Microsystems-based products are a key value-adding element for many sectors of industry - and the predicted nanotechnology future will also be largely delivered by microtechnologies. While the late 20th century has seen a silicon-based microelectronics revolution, the 21st century looks forward to the adoption of micro- and nano-manufacturing technologies as the demand for function and length scale integrations increases continuously on the way to bridging the nano- and the macro-worlds.
The existing imbalance between the ease with which batch-fabricated microcomponents and microsystems can be produced in silicon compared to the difficulties and costs associated with their manufacture in other materials hinders the introduction of new microsystems-based products into the market. Although there may be commercial advantages to leveraging the present suite of IC-based processes and materials, they will not be able to meet the demands of emerging products for 3D and high aspect ratio structures, enhanced-force microactuation, improved environmental resistance, high precision, and unification and standardisation. To broaden the range of microsystems-based products and simultaneously multiply their capabilities requires the integration of new materials and precision engineering technologies for their processing with IC-based, batch-fabrication processes. These are major challenges in developing new products that at the same time represent promising research and development areas for innovation and value creation.
The main goal of this Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of manufacturing capabilities for:
Papers are invited to present the latest advances in developing new processes and process chains for multi-material micro manufacture and their applications in microsystems-based products, in particular but not limited to:
The above six sub-topics represent the intended topics of the thematic sessions of the Conference to which the authors are invited to submit papers.
The Conference will also feature two invited sessions; one organised by the Assemic partnership and the second one by the MicroSapient Consortium
Papers MUST be submitted using ONLY Microsoft Word and the papers MUST follow the provided template in order to be included in the Conference Proceedings
The accepted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Conference Proceedings.
Questions may be directed in the meantime by e-mail to: 4m_conference[@]4m-net.org
Submission will be electronic only via: 4M2007
To ensure a high-quality Conference all papers will be reviewed by Programme Committee members under the leadership of the Conference Chair.
| Paper ID | Abstract |
|---|---|
| PID376318 |
Design for Microassembly – Capturing Process CharacteristicsC. Tietje(a), S. Ratchev(a)(b) AbstractMicro systems technology (MST) is considered to be an enormously strong economic driver in the 21st century. Market estimations predict a large volume of products in MST within the next decade. Within MST, microassembly shows vast potential in a wide range of industrial applications. Currently this potential has only been shown by the development of demonstrator products within research environments and with limited transfer to industrial practice. Microassembly is in particular necessary to produce multi-material devices with complex and true three-dimensional geometries. Although there are various DFA methods in use since the seventies to guide the designer to producing efficient and economic design, there is a lack of well defined solutions tailored to the microworld and its specific challenges. In fact, most DFA methods focus on assembly of products with part dimensions ranging from a few millimetres up to several decimetres. For the design of microproducts it is essential to consider key assembly process features in the early design stages. Furthermore it is important to provide support in the selection of suitable assembly processes by considering process related requirements as well as offering quantitative cost analysis to support the decision making to assure best producability and by this means enable an increased transfer of microproducts from Keywords: Microassembly, Design, Process selection |
| PID380349 |
Chemical Bonds of Nanoscale Materials – Reasons for Various ApplicationsIovka Dragieva |
| PID380343 |
A Synopsis of U.S. Micro-Manufacturing Research and Development Activities and TrendsKornel F. Ehmann(a)(b)(c)(d) AbstractMicro-manufacturing in the context of this presentation is defined as the manufacture of components and products in the sub-millimeter to a few-millimeter range with micron size feature characteristics of high accuracy and precision in a wide range of engineering materials by non-lithography based processes. The paper addresses three topics. First, the findings of a worldwide study on micro-manufacturing, conducted by the World Technology Evaluation Center, Inc. (WTEC) will be summarized. This summary will compare U.S. efforts to those in a number of Asian and European countries. Second, a précis of selected ongoing work conducted at U.S. universities with leading programs in the field will be given. Topics to be discussed include the development of miniaturized machine tools for cutting, forming and manipulation as well as the modeling of micro-manufacturing processes. An account of the growing industrial activities related to the development of micro-manufacturing equipment will also be included. Third, emerging directions and challenges in the development of micro-manufacturing technologies will be reflected upon. Keywords: micro-manufacturing, miniaturization, desk-top manufacturing |
| PID380346 |
Microassembly Processes and Microassembled DevicesM. Probst, R. Borer, B. J. Nelson AbstractMany future micro-scale products will rely on flexible microassembly systems that are capable of assembling three dimensional structures with high precision and repeatability. This is not only because of limitations imposed by clean-room processes but also because of the high-complexity of new sensor and actuator designs. Introducing new techniques into existing assembly systems for more complex components and higher output yield is crucial for industry acceptance. This paper presents an advanced 6 DOF microassembly system that allows the dexterous manipulation of parts of a large range of size and also serves as a test platform for a series of concepts. Keywords: micro-assembly, micro-manufacturing |
| PID380351 |
SPH Simulation of the Embossing and Injection Moulding of Micro-Parts: Softening and Aggregation AspectsD. Kauzlarić(a), L. Pastewka(b), C. Bretthauer(a), A. Greiner(a), J. G. Korvink(a) AbstractWe present an approach based on Smoothed Particle Hydrodynamics (SPH) for the predictive simulation of ultrasonic embossing and injection moulding of micro-components. The material is represented by a set of moving fluid particles, carrying all relevant physical information. In order to discretise arbitrary transport equations, the idea of interpolation over the discrete particle data is used. We use this approach for the non-isothermal modelling of embossing of polymers and for the injection moulding of feedstocks with suspended powder particles (powder injection moulding, PIM). For the former we incorporate softening by introducing a temperature dependent yield-stress model based on viscosity regularisation. For the simulation of powder filled feedstocks, we perform an SPH-discretisation of a continuum model for particle migration. For both models, simulation results are presented for engineering relevant mould geometries. The embossing simulations show a softening below the glass transition temperature. The simulation of powder injection moulding shows an aggregation of the solid particles, eventually leading to failures during sintering. Keywords:MEMS, Smoothed particle hydrodynamics, Fluid mechanics, Powder injection moulding, Embossing |
