kirby, Cranfield University, UK R. Guerre, U. Drechsler, M. Despont, IBM Research Gmbh, Switzerland F. Saharil, J. Oberhammer, KTH – Royal Institute of Technology, Sweden 15:00h Towards Batch Integration of SMA into Microsystems: an Actuator Prototype D. Clausi, J. Peirs, D. Reynaerts, Katholieke Universiteit Leuven, Belgium 15:15h Fabrication of piezoelectric thick-film bimorph micro-actuators from bulk ceramics using batch-scale methods R.P.Jourdain, S. A.Wilson, Cranfield University, UK

15:30h - 16:00h

Coffee Break/Poster Session

16:00h - 17:15

Session 7 Process-material interactions (Auditorium) Chair: P. Bolt, TNO, The Netherland 16:00h Influence of process parameter variation on ceramic feedstock flow behaviour J. Aroni, Forschungszentrum Karlsruhe, Germany T. Hanemann, Forschungszentrum Karlsruhe, Germany and Albert-Ludwigs-Universität Freiburg, Germany 16:15h Micro Electrical Discharge Machining of Si3N4-based Ceramic Composites K. Liu, J. Peirs, E. Ferraris, B. Lauwers, D. Reynaerts, Katholieke Universiteit Leuven, Belgium 16:30h Investigation of the mechanical behaviour of thin metal sheets using the hydraulic bulge test A. Diehl, D. Staud, U. Engel, University of Erlangen-Nuremberg, Germany 16:45h An analysis of the effects of nanolayered nitride coatings on the lifetime and wear of tungsten carbide micromilling tools D. Zdebski, D.M. Allen, D.J.Stephenson, J. Hedge, Cranfield University, UK C. Ducros, F. Sanchette, CEA Grenoble, France

Session 8 Novel processes and process chains (Room 0.31) Chair: S. Bigot, MEC, UK 16:00h Wafer-scale transfer of nanoimprinted pattern into silicon substrates G. Hubbard, S.J. Abbott, MacDermid Autotype Ltd, UK Q. Chen, D.W.E. Allsopp, W.N. Wang, C.R. Bowen, R. Stevens, University of Bath, UK A. Satka D. Hasko, F, Uherek and J. Kovac, International Laser Center, Slovakia 16:15h A new tool for aligned embossing and nano-imprinting T.Rogers, I.Malmros, Applied Microengineering Limited, UK 16:30h Microfabrication of Components for a Novel Biomimetic Neurological Endoscope A. Schneider, S. E. Huq, Rutherford Appleton Laboratory, UK L. Frasson, F. M. Rodriguez Y Baena, B. L. Davies, Depart. of Mechanical Engineering., Imperial College, UK T. Parittotokkapornc, Institute of Biomedical Engineering, UK 16:45h Single- and multi-layer conductive patterns fabricated using M3D technology B. Obliers-Hommrich, A. Fischerb, H. Willeck, W. Eberhardt, Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Germany H. Kück, University of Stuttgart, Germany

19:00h - 20.30h

A Cocktail Reception

Day 3: Thursday, 11-Sept-08

09:00h - 10:15h
Keynote Speakers (Auditorium) Chair: B. Fillon, CEA, France 09:00h Biphasic reactions in microreactors Prof. Thomas Wirth, Cardiff University, UK 09:30h Utilising Electrochemical Deposition for Micro Manufacturing Dr Peter Torben Tang, IPU Manufacturing, Denmark
10:15h - 10:45h
Coffee Break/Poster Session
10:45h to 12:00h
Session 9 Process Characterisation (Room 0.31) Chair: A. Schoth, IMTEK, Germany 10:45h Wire electro discharge grinding: surface finish optimisation A. Rees, E. Brousseau, S.S. Dimov, Cardiff University, UK H. Gruber, I. Paganetti, AGIE AG für Industrielle Elektronik, Switzerland 11:00h Micro-Injection moulding: surface treatment effects on part demoulding  C.A. Griffiths, S. S. Dimov, E.B. Brousseau, S. Bigot, Cardiff University, UK C. Chouquet, J. Gavillet, French Atomic Energy Commission (CEA), France 11:15h Investigations in Variothermal Injection Moulding of Microstructures and Microstructured Surfaces  W. Michaeli, F. Klaiber, RWTH Aachen University, Germany S. Scholz, Cardiff University, UK 11:30h Fabrication of NIL templates incorporating different length scale features G. Lalev, P. Petkov, V. Velkova, S. Dimov, Cardiff University, UK N. Sykes, D. Barrow, metaFAB, Cardiff University, UK	Session 10 Components (Auditorium) Chair: M. Richter, IZM, Germany 10:45h Concept for Fluidic Self-Assembly of Micro-Parts Using Electro-Static Forces J. Dalin, J. Wilde, University of Freiburg – IMTEK, Germany A. Synodinos, P. Lazarou, N. Aspragathos, University of Patras, Greece 11:00h Towards automation in AFM based nanomanipulation and electron beam induced deposition for microstructuring F. Krohs, T. Luttermann, C. Stolle, S. Fatikow, University of Oldenburg, Germany E. Brousseau, S. Dimov, Cardiff University, UK 11:15h Manufacturing and replication of cell aligning micro structures C. Brecher, RWTH Aachen University and Fraunhofer-Institute for Production Technology Aachen, Germany R. Klar, F. Pretzsch, C. Wenzel, Fraunhofer-Institute for Production Technology Aachen, Germany 11:30h X-Ray pattern analysis of electroplated two component moulds used for Production of micro gear wheels J. Lorenz, V. Piotter, H.-J. Ritzhaupt-Kleissl, A. Roch, Forschungszentrum Karlsruhe GmbH, Germany J. Prokop, J. Haußelt, Forschungszentrum Karlsruhe GmbH and University of Freiburg, Germany
12:00h - 13:00h
Lunch