| PID380352 |
Dimensional Metrology in Micro ManufacturingH.N. Hansen AbstractThe need for dimensional metrology at micro and nano scale is evident both in terms of quality assurance of components and products and in terms of process control. As critical dimensions are scaled down and geometrical complexity of objects is increased, the available measurement technologies appear not sufficient. New solutions for measuring principles and instrumentation, tolerancing rules and procedures as well as traceability and calibration are necessary if micro manufacturing is to develop into industrial manufacturing solutions. The current paper describes issues and challenges in dimensional metrology at micro scale by reviewing typical measurement tasks and the measuring capability of available instrumentation. Traceability and calibration issues are discussed subsequently. Finally needs and gaps are identified based on these observations. Keywords: dimensional and geometrical metrology, micro manufacturing, tolerancing |
| Paper ID | Abstract |
|---|---|
| PID367291 |
Method for Overcoming the Unwanted Displacements of an Electro-Thermally Actuated MicrogripperR. Voicu, D. Esinenco, R. Müller, L. Eftime, C. TibeicaNational Institute for Research and Development in Microtechnologies – IMT Bucharest, 126A, Erou Iancu Nicolae Street, Bucharest, Romania AbstractThermal microactuators are based on the principle of material deformation due to heat generated by Joule effect. As a class of microactuators, the microgrippers are promising tools for manipulation of micro and nano - scaled objects. The designs of two models of SU-8 microgrippers electro-thermally actuated are described. A simple design for an electro-thermaly actuated polymeric microgripper is compared with an improved design using a pair of heaters on both sides of the microgripper. We demonstrated that it is possible to reduce the unwanted out of plane displacement, the second model capable of being more stable to the out of plane deflection, generated by the stress, when a voltage is applied. Electro-thermo-mechanical simulations based on finite element method were performed for each of the model in order to make a comparison between the results. Preliminary results on the fabrication of the last model, using a surface micromachining technique and an SU-8 polymer as functional material are presented. Keywords: microgripper, SU-8 polymer, thermal actuation, FEM simulation |
| PID367308 |
A Simple Bonding Process of SU-8 to Glass to Seal a Microfluidic DeviceS. G. Serra(a), A. Schneider(a), K. Malecki(b), S. E. Huq(a), W. Brenner(b)a: Science and Technology Facilities Council, Rutherford Appleton Laboratory,Technology – Central Microstructure Facility, Harwell Science and Innovation Campus, Didcot, OX11 0QX, UK b: Institute of Sensor and Actuator Systems Vienna University of Technology, Floragasse Str./E366 MST, Vienna 1040, Austria AbstractThis paper describes a simple process of adhesive bonding between a glass lid and a SU-8 microfluidic device. The bonding is made by applying pressure, between 1.24 MPa – 3.72 MPa, and heat, above the SU-8 glass transition temperature (Tg). The advantages of this process are low cost, simplicity and no need of extra adhesive material, which could block microchannels and inlets. The SU-8 microchannels are fabricated on a glass substrate by UV photolithography. The resist thickness is 30 μm and the smallest channels are 5 μm in width. The bonding process was performed using a simple uniaxial press, a torque wrench and a convection oven as an alternative to the complex and expensive bonding machines with a vacuum chamber and alignment tools. To identify a suitable bonding temperature, a Tg of 175°C for the patterned SU-8 was obtained by Dynamic Mechanical Analysis (DMA). The bonding strength was 1.15MPa, measured by a pull-out test, and a bonding area of 90% was achieved, which was observed by visual inspection. It was also investigated the effect of an O2 plasma cleaning process on the bonding quality. Keywords: SU-8, adhesive bonding, microfluidic device |
| PID367463 |
ASSEMIC: Research Advances in Microhandling and Assembly – “Special ASSEMIC Session”Ana Almansa(a), S. Bou(a), Z. Rozynek(a) , W. Brenner(b)a: Profactor R&S GmbH, Seibersdorf 2444, Austria b: TU Wien – ISAS, Floragasse 7/2, Vienna 1040, Austria AbstractFew technical fields are so multidisciplinary and present so challenging demands as microtechnologies. The Research and Training Network “Advanced Methods and Tools for Handling and Assembly in Microtechnology” (ASSEMIC) addresses this research field at a European scale. ASSEMIC brings together a consortium of 14 participants, focusing their efforts in microhandling and microassembly. This paper summarizes some of the latest results achieved in this project. Keywords: microhandling, microassembly |
| PID367967 | A Concept of Collision Prevention during Micro Assembly in a SEM ChamberAl. Cvetanovic(a), An. Cvetanovic(b), M. Socek(c), D. Andijacevic(a), W. Brenner(a)a: Institute of Sensors and Actuator Systems, Vienna University of Technology, Floragasses 7/2 A-1040 Wien b: Integrated Microsystems Austria, Victor Kaplan Strasse 2, A-2700 Wiener Neustast c: Tomeckova 3, CZ-63800, Brno AbstractThis paper presents a concept for avoiding collisions during micro assembly processes in the camber of a Scanning Electron Microscope (SEM). Focus is the phase of approaching of a micro-gripper to the specimen holder and the phase of picking up the micro-components that are positioned on it. Although the 3D position of the gripper tips should be known exactly the current design of equipment in the SEN chamber does not allow an assesment of the position in the z-direction. This uncertainty of relative positions causes a high risk that tips of micro-crippers break if colliding with the speciment holder as the operator has no information about the distance. |
| PID372351 | Technologies for Microassembly: Selected MethodsS. Bou(a), D. Fratila(a), A. Boglea(b), D. Andrijasevic(c) , A. Almansa(a), W. Palfinger(a), W. Mann(a), A. Olowinsky(b), W. Brenner(c), R. Möst(d)a: PROFACTOR R&S GmbH, Seibersdorf 2444, Austria b: Institute for Laser Technology – ILT, Aachen, 52074 Aachen, Germany c : TU Wien – ISAS, Floragasse 7/2, Vienna 1040, Austria d : PICO Dosiertechnik GmbH & Co. KG, Friedenstraße 19, 82110 Germering, Germany AbstractThis paper presents three different Microassembly examples. The first part of the paper presents a solution based on a laser system, next a contact-less microdispensing system and finally an innovative hot air stream joining system. One of the most remarkable differences between these methods is the different material requirements: meanwhile the laser system requires that one of the joint components is optically transparent, the other two systems do not have this constraint but require compatibility between glue and parts. Keywords: microassembly, laser, dispensing, joining |
| PID373119 |