Poster presentations

Process Characterisation including Process Chains
Electrochemical finishing of nickel microstructures S. Kissling, K. Bade, Forschungszentrum Karlsruhe, Germany Improved bonding strength in hybrid micro parts by using plasma W. Michaeli, T. Kamps, Institute of Plastics Processing at RWTH Aachen University, Germany Force analysis in micro milling Al 6082 T6 in various engagement conditions G. Bissacco, University of Padova, Italy T. Gietzelt, Forschungszentrum Karlsruhe Institut für Mikroverfahrenstechnik, Germany H. Hansen, Technical University of Denmark, Denmark Strategies for material removal in laser milling P. Petkov, S. Scholz, S. Dimov, Cardiff University, UK TEM/SEM and FT-IR characterization of biocompatible magnetic nanoparticles K.Alexandrova, A. Gigova,I. Dragieva, Bulgarian Academy of Sciences, Bulgaria I. Markova–Deneva, University of Chemical Technology and Metallurgy, Bulgaria
Components: Fabrication and Assembly Technologies
Ultrasonic welding of micro plastic parts W. Michaeli, W.-M. Hoffmann, E. Haberstroh, RWTH Aachen University, Germany High Density Interconnections Fabrication by UV Lasers Microprocessing of Microvias and Microstructures D. Ulieru, ROMES S.A., Romania A. Matei, National Institute for Research and Development in Microtechnologies, Romania E. Ulieru, A. Tantau, c SITEX 45 SRL, Romania F. Babarada, University of Bucharest, Romania Fabrication of stainless steel micro components using softlithography M. Imbaby, K. Jiang, I. Chang, University of Birmingham, UK Investigation of Material Compatibility for Embedding Stereolithography T. Rechtenwald, M. Devrient, T. Frick, M. Schmidt, Bayerisches Laserzentrum GmbH, Germany A. Kopczynska, E. Schmachtenberg, Friedrich-Alexander Universität, Germany Electric fields in a hybrid batch fluidic micromanipulation concept P. Lazarou, N.A. Aspragathos, University of Patras, Greece E. Jung, Chip Interconnection Technologies, Germany
Novel Materials: Characterisation and Processing
Dielectric properties of hydroxyapatite based ceramics J.P. Gittings, C.R.Bowen, I.G.Turner, A.C.E.Dent, F.R.Baxter, J.B. Chaudhuri, University of Bath, UK Carbon nanotubes grown directly on printed electrode of electrochemical sensor J. Prasek, J. Hubalek, M. Adamek, Brno University of Technology, Czech Republic O. Jasek, Masaryk University, Czech Republic Micromachining of amorphous and crystalline Ni78B14Si8 alloys using micro-second and pico-second lasers I. Quintana, 1CIC marGUNE., Spain A. Aranzabe, Fundación Tekniker, Spain T. Dobrev, G. Lalev, S. Dimov, Cardiff University, UK FT-IR study of nanosurface phenomena I. Markova–Deneva, University of Chemical Technology and Metallurgy–Sofia, Bulgaria 3D micro and nanostructuring of an epoxy based resist by electron beam lithography G. Rius, J. Bausells, C. Martín, A. Llobera and F. Pérez-Murano, Institut de Microelectrònica de Barcelona, IMB-CNM-CSIC, SPAIN Explosive welding of Ni- based amorphous foils for micro-tooling applications R. Minev, N. Festchiev, Rousse University, Bulgaria S. Dimov, G.Lalev, Cardiff University, UK S. Koev, BOM Ltd, Bulgaria
Process Modelling and Simulation
Implementation strategies for the optimization of micro injection moulding simulations G. Tosello, Technical University of Denmark, Denmark A. Schoth, Department of Microsystems Engineering IMTEK),Germany H. Hansen, University of Freiburg, Germany Geometry Optimization of Micro Milling Tools J. Fleischer, M. Deuchert, C. Kühlewein, C. Ruhs, Universität Karlsruhe, Germany On the force between two metallic plates of a gripper immersed in a nonpolar fluid D. Dantchev, K. Kostadinov, Bulgarian Academy of Sciences, Bulgaria А study of the gate size effects on the process of optical data storage micro-scale D. S. Trifonov, Y. Toshev, Bulgarian Academy of Sciences, Bulgaria Influence of Force Components on Thin Wire EDM A. Herrero, S. Azcarate, Fundacion Tekniker, Spain A. Rees, Cardiff University, Cardiff, UK A. Gehringer, A. Schoth, University of Freiburg, Germany J.A. Sanchez, Faculty of Engineering of Bilbao, Spain
Systems: Novel Product and Process Designs
Sub-Micron Referencing System for Ultraprecision Machining Processes M. Weinzierl, Fraunhofer Institute for Production Technology IPT, Germany C. Brecher, Fraunhofer Institute for Production Technology IPT and RWTH Aachen University, Germany A. Rashid, System 3R Intl. AB, Sweden R. Schmitt, D. Köllmann, RWTH Aachen University, Germany

Registration Information

 

Registration Fees for Attendees

	Paid before July, 31 2008	Paid after July, 31 2008
4M NoE Partners and Delegates from NMS & ACC	185 €	225 €
Non-partners in 4M NoE	225 €	275 €
Students	185 €	225 €
Accompanying guest	80 €	100 €

• Please note that the registration form below is for all attendees who wish to attend the 4M2008 Conference with or without submitting a paper.

Registration Form for Authors and Attendees




• Please note that the registration deadline for AUTHORS is 1st June 2008.
• The registration deadline for attendees at the discounted price is 31st July 2008. Please note that after 31st July 2008 the prices will increase.
• Please note that as a non - partner in 4M NoE you can benefit from the sponsorship opportunities with only 325 € extra.

Find out more about Sponsorship Opportunities at the 4M2008 Conference.




Email, Fax or Post completed form with payment to:
Miss Jeanette Whyte, Manufacturing Engineering Centre, Cardiff University, Cardiff CF24 3AA, E-mail: whytejc@Cardiff.ac.uk, Telephone: +44(029)2087 4641, Facsimile: +44(029)2087 4880

Scope

Microsystems-based products are a key value-adding element for many sectors of industry - and the predicted nanotechnology future will also be largely delivered by microtechnologies. While the late 20th century has seen a silicon-based microelectronics revolution, the 21st century looks forward to the adoption of micro- and nano-manufacturing technologies as the demand for function and length scale integrations increases continuously on the way to bridging the nano- and the macro-worlds.

The existing imbalance between the ease with which batch-fabricated microcomponents and microsystems can be produced in silicon compared to the difficulties and costs associated with their manufacture in other materials hinders the introduction of new microsystems-based products into the market. Although there may be commercial advantages to leveraging the present suite of IC-based processes and materials, they will not be able to meet the demands of emerging products for 3D and high aspect ratio structures, enhanced-force microactuation, improved environmental resistance, high precision, and unification and standardisation. To broaden the range of microsystems-based products and simultaneously multiply their capabilities requires the integration of new materials and precision engineering technologies for their processing with IC-based, batch-fabrication processes. These are major challenges in developing new products that at the same time represent promising research and development areas for innovation and value creation.

The main goal of this Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of manufacturing capabilities for:

• Product miniaturisation through innovative integration and development of knowledge-based technologies and production concepts (especially micro and nano) for the processing of non-silicon materials;
• Prediction of product and process performance to reduce/manage the risk during product development and production, and to reduce time to market for the next generation of microsystems-based products;
• Future product platforms to meet the requirements of the next generation of microsystems-based products, and of more stringent regulations and environmental legislation;
• Production scale-up to ensure effective and efficient transfer of product and technology ideas from laboratories to serial production.

Sightseeing in Cardiff

Sightseeing


Cardiff Castle


Millenium Stadium Copyright Stan Zurek
Creative Commons Attribution ShareAlike


Cardiff Bay

Having been in the throes of redevelopment for a good few years now, especially around the Cardiff Bay area, the city has several new attractions. The old favourites (Cardiff Castle, Llandaff Cathedral and the museums) are still popular and as worthy of a visit as ever, but they must now compete with the newcomers, most of which are concentrated on the waterfront. For this reason, visitors could consider Cardiff Bay as one huge tourist attraction and approach individual sights as components within it.

Attractions are dotted all over the city. The Millennium Stadium and Cardiff Castle, for example, are in the city centre, the National Museum and Gallery is a short distance away, at Cathays Park, while the Museum of Welsh Life is in St Fagans, on the city's western outskirts.

• Cardiff Castle

• National Museum and Gallery of Wales, Civic Centre

• Millennium stadium

• Museum of Wales Life, St Fagans

• Cardiff Bay

• Hop on Hop off/ Cardiff Sightseeing bus

For more information please contact

Tourist Information
Cardiff Gateway Visitor Centre.
The Old Library, The Hayes (city centre)
Tel: 0870 1211 258.
Website: www.visitcardiff.com

Opening hours: Mon-Sat 0930-1800 Sun 1000-1600

Sponsors

	The Welsh Assembly Government, Wales, UK The Welsh Assembly Government are proud to sponsor the 2008 4M Network of Excellence on Multi-Material Micro Manufacture. Our Technology and Innovation Team support businesses and academia and encourage and recognise innovation to embrace the technological change needed to meet the competitive challenges of manufacturing in the 21st Century. The assistance we provide includes: Professional and impartial advice from specialist advisers Networking opportunities and strategic sector support Support for new product and process development Access to specialist equipment, facilities and expertise Links to internationally respected academic resources
	SARIX SA, MICRO EDM TECHNOLOGY, LOSONE High precision 3D Micro EDM Milling Technology SARIX always at leading edge of the highest Micro-machining performance offers now a new Micro EDM machining concept, the 3D Micro EDM Milling Machining. Complete 3D cavities can be achieved down to real micro scale of 10 micron with accurate tolerance down to 0.3 micron within high surface finishing of Ra 50 Nano. With its reliable machine concept using in once the Micro-Drilling, Micro-sinking and the 3D Micro EDM Milling, SARIX contribute on the development of new high-tech products and Micro-device. Micro EDM is now utilized for high-performance applications in electronics, automotive, medical, textiles, aerospace, and industrial equipment. Difficult-to-machine materials such as titanium, hardened steel, tungsten carbide, PCD and even some ceramics can be machined by micro EDM on SARIX machines.
	Oxfordlasers, UK Oxford Lasers specialise in the integration of Laser Micro Machining Systems for a variety of applications where parts or features require to be fabricated on a micron scale. The systems offered employ lasers which range in wavelength from the UV through to the Infrared, with pulse lengths in either the nano, pico or femtosecond range. Materials capable of being processed range from metals and ceramics through to polymers and glasses using a variety of techniques, including drilling, milling, scribing and cutting. These lasers are integrated with vision or measuring systems, manual or automatic part handling, software and all necessary safety features.
	Micro Manufacturing magazine The newly launched Micro Manufacturing magazine is to sponsor the 4M2008 conference. They are to offer a cash prize and will present a trophy to the first named author of the paper judged to be "Best in 4M2008". Publication can be subscribed free of charge at www.micromanu.com
	Tecan Ltd Tecan is a leading manufacturer of customised precision parts. It serves the world’s most innovative, hi-tech companies from industries that demand high quality and precision. Tecan's team of experienced engineers work in close partnership with customers to develop high tolerance parts - helping them to realise ideas rapidly and cost-effectively.
	The Manucacturing Engineering Centre, MEC, UK The Manufacturing Engineering Centre (MEC) is an award-winning R&D Centre of Excellence for Advanced Manufacturing and Information Technology. The ISO 9001:2000 accredited Manufacturing Engineering Centre (MEC) offers specialist services in Time Compression Technologies to companies of all sizes. The Manufacturing Engineering Centre (MEC) has an international reputation for its leading-edge research in Advanced Manufacturing and Information Technology spanning a broad spectrum of subjects.
	The Nanotechnology KTN, UK The Nanotechnology KTN was established by the Technology Strategy Board (TSB) as a successor to the MNT Network. The Nanotechnology KTN facilitates the transfer of knowledge and experience between industry and research, offering companies dealing in small-scale technology access to information on new processes, patents and funding as well as keeping up-to-date with industry regulation. The four broad areas that the KTN focuses on are: - Promoting and facilitating knowledge exchange - Supporting the growth of UK capabilities - Raising awareness of Nanotechnology - Providing thought leadership and input to UK policy and strategy These four offerings are targeted at growing and strengthening the micro and nanotechnologies (MNT) community.

Sponsorship Opportunities

The main goal of the Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of micro-manufacturing capabilities. Papers are invited to present the latest advances in developing new processes and process chains for multi-material micro manufacture and their applications in microsystems-based products.

The 4M Conference will be one of the most prestigious and well attended events of its kind in Europe during 2008. Becoming a sponsor of 4M2008 Conference provides an excellent opportunity to market your organization and services further, as the conference attracts a wide variety of attendees from the emerging micro-manufacturing community.

Stand out from the rest in front of more than 150 Micromanufacturing experts.

As a sponsor you can promote your company’s mission even more effectively to the assembled individuals and organisations attending 4M2008 while learning about the latest advances in micro-manufacturing research.

We are offering four sponsorship levels:

• Platinum Package of € 1500, SOLD!!!
• Gold Package of € 750
• Silver Package of € 500




Sponsorship benefits




Platinum Package,SOLD!!!	Gold Package	Silver Package
1 page advert in 4M2008 Proceedings Company / Project logo on back cover of proceedings Exhibition space Entrance to conference, including all meals and refreshments,for 3 people 3 copies of Conference Proceedings Sponsors logo, with link to own website, on 4M2008 website Company’s name linked to the conference dinner, in announcements, in all literature and on website	1 page advert in 4M2008 Proceedings Company / Project logo on back cover of proceedings Exhibition space Entrance to conference, including all meals and refreshments,for 2 people 2 copies of Conference Proceedings Sponsors logo, with link to own website, on 4M2008 website	½ page advert in 4M2008 Proceedings Company / Project logo on back cover of proceedings Exhibition space Entrance to conference, including all meals and refreshments,for 1 person 1 copy of Conference Proceedings Sponsors logo, with link to own website, on 4M2008 website

Print Version

Please note that the deadline having an advert in 4M2008 Proceedings and your Company logo on back cover of 4M2008 Proceedings is 6th May 2008. After this deadline the advert opportunities in 4M2008 Proceedings are no longer included in the sponsorship packages and the package prices vary.

Get the most from your marketing budget and take advantage of these sponsorship packages.

For further information, to discuss your sponsorship interests and to get information regarding the exhibition please contact us at 4M_Info

Submission

Important documents

• Guidelines for Authors for preparing full papers
• A MS Word template instructions for preparing the camera ready manuscripts

Papers MUST be submitted using ONLY Microsoft Word and the papers MUST follow the provided template in order to be included in the Conference Proceedings

Submission Deadline for Full Papers

The full paper submission deadline is 10th FEBRUARY 2008.

Author File Submission and Approval Steps

1. Go to the 4M2008 conference paper submission website 4M2008
2. If it is your first visit, follow the New users link. Follow the on-site instructions
3. Otherwise login, providing your email-address password and the Conference Id - 4m2008.
4. Upload a full paper
5. Approve the PDF of submitted paper
6. Paper is released into Peer Review (for assessment by the referees)
7. A decision will be made (Accept with Revision or Reject) and emails will be sent out by the system to the authors
8. For those papers that revision has been requested authors may go through the process again of uploading their revised final paper
9. Authors who are invited to submit a revised full paper will re-enter the Author Submission site to upload a revised full paper
10. Approve the PDF of the revised full paper
11. Revised paper is released into Peer Review (for assessment by referees)
12. Programme Chairs and Themes Chairs will assess referees comments and make the decision on the full paper (Accept or Reject) and emails will be sent out by the system
13. Authors who received (Paper Accepted in Final Publication) are invited to submit a Final full paper will re-enter the Author Submission site to upload a Final full paper
14. Approve the PDF of the final paper
15. Papers will be collected and processed for Final Publication

The accepted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Conference Proceedings.

Questions may be directed in the meantime by e-mail to: 4m_conference[@]4m-net.org

Themes

Papers are invited to present the latest advances in developing new processes and process chains for multi-material micro manufacture and their applications in microsystems-based products, in particular but not limited to:

• Novel materials: characterisation and processing;
• Process modelling and simulation;
• Process characterisation including process chains;
• Metrology: inspection and characterisation methods;
• Components: fabrication and assembly technologies;
• Systems: novel product and system designs.

The above six sub-topics represent the intended topics of the thematic sessions of the Conference to which the authors are invited to submit papers.

Travel Directions

Travel to Cardiff

By Air

Cardiff is served by Cardiff International Airport with regular direct flights from UK and European destinations.

Cardiff International Airport: www.cwlfly.com, Tel: +44 (0) 1446 711111

Bristol International Airport is only 1 hour away. Birmingham, Manchester and London Airports (Heathrow, Gatwick, Stansted and Luton) are also all easily accessible to Cardiff by high-speed InterCity train or coach.

From/To Cardiff International Airport

Taxis
Checker cars, the official taxi operator for the airport, is located outside the arrivals hall to the right as you exit the building.Taxis are available upon arrival, or can be booked in advance by e-mailing cardiff@checkercars.com or calling +44 (0)1446 711747.