Preliminary Experiments for the Fabrication of Thermally Actuated Bimorph Cantilever arrays on non-silicon wafers with vertical interconnectsS. G. Serra(a), Z. Rozynek(b), A. Almansa(b), V. Djakov(a), A. Schneider(a), S. E. Huq(a), I. Montealegre(b), P. Castillo(b), S. Bou(b)a: Science and Technology Facilities Council, Rutherford Appleton Laboratory (RAL), Technology – Central Microstructure Facility, Harwell Science and Innovation Campus, Didcot, Oxfordshire, OX11 0QX, UK b: Profactor Research and Solutions GmbH, 2444 Seibersdorf, Austria AbstractThis paper describes the first steps for the fabrication of low-cost cantilever arrays, developed at RAL, on nonsilicon polymer substrates with vertical interconnects, produced at Profactor. The deflection and actuation of these cantilevers is based on the bimorph thermal actuation principle. The fabrication of the cantilever arrays requires many process steps which are presented in this article. The first one is the planarization between the via-holes interconnects with a uniform layer. This was achieved by spin coating of a thick (~58μm) SU-8 layer. Next, two thin metal layers of Cr (500Ǻ) and Au (1000Ǻ) were thermally deposited and patterned, using UV lithography with a mask alignment process and wet etching. The following step was the coating of a 1μm structural Au layer, in which the deposited layer had a very poor adhesion. Alternative procedures were explored to overcome this problem in the future. Modifications of the photo masks design and the substrates will be carried out to make the RAL microcantilevers technology more compatible with Profactor substrates. Keywords: bimorph cantilever, vertical interconnect, epoxy glass fibre, FR4 |
| Paper ID | Abstract |
|---|---|
| PID376397 |
Pneumatic Contactless Microfeeder Design Refinement through CFD SimulationMichele Turitto(a), Svetan Ratchev(a), Xiangdong Xue(b), Michael Hughes(b), Chris Bailey(b) AbstractA new contactless pneumatic microfeeder based on distributed manipulation is proposed. By cooperation of dynamically programmable microactuators, the part to be conveyed floats over an air cushion and is moved to the desired location with the desired orientation. CFD simulations are used to test the validity of the proposed concept and refine the design of the microactuators. Keywords: Microassembly, Microfeeder, Contactless, Distributed Manipulation, CFD Simulation |
| PID382976 |
SMART: A Tool to set the Materials EuroRoadsE. Bouyer, P. Juliet AbstractSMART is a Specific Support Action funded within the 6th Framework Programme of the European Union. The SMART-project aims to create a European map of excellence in materials science with special focus on multifunctional and highly sophisticated materials, and to identify trends and visions in the respective materials R&D for the next two decades. The SMART-process is a two folded approach consisting of a traditional forecast branch with data screening, trend extrapolation and roadmapping and an innovative foresight branch taking studies with economic, social and security focus into consideration. The methodology used for this roadmap will be presented. Some key examples will be extracted from the three thematic topics which are focusing on “Materials powering Europe”, “Materials for a Better Life” and “Materials for a Safe Europe”. By crosschecking these three topics with the five materials main fields (smart materials, nanomaterials, tailored macroscale materials, bioconceptional materials and modelling for materials technology) it was found, that all fields of materials technology are addressed. For advancement in materials technology not only scientific bottlenecks have to be solved by addressing them in European research strategies but non technical problems have to be addressed as well. Keywords: materials, roadmapping |
| PID363883 |
Structure-Property Relationship of Dispersants used in Ceramic Feedstock DevelopmentT. Hanemann(a)(b), R. Heldele(a)(b), J. Haußelt(a)(b) AbstractWith respect to polymer-filler composite (feedstock) development for the different variants of powder injection molding the use of dispersants or surfactants is essential for a large filler load and a homogenous feedstock quality. In this paper the influence of a series of citrate derived dispersants on the viscosity of feedstock systems with different binder composition and ceramic fillers will be described. Citrates posses four polar functionalities, which can interact with the hydroxy-groups at the alumina or zirconia surface. The investigated surfactants differ in the extension of the lipophilic end chains (ethyl or butyl) and in the presence of one free hydroxy group, which is masked partially by an acetic acid group. The impact of the dispersant concentration, molecular structure, dipole moment and the used binder composition will be discussed in terms of the resulting composite feedstock flow behaviour, some structure-property relationships can be found. Keywords: Polymer-ceramic-composites, rheological properties, feedstock development |
| PID365567 |
Application of Different Process Chains for Polymer Microfluidics Fabrication including Hybrid Tooling Technologies, Standardization and Replication: A Benchmark Investigation within 4M Polymer DivisionG. Tosello(a), B. Fillon(b), S. Azcarate(c), A. Schoth(d), L. Mattsson(e), C. Griffiths(f), L. Staemmler(g), P.J. Bolt(h) AbstractThis paper is based on the Division 4 “Processing of Polymers” activities within the 4M NoE “Multi-Material Micro Manufacturing”. To overpass limitations of the current existing micro tooling capabilities, a new generation of micro hybrid tooling technologies for micro replication was developed. A metrological approach was applied to standardize the employed tooling processes (μ-milling, μ-EDM, laser μ-machining, electrochemical μ-milling). The micro tools were then tested with different polymers. The paper provides a comparison of these technologies concerning obtainable feature sizes, surface finishing, and aspect ratios of both micro tools and micro moulded parts. Keywords: Hybrid tooling, micro tools, micro injection moulding, standardization. |
| PID366530 |
A CAD/CAM Approach for Layer-Based FIB ProcessingGeorgi Lalev(a), Stefan Dimov(a), Jeff Kettle(a), Falco van Delft(b) and Roussi Minev(a) AbstractThe realization of complex three-dimensional structures at micro- and nano-meter scale in various materials is of great The factors that can affect the accuracy of the structures produced by layer-based FIB processing are also discussed. By assessing all stages of the proposed approach and the results of its experimental validation, conclusions are drawn about its applicability. Keywords: layer-based manufacturing, CAD/CAM systems, focus ion beam machining, FIB, grey scale lithography, |
| PID373249 |
Design of Generic Modular Reconfigurable Platforms (GMRP) for Future Micro ManufacturingX. Sun(a), K. Cheng(a)(c), F. P. Wardle(b) AbstractThe need for reduced weight, small size, energy efficiency, higher surface quality and dimensional/form accuracy, whereas at the same time decreasing component costs and batch sizes for components/devices, is forcing the industry to introduce more and more microparts into various industrial products. It is expected that the market for micro products is increasing rapidly and changing frequently in the future. To cope with such a volatile market, manufacturing enterprises will have to be adaptive and response quickly and cost-effectively. However, the existing micro manufacturing systems can not meet the need above because of their limits in setup cost, large footing space, rigid functions and high operation cost. In this paper, a new micro manufacturing platform, i.e. generic modular reconfigurable platform (GMRP) is proposed in order to provide an effective means for fabrication of high quality micro products at low cost in a responsive manner. GMRP is characterized by hybrid micro manufacturing processes, modularity of key components, and reconfigurability. Various micro manufacturing processes can be conducted on a single platform by changing, adding and integrating the component modules or even re-setting up platforms simply, and thus forming an effective micro manufacturing system rapidly and effectively. The paper concludes with a discussion on the potential and applications of the GMRP concepts and methodology for micro manufacturing and micro factory purposes in particular. Keywords: Micro manufacturing, Reconfigurable manufacturing, Micro manufacturing system, Micro factory |