Shared Airport Shuttle
Pre book a shared airport shuttle or chauffer driven executive car service prior to your arrival in Cardiff. Contact Flightlink Wales at +44 (0)29 20 253555 or email sales@flightlinkwales.com or check out www.flightlinkwales.com

Train
A shuttle bus provides located outside the Arrivals Hall provides an easy and convenient link to a local railway station from which you can travel to Cardiff City Centre. For more information see Arriva Trains.

By Bus

• National Express: operates low cost coach services to Cardiff from cities throughout the UK, including a flightlink service from Heathrow and Gatwick airports.
• Megabus: operate among others a frequent London-Cardiff service with fares from as little as £1
• Travel line: for all your public transportation information.

By Rail

High-speed trains link most cities with Cardiff. The journey time from London Paddington to Cardiff is under two hours and leaves every 30 minutes during the day.

Regional railways operate modern air-conditioned trains direct to Cardiff from Birmingham, Manchester, Liverpool, Nottingham, Bristol, Southampton, Exeter, Portsmouth...

• National Rail website
• National Rail Enquiries from overseas (Please note: International rates apply): +44 (0)20 7278 5240
• National Rail Enquiries: 08457 48 49 50
• National Rail Enquiries Textphone: 0845 60 50 600
• Welsh language: 0845 60 40 500

By Road

The M4 Motorway runs through the north of the city, making London a comfortable drive away. From the Midlands, the North of England and Scotland it is a straightforward drive via the M6, M5 and M50/M4. From the South and South West of England the approach is by M5 and M4. Access from West Wales is by M4. Please note that parking is NOT available at the conference venues, there are however several carparks nearby (North Road being the closest) and on street parking is available (using vouchers).

Venue

The conference will take place at Cardiff University, one of Britain’s major teaching and research universities. Located in the Centre of the capital city of Wales, Cardiff University has an international reputation for the quality of its work which attracts staff and students from around the world.

The Conference will be held at Julian Hodge Building (No. 14 on the map) on Column Drive which is about 15-20 minutes walk from the City Centre via Park Place road.

Directions to Julian Hodge Building:

• Use Cardiff University's link to Multimap.com, put in your starting point and select "Julian Hodge Building" as the destination!,
• Use your own routefinder and put in "CF10 3EU" or "Column Drive, Cardiff", for example the AA route planner! or
• Use the Cardiff University Cathays Park Campus map and look for location 14!
• View Google Maps' aerial photo of the Julian Hodge Building

By Bus

There are regular bus sevices from Cardiff Bus Station (and St. Mary Street) to Column Road (Column Drive is located just off Colum Road). These include the No. 27 and 86 Cardiff Bus routes and the X6 Shamrock Travel service. Full details including a route planner service are available from Traveline Cymru

By Taxi

Most hotels provide easy access to taxis that could be available within few minutes depending on the time of the day. The taxi journey to the Conference venue takes 5-10 minutes and costs £4-£7. When ording the taxi please indicate your destination as Julian Hodge Building, Column Drive.

By Rail

If you are arriving by train at Cardiff Central it is possible to use the Arriva Trains Wales local services as there are stations are located within walking distance of the two venues.

Cathays Station is the closest station and is shown on the Campus Map, the Julian Hodge Building is No. 14 on the map.

 

Julian Hodge Building



Julian Hodge Theatre

Abstracts

Keynote papers

Biphasic reactions in microreactors

B. Ahmed-Omera (b), D. Barrow (b), T. Wirth (a) a Cardiff School of Chemistry, Cardiff University, Cardiff, CF10 3AT, UK b Laboratory for Applied Microsystems, Cardiff School of Engineering, Cardiff University, Cardiff, CF24 3TF, UK

Abstract

The contact between immiscible liquids in a microfluidic system creating segmented flow offers great potential in the study of biphasic reactions in organic chemistry with significant advantages with respect to conventional flask techniques. As organic solvents play a key role in many chemical processes within the pharmaceutical and chemical industry, there are many applications of biphasic reactions in different areas of chemistry. For a simple biphasic reactions, we show that the application of various reaction conditions in microreactors using segmented flow can dramatically increase the reaction rate, especially when microwave irradiation, sonication or phase transfer catalysis are combined with segmentation.

Engineered Self-assembly From Nano to Milli Scales

Karl F. Böhringer Department of Electrical Engineering, University of Washington, Seattle, WA 98195-2500, USA

Abstract

Self-assembly is the autonomous and spontaneous organization of components into patterns or structures. Self-assembly is ubiquitous in nature, e.g. in the growth of crystals and organisms, but also at macroscopic scales – it is nature’s prevalent paradigm for manufacturing. Self-assembly also provides the basis for important new industrial manufacturing techniques, especially for components at the milli, micro, and nano scales: their small sizes and large numbers scale unfavorably for common serial techniques but favorably for a new, massively parallel approach. We believe that self-assembling systems will be able to create complex, heterogeneous, non-periodic, three-dimensional devices in massively parallel production processes. Hence, our research investigates the scientific and engineering foundations of self-assembly processes for integrated micro/nanoelectromechanical systems (MEMS/NEMS).

Mircofabrication using a Single Mode Yb Fiber Laser

W. O’Neill, K. Li, Q. Hu, P. Chopra, J. Kanghee, A. Buntardjo Institute for Manufacturing, University of Cambridge, Cambridge, CB2 1RX, UK

Abstract

The advances in design, performance, cost reduction, and brightness for the modern Yb fiber laser have opened up the possibility of redefining the micro processing options for a range of semiconductor materials and micro fabrication production techniques at a wavelength of 1064nm. The usual laser of choice for micro electronics processing is the 532, 355, or 266 nm DPSS system. The provision of a new MOPA high brightness Yb based fiber laser configuration has provided a range of pulse parameters (10-200 ns FWHM), peak powers approaching ~ 2G Wcm^(-2) , and pulse repetition rates up to 500 kHz. These processing parameters offer a broad range of material response characteristics. This paper provides a preliminary analysis of the use of a Yb based fiber laser in the production of Si and Glassy Carbon microstructures and explores the potential of this source for low cost micromachining solutions.

Traceable measurement of areal surface texture

R.K. Leach, C. Giusca Industry & Innovation Division, National Physical Laboratory, Teddington TW11 0LW, UK

Abstract

There is a clear need in industry and academia for traceable areal surface texture measurements. To address this need traceable transfer artefacts and primary instrumentation are required. The National Physical Laboratory (NPL) is working on two projects – one to develop areal transfer artefacts and one to develop a traceable areal surface texture measuring instrument. The authors describe the development of the artefacts and instrument, and present some of the challenges that are still required to be able to offer an areal traceability measurement service to industry. The instrument has a working volume of 8 mm x 8 mm x 0.1 mm and uses a co-planar air-bearing slideway to move the sample. It also uses a novel vertical displacement measuring probe, incorporating an air-bearing and an electromagnetic force control mechanism. The motions of the slideway and the probe are measured by laser interferometers thus ensuring traceability of the measurements to the definition of the metre. The artefacts were manufactured using a range of machining technologies and in a range of geometries suitable for stylus and optical based instruments.

Utilising Electrochemical Deposition for Micro Manufacturing

Peter T. Tang IPU Manufacturing, Kemitorvet 204, 2800 Kgs. Lyngby, Denmark

Abstract

Electrochemical deposition, comprising both electroplating and electroless plating, plays an important role as an indispensable process family utilised in many micro manufacturing process chains. Advantages of electrochemical deposition, such as deposition speed, relatively inexpensive equipment, reliability, the large amount of available processes as well as the almost atom-by-atom replication of a given substrate, has given the technology its present position within microelectronics, surface treatment and recently also micro- and nano-manufacturing. The present paper will briefly describe all the major disciplines of electrochemical deposition, as well as some of the problems and challenges that are usually associated with the different deposition processes. Finally are two applications, an all-nickel AFM cantilever and a new process chain for fabrication of tool inserts for injections moulding, described in some detail.

Q2M Special Session

Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies

T. Grund, M. Heckele and M. Kohl Forschungszentrum Karlsruhe GmbH, Institute for Microstructure Technology (IMT),Postfach 3640, 76021 Karlsruhe, Germany

Abstract

A batch compatible process flow to overcome the costly piece by piece assembly of hybrid microsystems is shown. Hot embossing is used to fabricate microstructured polymer layers. Wafer scale compatible bonding tasks are carried out by ultrasonic welding and heat activated bonding with micromachined bonding foils. As demonstrator device, a shape memory alloy (SMA) actuated polymer microvalve is introduced. The valve concept, fabrication technologies and device characteristics are discussed.

Fabrication of piezoelectric thick-film bimorph micro-actuators from bulk ceramics using batch-scale methods

R.P.Jourdain and S.A.Wilson Materials Department, School of Applied Sciences, Cranfield University, Cranfield, Bedfordshire, MK43 0AL, United Kingdom

Abstract

Piezoelectric ceramic films in the 20-60 micron thickness range are rarely employed today in commercial micro-mechanical devices, even though their expected force capability suggests that they are well suited to many micro-fluidic and micro-pneumatic applications. Some examples would be micro-scale fuel cells and micro-combustors. Head sliders, radio-frequency (RF) micro-switches and powered micro-optics are further potential application areas. These are only a few and the barriers in bringing them into reality are those of processing compatibility rather than commercial desirability. Such issues are being addressed in the EU Framework 6 Project ‘Q2M’, which focuses on batch-scale fabrication issues for high quality new micromechanical devices that are cost-effective and which have extended capabilities. This paper discusses a potential batch-scale production route for piezoelectric thick-film bimorph microactuators that combines ultra-precision grinding of ceramics and femto-second laser machining, along with standard micro-fabrication techniques such as wafer bonding. This new method has the key advantage that many different shapes and thicknesses of actuator can be made with only minor process changes, meaning that actuators can be designed to suit their intended application. It contrasts with current practice whereby micro-actuators are often designed around a limited range of standard components, with consequent reduction in their achievable performance. The examples used are a 6mm diameter plane-spiral bimorph actuator for integration into a polymeric micro-valve and 2-5mm long bimorph cantilevers intended for use in a new type of silicon ‘house’ micro-valve, with pneumatic applications.

Material aspects for batch integration of PZT thin films using transfer bonding technologies – Q2M development

D. Bhattacharyya (a), R. V. Wright (a), Q. Zhang (a), P.B. Kirby (a), R. Guerre (b), U. Drechsler (b), M. Despont (b), F. Saharil (c), J.Oberhammer (c) (a) Materials Department, Cranfield University, Bedford MK43 0AL, UK (b) IBM Research Gmbh, Zurich Research Laboratory, Rueschlikon, Switzerland (c) Microsystem Technology Lab, KTH – Royal Institute of Technology, Stockholm, Sweden

Abstract

Transfer bonding is a reliable cost-efficient and low-temperature CMOS compatible technique which allows batch integration of materials whose incompatibility with Si makes them unsuitable for monolithic integration. In this heterogeneous device integration method the material and process incompatibilities inherent in Si IC technology are overcome by fabricating devices on separate substrates and then transferring them onto target (e.g. CMOS) wafers. Transfer bonding has great potential for integrating RF-MEMS devices incorporating, for example, high thermal budget materials such as PZT and PST or non-ferroelectric piezoelectrics such as AlN and ZnO into microwave ICs for enhanced systems performance. This paper presents an overview of technology developments within the EU sponsored project Q2M for the realization of transfer bonded piezoelectrically actuated RF MEMS switches and other components focusing in particular on material factors relating to growth of the piezoelectric films, in this case sol-gel deposited PZT, that restricts the choice of device layers and impact on PZT properties such as microstructure, film orientation and piezoelectric coefficients. New process developments such as hard masking of PZT pattern during RIE etching and its compatibility with polymer transfer bonding are discussed.

The integration of mono-crystalline silicon micro-mirrors on CMOS for SLM applications

F. Zimmera, M. Friedrichsa, M. Lapisac, F. Niklausc, M. Muellera, T. Bakkeb, H. Schenka, H. Laknera a Fraunhofer Institute for Photonic Microsystems (IPMS), Maria-Reiche-Str. 2, D-01109 Dresden, Germany b SINTEF Department of Mikrosystems and Nanotechnology, Gaustadalleen 23C, Oslo, Norway c KTH, The Royal Institute of Technology, Stockholm, Sweden

Abstract

Spatial light modulators (SLMs) based on micro-mirrors for use in DUV lithography and adaptive optics need very high mirror planarity as well as mirror stability. We will present results of new micro-mirror arrays, consisting of monocrystalline silicon, which is a material to fulfil these requirements. As all mirrors of the SLM can be separately activated by an underlying CMOS circuit, the integration of CMOS and MEMS must be achieved, which results in certain restrictions on processing temperatures and the compatibility of materials. Therefore a special low temperature bonding technology has been developed, using an adhesive polymer. This technique provides the transfer of a 300nm thin mono-crystalline silicon layer to the CMOS wafer using only 250°C. First silicon micro-mirrors have been made and characterized using pure adhesive polymer (PMGI), improvements using a mix of an inorganic material with a thin bond-polymer benzocyclobutene BCB) on top are in development. Both approaches and their results will be discussed and presented in detail.

Towards Batch Integration of SMA into Microsystems: An Actuator Prototype

D. Clausi, J. Peirs, D. Reynaerts Katholieke Universiteit Leuven, Department of Mechanical Engineering, Division PMA

Abstract

Shape Memory Alloys have a considerable potential for integration into microsystems, where scaling down of their size allows favorable exploitation of the intrinsic adaptive capabilities, providing an actuation mechanism for applications (e.g. micropneumatics) requiring large force control and large actuator stroke. However, the implementation of these materials into actual structures is rather complex and mostly confined to depositing thin NiTi films onto certain target substrates, resulting in devices having a relatively high cost-per-piece. This paper is aimed at investigating a novel approach for batch integration of SMA to microactuators, which might provide a cost-effective alternative to thin film technology while enhancing functional properties and design flexibility. Indicative requirements for the actuator design have been drawn from typical microvalve applications. In order to evaluate the actuator performance, brass microcantilevers have been produced, with prestrained SMA thin wires bonded on top of them, eccentrically with respect to the cantilever’s neutral plane. The activation of SMA element is obtained by direct heating through electrical current. The bending actuation of the cantilever leads to large strokes, expected to match the requirements of a wide range of applications.

Wafer-scale manufacturing of robust trimorph bulk SMA microactuators

N. Sandström (a), S. Braun (a), T. Grund (b), G. Stemme (a), M. Kohl (b), W. van der Wijngaart (a) a Microsystem Technology Lab, KTH - Royal Institute of Technology, Stockholm, SWEDEN b Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe GmbH, Karlsruhe, GERMANY

Abstract

This paper demonstrates the concept of wafer-level fabrication and integration of robust bulk SMA microactuators based on adhesive bonding of cold-rolled SMA sheets to silicon wafers. Contact printing of an adhesive polymer ensures a selective bonding when transferring full SMA sheets to silicon structures on a patterned wafer. The induced stress of a thin dielectric film deposited on top of the SMA sheet ensures a stable and built-in reset mechanism of the actuators. The trimorph microactuators can be actuated by indirect resistive heating through a thin metal film. We report on the successful wafer-scale fabrication of actuator cantilevers and their characteristics. First test cantilevers show a cold-state deflection of 300 μm which, however, is limited by the silicon substrate. Upon heating, the cantilever shows a stroke of approx. 80 μm.