| Paper ID | Abstract |
|---|---|
| PID361344 | A New Approach to Qualitiy Assurance in Resistance Welding for Microsensors PackagingD. Ulieru(a), Alina Matei(b), Elena Ulieru(c), A. Tantau(c)a: ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, Romania b: National Institute for Research and Development in Microtechnologies, 32B, Erou Iancu Nicolae Str., Bucharest, 077190, Romania c: SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, Romania AbstractThe permanent development of microelectronics technologies provide new challenges for miniaturization and complexity increasing for new packaging technologies. So the exciting applications for microsystems, sensors and actuators production are looking for the best quality hermetic sealing of metal packages. The paper showed our researches and experiments results for a new approach to quality assurance in resistance welding. These will analyze the main causes of weld failures and also our methods of determining its value. On the basis of this requirement have monitored through the weld sequence, integrated concept of power monitor. The technical features developed a modern concept applicable to a wider range of fields. Our monitor could be used to wide range of welding technologies like distributed spot and focused spot, projection, roller spot and mash welding machines, working with single or three phase, ac. or dc. The experiments with our equipment have proven its advantage for fast production assembly line. Keywords: microwelding, microsensors and microsystems, quality assurance, monitoring systems |
| PID363922 |
Design of a Micro Injection Moulding Machine for Thermosetting Moulding MaterialsW. Michaeli, T. KampsInstitute of Plastics Processing at RWTH Aachen University, 52056 Aachen, Germany AbstractMicro products made of thermosetting polymers enable innovative applications since thermoplastics do not always yield the desired properties: thermosetting moulding grades offer advantages in thermal durability and chemical resistance in comparison to thermoplastic resins. Processing smallest quantities of polymeric material for applications in micro system technology require high process accuracies, e.g. in the volume of plasticised material and injection dynamics. Alternative machine concepts especially designed for micro injection moulding meet these requirements by means of special constructive setups mostly by using a plunger for injection. An appropriate micro injection moulding machine prototype is available at IKV Aachen. A new design of the plasticising and injection unit specially designed for thermosetting moulding materials is presented in this paper.>/p> Keywords: micro injection moulding machine, plasticising, thermosetting materials, machine concept |
| PID364065 |
Laser Transmission Welding of Transparent Plastics Parts in Micro TechnologyE. Haberstroh, W.-M. HoffmannInstitute of Plastics Processing (IKV), RWTH Aachen University, 52056 Aachen, Germany AbstractMost welding processes for plastics do not meet the special demands of micro technology. Laser transmission welding, however, features distinctive advantages like low mechanical and thermal load of the joining parts. Hence it is particularly suitable for the welding of micro plastics parts. Certain optical properties of the components to be welded are needed though. While one of the welding parts has to exhibit a high transmittance in the range of the laser wavelength the absorptance of the other one has to be high enough to ensure a sufficient absorption of the laser radiation to plasticise the material. Here, carbon black has almost exclusively gained industrial importance, since it is an inexpensive material with good absorbing properties. However, it leads to a black coloration which is not always acceptable. Recently, there are special pigmentations which allow for a non black colour in the visible range of light, but nevertheless absorb laser radiation. Up to know, only few is known about their welding characteristics, so that it has to be investigated whether they are suitable for the application in micro technology. Keywords: laser transmission welding, pigments, weld seam width, weld seam morphology |
| PID365372 |
Different Influences on the ECF ProcessK. Hofmann(a), H. Kück(a)(b) H. Ruoffc, L. Staemmler(b)a: Institute of Micro- and Precision Engineering (IZFM), University of Stuttgart, 70569 Stuttgart, Germany b: Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT), 70569 Stuttgart, Germany c: Institute for Materials Testing, Materials Science and Strength of Materials (IMWF), 70569 Stuttgart, Germany AbstractElectrochemical milling with ultra short voltage pulses (ECF) is an innovative technique to machine electrochemically active materials at micrometer feature size, especially very hard materials like steel. The movement of the tool is similar to conventional milling, although it does not rotate. Therefore 3D-forming of the workpiece is possible. The surface of the workpiece is etched by a galvanic current. Due to this neither mechanical forces nor thermal loads are applied to workpiece or tool. The ability to manufacture hard materials like stainless steel at micrometer feature size makes ECF the ideal technique for processing micro moulds. When manufacturing moulds large differences in machining speed and quality of the surface occur. So far possible explanations for this were supposed differences between the machinability of grain boundaries and interior of the grains. But experiments showed no significant influence. Furthermore the dependence of the tool diameter on the working distance was determined. Experiments showed a decreasing working distance with increasing tool diameter. This phenomenon could also be explained theoretically. Finally the influence of the grade of hardness on the ECF process is investigated at the tool steel M 340. Keywords: ECF, working distance, grade of hardness, grain boundary |
| PID365431 |
Multi-Component Micro Injection Moulding – Trends and DevelopmentsV. Piotter(a), G. Finnah(b), J. Prokop(a), R. Ruprecht(a), J. Hausselt(a)a: Forschungszentrum Karlsruhe, Institute for Materials Research III, P.O. Box 3640, 76021 Karlsruhe, Germany b: Robert Bosch GmbH, Waiblingen, Germany AbstractWith standard micro injection molding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially the approaches on multi-component micro injection moulding have to be mentioned: As handling and assembly are difficult procedures especially in micro technology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or, in principal, ceramic) micro components is the combination of insert injection molding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only, so that defect-free metal micro components can be achieved. As a further variant of micro injection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic micro components. Combined with multi-component technology, an interesting new approach for micro manufacturing is obtained, i.e. the realization of magnetic/nonmagnetic or conductive/non-conductive material combinations by two-component MicroPIM. Keywords: micro injection moulding, two-component injection moulding, powder injection moulding, electroplating, galvanoforming |