Components: fabrication and assembly technologies

A new tool for aligned micro-embossing and nano-imprinting

T.Rogers & I.Malmros Applied Microengineering Limited, Unit 8 Library Avenue, Didcot, Oxon.,OX11 0SG, UK

Abstract

A new multi-purpose MEMS fabrication tool is described. The tool enables in-situ aligned embossing and nanoimprinting, in addition to surface activation and aligned wafer bonding. De-embossing is also included in-situ via the use of vacuum chucks and chamber pressurisation. The multi-purpose tool enables the fabrication of bonded, embossed, multi-layer, micro-fluidic devices, for example PDMS structures on silicon, including the alignment of the embossed structure to any pre-existing patterning on the silicon. Examples are presented of various structures that have been made using the tool along with a description of the principles of operation.

Concept for Fluidic Self-Assembly of Micro-Parts Using Electro-Static Forces

J. Dalin (a), J. Wilde (a), A. Synodinos (b), P. Lazarou (b)and N. Aspragathos (b) (a) University of Freiburg – IMTEK, Department of Microsystems Engineering, Georges-Köhler Allee 103, 79110, Freiburg, Germany, contact: Johan.Dalin@imtek.uni-freiburg.de (b) Robotics Group, Department of Mechanical Engineering and Aeronautics, University of Patras, Greece, contact: Lazarou@mech.upatras.gr

Abstract

Self-assembly is relatively unused in industrial micro-fabrication, although it offers opportunities to simplify processes and to lower manufacturing costs. A variety of self-assembly procedures have been introduced that take advantage of various forces, e.g. capillary, gravitational, electro-static. In this paper a concept for the alignment of micro-parts on a substrate using fluidic-self-assembly with electro-static attraction is presented. Further, FEM-simulations for the electro-static alignment force are performed and its dependence on several geometric parameters, e.g. the width of the binding sites and the distance between micro-part and substrate at the binding sites, is investigated. Based on results an analytic model is extracted. Furthermore, simulations are also performed to estimate capillary alignment forces, acting on micro-parts that are self-aligned. Finally, the magnitude of electro-static and capillary forces is compared. This novel assembly concept, where the alignment of the component at the binding site is achieved due to electro-static energy minimisation and, optionally, in combination with capillary alignment, could be beneficial in the manufacturing of heterogeneously integrated MEMS, such as optical and RF micro-systems.

Concept for Packaging of a Silicon based Biochip

T. Velten (a), M. Biehl (a), T. Knoll (a), W. Haberer (a) (a) Fraunhofer Institute for Biomedical Engineering, Ensheimer Strasse 48, 66386 Sankt Ingbert, Germany

Abstract

We report on a concept for packaging of a silicon-based biochip for integration with a fluidic cartridge, thus forming a lab-on-chip (LOC). The biochip, which has dimensions of 2 mm x 2 mm, comprises a central membrane having a diameter of 200 μm, and 20 bond pads with metal tracks leading to the membrane. The packaged biochip provides a fluidic interface to the cartridge as well as electrical interfaces to the biochip electronics being located in a readout instrument. The packaging method ensures the strict separation between the wet sensing area and the electrical contacts. The challenge is that the biochip has a freely moving membrane, additionally with a delicate biological coating, and this membrane is positioned on the same side of the silicon chip as the bond pads for the electrical interconnection. For packaging, the biochip is mounted into a recess of a rigid printed circuit board (PCB). The biochip is electrically connected with the PCB using a proprietary MicroFlex interconnection (MFI) technology, thus resulting in a flat surface towards the reaction chamber of the fluid cartridge. After the realization of the electrical contacts between the sensor chip and the PCB, the entire chip is encapsulated with an epoxy layer, leaving the membrane of the biochip uncovered. To protect the membrane against the fluidic epoxy, a specially shaped silicone casting-mould is used. In a last step, the biochip with the epoxy layer is glued on the bottom side of the cartridge.

Electric fields in a hybrid batch fluidic micromanipulation concept

P. Lazarou (a), N.A. Aspragathos (a), E. Jung (b) (a) Robotics Group, Department of Mechanical Engineering and Aeronautics, University of Patras, Patras T.K. 26500, Greece (b) Chip Interconnection Technologies, Fraunhofer IZM Berlin, Germany

Abstract

Micromanipulation is a very important issue in several fields of technology (microelectronics, optoelectronics & MEMS device packaging). Current implementations do not provide both sub-micron accuracy and movement of parts over centimeter-scale to a ~100μm final alignment precision. A micropart-inside-a-liquid-droplet manipulation concept that manages to bridge the gap from meso via the micro to the sub-micron scale in a fully contained process has been previously introduced by integrating the phenomena of electrowetting, dielectrophoresis and fluidic self-assembly. In this paper, an investigation of the electric fields that drive the manipulation of the droplet and micropart during the stages of electrowettng and dielectrophoresis is presented. Information for critical factors such as electrostatic force, Maxwell stress and surface charge density distribution is provided. Their effect on the manipulation process is verified, in accordance to theory.

Fabrication of stainless steel micro components using softlithography

Mohamed Imbaby (a), Kyle Jiang (a), Isaac Chang (b) (a) School of Mechanical engineering, University of Birmingham, Edgbaston, Birmingham, UK (b) School of Metallurgy and Materials, University of Birmingham, Edgbaston, Birmingham, UK

Abstract

316-L stainless steel has good mechanical properties and has been widely employed for making different devices. This paper presents a study for making micro 316-L stainless steel components by soft lithography in combination with powder metallurgical processes. The process involves producing deep and solid micro moulds using SU-8 photo resist, making soft replica of the moulds using silicon rubber (PDMS), forming green patterns by filling stainless steel slurry into the PDMS moulds. The green parts are de-moulded, de-bound, and finally sintered in tube furnace including nitrogen atmosphere to obtain the final micro parts. The resultant micro components show good quality micro parts with complex geometry. The density of the sintered parts reaches 91.5% of the theoretical one and the linear shrinkage of the micro components after sintering is investigated and it is found to be dependent on the percentage of the solid loading in the green patterns. The fabrication process is described in detail and the results of characterization in shrinkage and density have been analysed.

Flexible microfluidics based on commercial SU8 foils

Chantal Khan Malek and Laurent Robert Institute FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l’Observatoire, 25044 Besançon, FRANCE

Abstract

Polymer-based microfabrication technologies are gaining momentum as they enable low cost fabrication of a variety of microsystems, with major developments in optical and microfluidic systems. The use of dry film resist for microsystem applications is briefly reviewed. A method based on the lamination of commercial SU8 dry films and photolithography for the formation of flexible thin film micro-devices is presented. Fast prototyping of multi-layer microfluidic simple chips with embedded channels is reported.

High Density Interconnections Fabrication by UV Lasers Microprocessing of Microvias and Microstructures

D. Ulieru (a), Alina Matei (b), Elena Ulieru (c), A. Tantau (c), Florin Babarada (d) (a) ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, ROMANIA (b) National Institute for Research and Development in Microtechnologies, 32B,Erou Iancu Nicolae Str., Bucharest, 077190, ROMANIA (c) SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, ROMANIA (d) “Politehnica” University of Bucharest, Splaiul Independentei Str., No. 313, Bucharest 060042, ROMANIA

Abstract

The strong evolution of electronic packaging in the field of high performance hand held electronic products involves, from the fabrication point of view, to manufacture small, lightweight, reliable and, very important too, cost effective electronic modules. In the last years new techniques and technologies for production of rigid/flexible MCMtype multilayer were introduced. The manufacturers of laminate substrates are being challenged to realize boards with very good electrical and mechanical properties. In the past the biggest issues regarding vias and via capture pad sizes were only solderability and manufacturability. Today the vias density is also an important electrical issue. The more vias on a board are presented, the more discontinuities into PCB/MCM passive interconnection structure are placed. For High Density Interconnection (HDI) circuits design one solution is to reduce the via hole and the via capture pad, but still maintain manufacturability at board fabrication stage.The most indicated solution is to use UV laser microprocessing for HDI production.