| PID366652 | Fabrication of Highly Precise Fiber Optical Array Products by use of Laser Based Micro AlignmentM. Zimmermann, L. Schaefer, M. Rank, M. Schmidt, S. RothBayerisches Laserzentrum gGmbH, Konrad-Zuse-Str. 2-6, 91052 Erlangen, Germany AbstractThe proceeding integration and miniaturization of mechanical and optical functions in systems for optical communication, for sensor and environmental technologies or for life sciences require an improvement and a customization of the manufacturing technologies. For fiber optical systems and components, especially for singlemode applications, adequate methods for a precise adjustment are necessary which allow a fast and cost-efficient alignment of fibers and other optical components like microlenses or laserdiodes. The demands on the adjustment process rise additionally for array applications. Laser based micro alignment is a promising technology for such critical adjustment tasks. We investigated the use of this technology for the alignment of fibers within fiber arrays. They are used for the assembly of fiber collimator arrays. We developed and analysed suitable actuator geometries for this application. In this paper we show some important results of the FEM based analyses to demonstrate the influence of the laser irradiation regime. First experimental results confirm the actuator behaviour calculated in the FEM analysis. Based on the simulations and experimental results, we are developing a compact alignment module which is adapted to the demands on the assembly process of fiber optical components. This alignment tool is one module within a complete miniaturised, scaleable and modular assembly line for the production of fiber collimator arrays. Keywords: laser based micro alignment, fiber collimator array, assembly platform |
| PID366848 |
Application of EDM to the Production of Micro ToolingA. Herrero(a), J. Esmoris(a), S. Azcarate(a), S. Geissdoerfer(b), U. Engel(b)a: Department of Micro & Nano Technologies, Tekniker, Avda. Otaola 20, 20600 Eibar, Spain b: Universität Erlangen-Nürnberg, Egerlandstrasse 11, 91058 Erlangen, Germany AbstractThe mass production of micro and meso scale products made of polymers or metals is intimately related to the production of high quality microtooling in stable materials capable to provide an accurate and repetitive performance throughout the whole demanded production. As it is widely known, the WEDM process provides high accuracy but is conceptually limited to the production of ruled features. The SEDM process can be a complement to this aspect but the electrodes must be manufactured by other technologies like WEDM, micromilling, turning, etc. Given the importance of several parameters like dimensional accuracy, tooling material for the different replication processes or tooling production technology, the present paper introduces some tests performed by the 4M Metals Workgroup. The analysis of some components manufactured by members of the group is presented discussing the influence of the EDM process on the machined tooling components and the consequent influence on the replication process. Keywords: tooling, micro-punching, micro-EDM |
| PID366898 |
Rapid Prototyping of 3D Micro- Nanostructures to Explore Cell BehaviourH. Schuck, F. Bauerfeld, D. Sauer, R. Le Harzic, T. Velten, I. Riemann, K. KönigAbstractWe report on the rapid prototyping of 3D microstructures with nano structured surfaces in common photoresists for investigating cell behavior on surfaces and in complex 3D containers (structures). Not amplified femtosecond laser pulses (760 nm) were coupled into a laser scanning microscope with high numerical aperture objectives to generate a two photon effect inside the focus volume. By the use of this effect a polymerization was produced inside the photoresist and 3D structures like tubes and hollow cubes with round inlets down to the submicron range were generated. The surfaces of those bodies were structured with ripples, to test the influence on cell (Chinese hamster ovary (CHO)) adhesion, morphology and alignment compared to unmodified polymer surfaces. The described manufacturing process is a powerful tool to rapidly investigate the influence on different cells in a systematic way by varying the desired geometries and the structured surfaces down to the submicron range. Keywords: two photon, multi photon, 3D structuring, polymerization, photoresist, resin, rapid prototyping, cell a lignment, cell container |
| PID367026 |
A Novel Approach for Batch Production of Micro Holes by Micro EDMS. T. Chen(a), Y. S. Liao(b)a: Department of Mechatronic Technology, NTNU, No. 162, He-ping East Rd., Sec. 1, Taipei, 106, Republic of China b: Department of Mechanical Engineering, NTU, No. 1, Roosevelt Rd., Sec. 4, Taipei, 106, Republic of China AbstractThe paper proposed a novel approach of effective production of mass micro holes. A set of micro w-EDM mechanism is designed and mounted on the developed tabletop precision machine tool. The tension of micro wire is precisely controlled by magnetic force. In addition, the micro vibrations of the wire during discharging are effectively suppressed by the developed vibration suppression system. In order to fabricate the mass micro holes, the microstructure array of the high aspect ratio 10×10 micro squared electrodes with the width and the height of 21μm and 700μm, respectively for each electrode, and the spacing between two electrodes of 24μm is fabricated first by the proposed “reverse w-EDM” machining strategy. This micro electrodes array is employed directly to machine the mass micro holes on the same machine via the modified micro EDM peck drilling. By sequentially positioning the micro electrodes array after one drilling through process, the 900 same size micro through-holes array is successfully obtained on the stainless steel board of 0.1mm thickness. The results show satisfactory hole geometry, dimensional accuracy and surface roughness. More, it is verified that the mass micro holes can be fabricated efficiently by the proposed approach. Keywords: batch production, mass micro holes, micro EDM |
| PID367198 |
Investigations in Injection Moulding of Micro Structures and Microstructured SurfacesW. Michaeli, F. KlaiberInstitute of Plastics Processing, RWTH Aachen University, 52056 Aachen, Germany AbstractTelecommunication, information and medical industries have a high growth potential. A key technology for those industries is the replication of micro-structures. Precise micro-structured parts with functional surfaces can be produced economically by injection moulding. The whole process chain (thermal mould condition, moulding, demoulding, measurement and analysis) must be analysed carefully to ensure the highest precision and reliability. To enable the precise production of the above mentioned structures fundamental studies were conducted at the IKV. The studies considered on the one side several polymers (PMMA, PC, POM ) and on the other side various test structures. In addition an external inductive heating unit was analyzed and implemented into the process to heat the cavity surface efficiently. Using this technique new mould concepts could be developed with a dynamic inductive heating system to increase the moulding accuracy and reduce the formation of orientations in the moulded part drastically. The final step of the process chain comprises the measurement and analysis of the micro-structured moulded parts. To analyse the microscopic deviation between mould cavity and the surface of the moulded part, a special softwareprototype was developed. This software calculates the so called “differential surfaces” to show the influence of shrinkage and warpage on the micro structures and the macroscopic part geometry. Keywords: Injection Moulding, microstructures, dynamic heating |
| PID367274 |
Simulation of Micropart Motion under 2D Force Fields Implemented on a Cilia Microactuator ArrayP. Lazarou, N. A. AspragathosRobotics Group, Department of Mechanical Engineering and Aeronautics, University of Patras, Patras T.K. 26500, Greece AbstractMicromanipulation is a hot topic in the manufacturing of MEMS products. Alternatives to established manipulation techniques that have been proposed in the recent years include manipulation with force fields and microcilia actuator arrays. In this paper, a simulator for the positioning and alignment of microparts on a microcilia array under two dimensional force fields is presented. A description of its design and motion dynamics is given and the simulation results are presented and discussed. Keywords: MEMS, 2D manipulation, simulation, force fields, cilia microactuator array |
| PID367452 |
New Methods for Selective Metallization of 3-D Polymer MicropartsR.A. Tacken, R. de Zwart, H. Rendering, P.J. BoltTNO Science and Industry, Eindhoven, The Netherlands AbstractThe development of microdevices would be well served by integration of electronic connects into 3-D packaging. A number of technologies have been proposed in which conductive paths are created on polymer structures, e.g. by local activation of organometallic components present in plastic. But these suffer either from limited 3-D freedom, yield problems in mass production or excessive use of chemicals. Here two new and patented methods, selective etching and selective masking, for selective metallization for the production of three dimensional integrated devices are presented, which do not use precatalyzed polymers. After initial tests, a two-shot moulded three-dimensional test object with solder patches, through holes and varying track widths was used to test their selectivity and reproducibility for selected polymer combinations. The selective etching method gave for the PA4,6-PET combination excellent results with regard to the selective plating and subsequent reflow soldering. The second method, selective masking could be applied to a LCP-PPS combination, however process stability needs to be improved. Keywords: metallization, integrated electronics, two-shot moulding |
| PID367459 | High Precision Placement of Solar Cell Assemblies on Large Base Plates for Concentrator PhotovoltaicsJ. Jaus(a), A.W. Bett(a), H. Reinecke(b), E.R. Weber(a)a: Fraunhofer Institute for Solar Energy Systems ISE, Heidenhofstr. 2, 79110 Freiburg, Germany b: IMTEK, University of Freiburg, Georges-Köhler-Allee 103, 79110 Freiburg, Germany AbstractPhotovoltaic concentrator applications use an optical system to concentrate sunlight on solar cells. A high concentration factor is necessary in order to reduce the size of the solar cells and hence to lower the costs for concentrator systems. The precise handling of the small solar cells calls for a high precision micro assembly process for base plate manufacturing. In this paper, the accuracies of the equipment and the processes used for high precision assembly of module base plates are analyzed. The sensitivity of the concentrator module to lateral dislocations of the cells is investigated in order to quantify the accuracy needed for the assembly process. The manufacturing equipment was characterized with respect to repeatability and to absolute accuracy. A repeatability of ± 6 μm for the X-axis and ± 15 μm for the Y-axis has been determined. The process accuracy is better than ± 60 μm, depending strongly on the measurement methods used for calculating the position errors. Keywords: micro assembly, accuracy, concentrator photovoltaics |
| PID372774 |
An Investigation on Development of MEMS in LTCC by Embossing TechniqueD. Andrijasevic(a), W. Smetana(a), S. Zoppel(b), W. Brenner(a)a: Institute of Sensor and Actuator Systems, Vienna University of Technology, 1040 Vienna, Austria b: Forschungszentrum Mikrotechnik, Fachhochschule Vorarlberg, 6850 Dornbirn, Austria AbstractThe latest results achieved during the investigation of possibilities for producing MEMS in unfired green Low Temperature Cofired Ceramic (LTCC) by embossing technique are presented in this paper. Ceramic tapes in unfired state are subjected to compression by means of using tools specially designed and developed for this purpose. Structures obtained in this way demonstrate high repeatability and surface quality comparable with those gained by other techniques. In comparison with traditionally used laser cutting or injection moulding for ceramic processing, this technique offers better resolution and further miniaturisation, improved rigidity of small structures and possibility to profile the vertical walls in U- and V-shapes. The main focus of this paper will be on the optimisation of embossing parameters (embossing force, embossing time and temperature) in order to get repeatable and reliable results. Structures produced in this way could be successfully used in optical as well as in medical applications. Keywords: LTCC, embossing, MEMS mass production, 3D packaging. |
| PID373481 |
Layer Manufacturing as a Generic Tool for Microsystem IntegrationPer Johander(a), Sjoerd Haasl(b), Katrin Persson(b) and Urban Harrysson(c)a: IVF- Industrial Research and Development Corporation; Argongatan 30, 431 53 Mölndal, Sweden, b: IMEGO AB; Arvid Hedvalls Backe 4, 411 33 Göteborg, Sweden; c: FCubic AB; Källarlyckevägen 6, 429 35 Kullavik, Sweden AbstractNearly every microsystem application requires specific packaging solutions. In this paper we suggest a new approach to use layer manufacturing as a generic tool for microsystem integration. Three different methods to produce 3D electrical interconnects are presented. Ink jet printing is used for the ceramic layer manufacturing process, as well as for the printing of silver for circuit patterns. The technique is demonstrated for an Inertial Measurement Unit(IMU) platform. A four-sided pyramid was manufactured with layer manufacturing in ceramics and four gyroscopes were mounted on the sides of the pyramid. A demonstrator with three light diodes was also manufactured to demonstrate the possibility to produce 3D electrical interconnects in the volume of the pyramid. Keywords: Layer Manufacturing, Microsystem 3D Electrical Interconnect, Micros system packaging |
| PID375269 |