Investigation of Material Compatibility for Embedding Stereolithography

T. Rechtenwald (a), A. Kopczynska (b), E. Schmachtenberg (b), M. Devrient (a), T. Frick (a), M. Schmidt (a) (a) Bayerisches Laserzentrum GmbH, Konrad-Zuse-Str. 2-6, 91052 Erlangen, Germany (b) Lehrstuhl für Kunststofftechnik, Friedrich-Alexander Universität, Erlangen, Germany

Abstract

Decreasing sales figures and increasing demand of different variants at the same time, as well as the desire of a short time to market pose a challenge for nowadays manufacturing technology. In this context, a new flexible production technology for mechatronical devices, which include also optical functions, called Embedding Stereolithography (eSLA) is introduced. eSLA combines the flexibility to automatically generated inner and outer complex geometries of conventional SLA with embedded functional components, which are conducted by generative manufactured electrical and/or optical structures. To form a rugged mechatronical device out of mechanic and/or electronic parts by eSLA a sufficient wetting of the used components by the processed liquid photopolymer is needed. Therefore the surface tension and viscosity of different photopolymers is measured and compared to surface energies and surface roughness of relevant component materials. Afterwards the characteristics of wetting of the chosen photopolymers on these materials are discussed.

Large-area metal-coated dielectric nanopillar array for excitation of surface plasmon resonance

X. Chen, K. Jiang Micro Engineering and Nanotechnology Group, Department of Mechanical Engineering, University of Birmingham, B15 2TT, UK

Abstract

Many of current techniques are not suitable for the fabrication of metallic nanostructure on the scale of usual optical coatings at reasonable fabrication cost and time. A fabrication process for producing large-area metalcoated periodic nanopillars is presented. A hybrid metallic nanostructure array was obtained by depositing a silver film with a thickness of ~40 nm on the fused silica nanopillars with an in-plane diameter of ~140 nm and out-ofplane height of ~130 nm, which was fabricated by a combination of interference lithography, metal deposition and etching. There are two peaks in the extinction spectrum of the p-polarized incident light, one at 585.3 nm and the other 493.6 nm. The shift of the higher peak is 32.9 nm (a red-shift), while that of the lower peak is 42.3 nm (a blue-shift) with the addition of absolute ethanol on the sample surface. Such structure was used to monitor the evaporation process of the absolute ethanol on the sample surface. It was found that narrowest extinction peak appears at normal incidence, while the polarization of the incident light does not affect the experimental result due to the symmetrical distribution of the nanostructures. The fabrication process and unique optical properties of the structure array are expected to be suitable for the development of high-throughput ultrasensitive chemical sensor arrays.

Manufacturing and replication of cell aligning micro structures

C. Brecher (a),(b), R. Klar (b), F. Pretzsch (b), C. Wenzel (b) (a) Werkzeugmaschinenlabor (WZL), RWTH Aachen University, Germany (b) Fraunhofer-Institute for Production Technology Aachen, Germany

Abstract

Biotechnology is becoming more and more important and is influencing our everyday life. One of the most important advantages will become the manufacturing of mass customized cells also known as tissue engineering. To optimize and shorten the cell growth, micro structures have shown an important impact on the cell division, alignment and cell differentiation. This paper deals with the manufacturing of micro structured moulds by diamond machining and the successive replication process to create bio functional surfaces provided with micro structures. While the fabrication of micro structures by diamond machining is an expensive and long lasting process the replication of bio functional surfaces by hot embossing allows the cost efficient production of these surfaces. Compared to lithography processes, diamond machining is very flexible and offers next to 2D or 2 1/2D geometries real 3D forms to copy invivo conditions for in-vitro cell replication processes. One of the main advantages of diamond machining is the flexibility to diversify the shape of micro structures rapidly to investigate the cell - substrate - interaction down to the micrometer range.

Manufacturing of Versatile Ceramic or Metal Micro Components by Powder Injection Moulding

V. Piotter, K. Plewa, J. Prokop, A. Ruh, H.-J. Ritzhaupt-Kleissl, J. Hausselt Forschungszentrum Karlsruhe, Institute for Materials Research III P.O. Box 3640, 76021 Karlsruhe, Germany

Abstract

Although microsystems technologies products have been steadily launched worldwide markets the development and improvement of manufacturing processes suitable for medium or large-scale production is still one of the most important prerequisites. A well-known technology to meet such demands is micro injection moulding which has already reached an industrial viable status for polymeric materials. Nevertheless, there is still a lack of methods for the processing of materials with a wider range of properties. A promising option to close this gap, development of the so-called MicroPIM process to facilitate the fabrication of metal and ceramic micro components was started. Presently, the smallest dimensions achievable are 25-50μm of part thickness or minimum structural details of less than 5μm. Theoretical densities of up to 99% were achieved depending on the particular powder applied. As further improvement, the technology to produce rotational-symmetric parts by making use of a special head spindle system has been developed. To enlarge the application possibilities of MicroPIM further, micro two-component injection moulding enables, for example, the fabrication of micro components consisting of two ceramic or metal materials with different physical properties and, not less important, significantly minimises assembly expenditure.

Microfabrication of Components for a Novel Biomimetic Neurological Endoscope

A. Schneider (a), L. Frasson (b), T. Parittotokkaporn (c), F. M. Rodriguez Y Baena (b), B. L. Davies (b), and S. E. Huq (a) (a) Science and Technology Facilities Council, Rutherford Appleton Laboratory, Technology – Central Microstructure Facility, Harwell Science and Innovation Campus, Didcot, OX11 0QX, UK (b) Mechatronics in Medicine Lab., Depart. of Mechanical Engineering., Imperial College, London, SW7 2AZ, UK (c) Institute of Biomedical Engineering, B 422 Bessemer Building, Imperial College, London SW7 2AZ, UK

Abstract

The development of a novel biomimetic neurosurgical probe is inspired by nature. Some insects have spines with a unique surface texture which enables them to penetrate tissue more easily. This surface texture consists of cutting teeth and fin-like pockets on the spine. Instead of drilling, the insect slides its spine into the fibre through the reciprocating motion of independent segments. Applying the same or similar microtexture to a miniaturized neurosurgical endoscope could improve existing tools for brain surgery and brain biopsy. The development of such endoscope could minimize the damage caused by inserting the probe whilst avoiding the risk of buckling, which is a common occurrence when thin flexible probes are axially loaded. To replicate the surface microtexture, teeth and fin-like high-aspect-ratio microstructures were fabricated. Different geometries of these fins and teeth were studied for insertion into tissue so that the texture could be characterized for friction and tribological interaction with tissue. For these tests, free-standing long and narrow strips with microstructures in up to 525 μm thick SU-8 were designed, fabricated, and mounted onto prototypes made by stereolithography. This paper focuses on the fabrication of the microtextured strips. The required geometry of these strips can cause considerable bending. The structures were investigated regarding fabrication and stress conditions.

Single- and multi-layer conductive patterns fabricated using M3D technology

B. Obliers-Hommrich (a), A. Fischer (b), H. Willeck (a), W. Eberhardt (a), H. Kück (b) (a) Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Stuttgart, Germany (b) University of Stuttgart, Institute of Micro and Precision Engineering, Germany

Abstract

The continual trend of miniaturization and increasing complexity in the field of microelectronic devices pose a challenge for today’s manufacturing technology. The novel Maskless Mesoscale Material Deposition (M3D) manufacturing technology offers the potential for printing superfine circuitry as well as for the building up of multi-layer systems. Therefore it could be an interesting technology to meet the requirements of miniaturized systems. The M3D process depends on aerosol formation and uses aerodynamic focusing of aerosol streams for a high resolution deposition of colloidal suspensions and liquid raw material. Since M3D is a contactless and maskless Direct Write Technology, it also offers new possibilities for 3D devices. This paper will report on first results of depositing conductive and non conductive materials onto glass substrates as well as onto typical MID (Moulded Interconnect Devices) substrates. Furthermore it will present first multi-layer systems that have been fabricated using the M3D technology.