Bimaterial Actuators and Sensor with Built-in Compensation of the Ambient Temperature InterferenceJ. Matović(a), Z. Jakšić(b)a: ISAS, Technical University, 1040, Vienna, Austria b: IHTM, University of Belgrade, 11000, Belgrade, Serbia AbstractWe present a novel simple and efficient method for the full removal of the influence of ambient temperature variations to the operation of bimaterial-based MEMS actuators and sensors. The removal of the undesired interference is achieved through the very structure of the bimaterial cantilever, by reversing the order of bimaterial constituent materials at a certain length. Thus an extremely simple geometry is obtained for full self-compensation of the structures. We performed the full simulation of our devices by the finite element method. The structures require standard surface micromachining and utilize only Si-technology compatible materials like polyimides or SU-8. A simple rule for the determination of the zero-deflection condition is presented. The described compensation method enables a significantly reduced bimaterial device area and a much higher packaging density in element arrays, as well as an improved signal-to-noise ratio. The method is especially convenient for photodetector arrays for direct conversion of infrared radiation spatial distribution into a visible image. Keywords: MEMS, temperature sensor, thermal actuator, bimaterial cantilever |
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| PID367086 |
Impact of Liquid Lubricant on the Flattening Behaviour of Single AsperitiesS. Weidel, U.Engel AbstractScaled friction tests show that in micro forming applications friction is increasing significantly when forming processes are scaled down. This phenomenon can be explained by the model of open and closed lubricant pockets characterising the surface topography: the forming load is transmitted from the tool to a lubricated workpiece by three different bearing ratios. These are the real contact area (RCA) as well as open (OLP) and closed lubricant pockets (CLP). The developing hydrostatic pressure which is built up in CLPs takes a part of the external forming load, thus reducing the normal pressure on the asperities leading to a decrease in friction. With miniaturisation in micro forming applications, the ratio of CLPs is reduced drastically as the surface topographies are mainly invariant to scaling. Thus, the forming load is mainly transmitted by the remaining RCA leading to an increase in friction. Hence, the interface between tool and RCA has to be investigated in more detail for the characterisation of the tribological conditions in microforming. In contrast to the macroscopic approach, where the RCA is assumed is assumed to be flattened completely, in microforming submicron effects within the RCA have to be considered. In order to investigate the contact state in the RCA a novel, high-resolution experimental set-up has been developed which enables the measurement of the force-displacement characteristics during flattening the surface topography, and Simultaneously, the in-situ observation of the developing real contact area by using a translucent tool. Thus, the deformation behaviour of idealised asperities represented by pyramids with a base area of 120 x120 μm2 and a height of 32 μm can be examined. In-process measurement is complemented by post-process topography analysis. The present paper will present recent results and experiences obtained by the investigations described above. The detailed knowledge about the evolution of surface topography is relevant in particular to microforming but also for an improved understanding of tribological phenomena in general. Keywords: microforming, tribology, surface characterisation, asperities |
| PID363765 |
A New Method for Directly Determining the Adhesive Strength of Conductors on Microstructured MIDH. Willeck(a), W. Eberhardt(a), H. Kück(b) AbstractThrough miniaturisation and 3D capability moulded interconnect devices (MID) offer great opportunities for various applications in a broad industrial field. Especially, when applying the laser-direct-structuring process of the company LPKF (LPKF-LDS® process) fine conductors can be fabricated on thermoplastic substrates. A main criterion for the industrial application is the adhesive strength of the conductors. As for LDS MID there is currently no suitable test method for directly determining the adhesive strength of conductors. Therefore, a measuring device consisting of a sensor and peel off unit has been developed at HSG-IMAT. It has been used to investigate a measuring principle utilising a peel off chisel for adhesion determination. Promising and repeatable results have been obtained by testing conductors on thermoplastic substrates. Keywords: adhesive strength, conductor, MID, LDS, quality control |
| PID367203 |
Non-Destructive Characterization of Multilayer Structures by Low-Coherence InterferometryZ.V. Djinovic(a)(b), L. Manojlovic(b), M.C. Tomic(c) AbstractWe present here a non-destructive technique for characterization of multilayer structures based on low-coherence interferometry. This technique is capable to give information of physical thickness and index of refraction of the subjected sample regardless of how many different layers exist along the optical trip. The main limitation is if the investigated materials are transparent for the used optical wavelength. We performed sensing set up in the form of single-mode fiber-optic Michelson interferometer composed of one 2×2 optical coupler. There were tested three and five layers foils composed of sandwich structure made by alternation of polyarilate (PAR) and glue layer. We achieved a success discriminate the interface between the two different materials with accuracy of about 40 nm by analyzing low-coherence interferograms. Keywords: thickness measurement, index of refraction measurement, interferometry, fiber optic sensor |
| PID367419 |
Critical Analysis of an Existing Calibration Procedure Built in a White Light Interferometer Microscope and Proposal of an Alternative Spline-Based ApproachC. Ferri, E. Brousseau AbstractThis paper presents a spline-based calibration method in order to overcome the limitations observed in the built – in calibration procedure of a commercial white light interferometer microscope. Quantitative experimental evidence highlighted the presence of inconsistencies of this built-in procedure with the international standard about the linear calibration method. A bias in the measurement results was shown experimentally. The proposed spline-based approach was implemented with reference materials of nominal heights ranging from 182 to 218 μm. The state of control of the measuring process during a calibration and between calibrations was also monitored using purpose developed control chart designs. Keywords: White light interferometry, calibration, regression analysis, control charts |
| PID392662 |
On the Development of a Universal and Flexible Coordinate Metrology for Micro and Nano Components ProductionB. Navarro(a), T. Ventura(b), E. Trapet(c), O. Lazaro(a) AbstractMetrology is required at any stage of development and production. For conventional industries (e.g. automotive), classical coordinate measuring machines (CMMs) allow to deliver flexible off-the-shelf solutions for most R&D and process control problems. To inspect a new component only requires measurement program changes, no different equipment. As a result of this project, this highly flexible “CMM approach” shall be applicable to the micro- and nanocomponents’ world too, relieving production planners from the burden to find suitable measurement systems for each new component and for each stage of its production. This paper presents the main challenges and specifications regarding the development of such machines as part of an integrated research effort. |
| Paper ID | Abstract |
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| PID360235 |