Towards automation in AFM based nanomanipulation and electron beam induced deposition for microstructuring

F. Krohs (a), T. Luttermann (a), C. Stolle (a), S. Fatikow (a), E. Brousseaub, S. Dimov (b) (a) Div. Microrobotics and Control Engin., Univ. of Oldenburg, Germany; (b) The Manufacturing Engineering Centre (MEC), Cardiff University, Wales

Abstract

To move towards complex assemblies at the micro- and nanoscale, manipulation processes have to be automated to increase throughput and accuracy. First, this paper addresses manipulation at the nanoscale by an AFM and second, automated electron beam induced deposition as a method for structuring at the microscale is presented. Nowadays, AFM based nanomanipulation still requires frequent user interaction and remains a very labor intensive task. Spatial uncertainties are identified as a major problem that prevents reliable automation of AFM based manipulation. Results of a novel particle filter based method for measuring thermal drift in an AFM system is presented and future applications for probabilistic methods are discussed. The automation of electron beam induced deposition (EBiD) for microstructuring purposes builds a multifunctional tool for additive structuring and also bonding inside an SEM. The presented system has the ability to create EBiD depositions from two different precursor materials by automatically executing predefined sequences. The automation includes the precursor flux control with the possibility to alternate between two materials, the deposition of points and lines at defined positions, as well as the ability to find and track already deposited structures with the use of digital image processing. This assures precise positioning of depositions relative to others even in cases of thermal or electrostatic drifting of the specimen substrate or the electron beam.

Ultrasonic welding of micro plastic parts

W. Michaeli (a), E. Haberstroh (b), W.-M. Hoffmann (a) (a) Institute of Plastics Processing (IKV), RWTH Aachen University, Aachen, Germany (b) Lectureship and Research Field of Rubber Technology, RWTH Aachen University, Germany

Abstract

Due to the ongoing miniaturisation in many industrial branches plastics are increasingly applied in microsystems technology. To guarantee the functionality of the system suitable joining processes must be applied to join separate components. Most of the welding processes commonly used for series production are not suitable for welding micro parts made from plastics, since either the mechanical or the thermal load of the joining partners during the welding process are too high. Only laser transmission welding and ultrasonic welding are applicable for welding complex micro components. Since with ultrasonic welding a certain frictional load of the components cannot be avoided totally with standard welding equipment, specially adapted machinery has to be used as it could be shown at the Institute of Plastics Processing (IKV) at RWTH Aachen University. While micro parts with two-dimensional weld seams have already been successfully welded in previous investigations, recent research deals with the ultrasonic welding of micro parts with a more complex three-dimensional weld seam geometry. It could be shown that for appropiate welding parameters this can be accomplished, whereby the mechanical load of the parts has to be kept as small as possible.

Wafer-scale transfer of nanoimprinted pattern into silicon substrates

G. Hubbard (1), S.J. Abbott (1), Q. Chen (2), D.W.E. Allsopp (2), W.N. Wang (2), C.R. Bowen (2), R. Stevens (2), A. Satka (3) D. Hasko (3), F, Uherek (3) and J. Kovac (3) (1) MacDermid Autotype Ltd, Grove Road, Wantage OX12 7BZ, England (2) Faculty of Engineering and Design, University of Bath BA2 7AY, England (3) International Laser Center, Ilkovicova 3, Bratislava 812 19, Slovakia

Abstract

Nanoimprinting provides a low cost alternative to Deep Ultra-Violet and electron beam lithography for producing deeply sub-micron features in semiconductor device fabrication. This paper presents a flexible nanoimprint process capable of wafer-scale pattern transfer into Si substrates. The technique is based on the novel concept of a disposable soft master with matching imprint resist formulations. Both of the resists developed enable the transfer of vertical sided, nearly flat bottomed features in Si substrates. The technique lends itself to large-scale low cost roll-toroll processing based on the concept of a disposable master. The process is a promising method for low-cost formation of photonic crystal structures in hard substrates and is potentially suitable for high volume production.

X-ray pattern analysis of electroplated two-component moulds used for the production of micro gear wheels

J. Prokop (a),(b), J. Lorenz (a), V. Piotter (a), H.-J. Ritzhaupt-Kleissl (a), A. Roch (a), and J. Haußelt (a),(b) (a) Forschungszentrum Karlsruhe GmbH, Institute for Materials Research III (IMF III) Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany (b) Department of Microsystems Engineering - IMTEK, University of Freiburg, Germany

Abstract

A process for the fabrication of metal micro components by combining 2-component injection moulding with metal deposition by electroforming will be presented. To produce these 2-component polymer templates, an electrically conductive base plate is generated by injection moulding of electrically conductive carbon black-filled polymers. In a second injection moulding step microstructures consisting of insulating polymers are mounted onto these plates. The quasi-infinite conductivity gradient of such 2-component templates allows controlled electroplating to start from the base plate only, such that defect-free metal micro components can be achieved. The parameter set of the injection moulding process has been investigated by using an experimental method with an x-ray pattern analysis. Nearly defect-free electroplated micro parts could be fabricated by this process so far.

Metrology: inspection and characterisation methods 

Approaching a sub-micron capability index using a Werth Fibre Probe System WFP

Richard Thelen (a), Joachim Schulz (a), Pascal Meyer (a), Volker Sailea (a) (a) Institute for Microstructure Technology, Research Centre Karlsruhe, 76646 Eggenstein, Germany

Abstract

Reproducibility and precision of LIGA structures has been claimed in many publications, founded mainly on brilliant pictures. Because of the poor accessibility to the sidewalls many publications are based on surface measurements without including information about z depending aspects [1] and focus on reproducibility as measured close to the top. Often this neglects operator’s influence, short time and long time reproducibility, environmental effects on the CMM and others. Tactile optical metrology might help to overcome 2D measurements. Repeatability of tactile optical metrology at IMT was proven to be less than 0,3 μm over some months using ultra fine probes with less than 25 μm diameter. In addition DoE was used to determine the minimum deviation for best possible machine settings. Standard Deviation between 50 and 30 nm was measured. Compared to that, uncertainty remains about 1-2 μm for 3D measurements even with z maximum restricted to 1 mm [2]. Not enough to measure sub-μm product variation that is a typical benefit of LIGA products. Investigations were started at the Research Centre Karlsruhe to find out more about the effects influencing the measurements to explain why repeatability and capability do not match. Interaction between sample and sensor was the main reason. This was simulated and the results were used to reduce the uncertainty of the system. IMT elaborated a new strategy that improves the capability of a coordinate measurement machine CMM with tactile optical sensor for LIGA parts with sub μm variation.

How reliable are surface roughness measurements of micro-features? - Experiences of a Round Robin test within nine 4M laboratories

L. Mattsson (a), P. J. Bolt (b) , S. Azcarate (c), E. Brousseau (d), B. Fillon (e), C. Fowler (f), E. Gelink (b), C. Griffiths (d), C. Khan Malek (g), S. Marson (h), A. Retolaza (c), A. Schneider (f), A. Schoth (i), A. Temun (a), P. Tiquet (e), and G. Tosello (k) (a) KTH – the Royal Institute of Technology, Department of Production Engineering,School of Industrial Engineering and Management, SE-10044 Stockholm, Sweden (b) TNO Science and Industry, 5600 HE Eindhoven , The Netherlands (c) Tekniker Technological Center, 20600 Eibar, Spain (d) Cardiff Univer