Non-Fouling Thin Polymeric Films Synthesized by PECVDL. Béal(a), S. Martin(a), J. Gavillet(a), M.-C. Beckers(b) AbstractPolymeric films have been synthesized by a conventional PECVD technique at low temperature on COC substrates. Depending on the precursors chemistry and process conditions non-fouling property has been obtained which was correlated to chemical bonds similar to PEO/PEG bonds. The deposition process doesn’t involve any fragmentation of usual PEO/PEG precursors as mentioned in the literature but the direct synthesis of functional bonds by chemical reaction from elementary molecules which are eventually linked to a resistant and homogeneous teflon-like backbone. Unlike PEO/PEG solutions the films can also be tuned in surface energy hence offering hydrophobic or hydrophilic characters depending on process conditions. This latter property is especially interesting when integrating such materials in fluidicssystems where a range of surface energies can be required. Finally structuration of the films combined with materials proper surface energy can further widen the wetting window for fluid flow management in bio-systems or other fluidic systems. Keywords: polymer films, plasma deposition, PECVD, non-fouling, PEO, PEG, fluidic |
| PID363713 |
Plasmons in Nanospherical Metallic Systems: RPA DescriptionL. Jacak(a), J. Krasnyj(b), M. Krzyżosiak(a) AbstractSystem of metallic spherical nanocrystals is considered within the random phase approximation (RPA). The bulk plasmon spectrum and the dielectric permeability are found and discussed. Interaction with the electromagnetic radiationis studied. The refractive index and the attenuation index are found. Keywords: spherical nanocrystals, random phase approximation, plasmons, dielectric permeability |
| PID367068 |
DLC Based BioMEMS Probe for Electrical Activity Recording of Tissues and CellsC. Moldovan(a), R. Iosub(a), C.P. Lungu(b), A.M. Lungu(b), B. Firtat(a), C. Roman(a), R. Albulescu(c AbstractAn implantable probe for electrical activity monitoring of living tissues was engineered and fabricated on a silicon chip at IMT-Bucharest, Romania. In order to improve the mechanical resistance and biocompatibility of the device, the technology of Thermionic Vacuum Arc (TVA) deposition was used for coating the implantable parts with diamond like carbon (DLC) with zero stress (0SC). The paper presents the design and manufacturing steps of an DLC based 8-channel microprobe for recording the electrical activity of neural cells and tissues. The specific fabrication processes of the integrated microprobe are presented. The microprobe was packaged using gold wire bonding, in order to allow the electrical signals reading and processing. The electronics implemented on the board accomplish the separation and reduction of the biological noise recording. The microprobe functionality was tested in vivo and in vitro, in specialized laboratories, by recording electrical signals from cells cultures and mice organs. Biocompatibility tests were performed on implantable microprobes, coated with DLC/0SC, introduced in cells cultures. The integrated microprobe for monitoring tissues electrical activity can be used in laboratories and research centres acting in the biomedical field, which study the cells growth and their response to physico-chemical stimuli, in hospitals and treatment centres for people suffering from neurological diseases. Keywords: microprobe, diamond like carbon, design, micromachining |
| PID367142 |
Micro Milling of High Aspect Ratio Micro Structures in CeramicsTh. Gietzelt(a), L. Eichhorn(a), J. Binder(b) AbstractMicromachining is a very flexible and universal technique, compared to EDM (electrical discharge machining) or ECM (electrochemical machining). There are nearly no limitations in design. Also 3D-structures can be easily machined. The material removal rate is high and surface roughness in the submicron range can be obtained. With micromilling in contrast to EDM not only electrically conductive materials but a wide range of materials like polymers, metals and alloys as well as some sorts of ceramics can be microstructured. Manufacturing of microstructures made of several kinds of ceramics with different processing routes exhibiting specific advantages and disadvantages are discussed in this paper. Keywords: micromilling, microcutting, micro slotting, micro structure, ceramics, ceramic materials |
| PID367178 |
Rapid Hybrid Tooling Based on CNC- and μEDM-Milling to Fabricate Lab-on-a-Chip SystemsR. Jurischka(a), A. Schoth(a), C. Müller(a), C. Baggi(b), R. Gallera(b), H. Reinecke(a) AbstractMicrofluidic devices are becoming more and more important in life science, chemical analytic, and medical areas. For these applications disposable and low cost articles are highly convenient. Polymers are ideally suited for these applications due to their material properties and their applicability for high volume production with high accuracy. In this study, we combine the CNC-milling technology with a optimized μEDM-milling process to fabricate mould inserts made from steel, including micro and macro fluidic structures. The microfluidic structures have channel dimensions down to 18μm, aspect ratios of up to 4 and a surface roughness Ra < 70 nm. Additionally, demoulding drafts of 2-6 degrees have been achieved, resulting in low demoulding forces. These tools were characterized and polymer parts were reproduced by injection moulding. The main advantage of the combination of CNC- and μEDMmilling technology is the rapid and direct structuring of tool steel for mould inserts with a 3D geometry and a long tool life time. These tools are used as mould inserts for injection moulding, enabling flexible prototyping as well as the high volume replication of polymers. Keywords: micro replication, injection moulding, microfluidic structure, EDM, milling, steel, polymer |
| PID367385 |
Phase Transition in Nanocomposites LixCuySnz as Anode Material in Recharcheable Lithium BatteriesM. Mladenov(a), P. Zlatilova(a), D. Kovacheva(b), K. Belov(c), I. Dragieva(a) AbstractThis investigation summarizes work on preparing of CuySnz alloys in the micron-size particle range and its changes as electrochemical active material in Li-ion cells. The nanoparticles were obtained by low-temperature synthesis from corresponding metal salts using boron hydride as a reducing agent. By means of microprobe analyses the Cu:Sn atomic ratio of the obtained nanosized materials was found to vary from 1.1 to 1.57 depending on the synthesis conditions. XRD analyses were performed in order to determine the phase composition of the materials and the changes at different consecutive stages of the electrochemical lithiation process. The progressive phase transformation from hexagonal phase Cu6Sn5 (hcp type) into the cubic face-centered structure (fcc type) of the Li2CuSn and further to lithium rich amorphous phase of type Li4.4-xSn and Cu was observed. The mechanism of the lithiation process and electrochemical anode performances was discussed. In the cycling setup a novel data collection and experiment control methods are tested which utilize contextual information connected with the experiment. Keywords: lithium battery, nanomaterials, Cu-Sn nanocomposites, low-temperature synthesis, lithiation process, XRD method, cycling performances, data collection, experiment control method |
| PID367501 |
Micro-EDM of UFG AluminiumA. Rosochowski(a), L. Olejnik(b), S. Roginski(c), M. Richert(d) AbstractCompared to coarse grained metals, microforming or micro-milling of ultrafine grained metals leads to better consistency and improved surface finish of micro-parts. This paper investigates whether micro-EDM can also benefit from using ultrafine grained metals. Two aluminium materials, Al 5083 and Al 1070, have been nanostructured by severe plastic deformation with the resulting average grain size of 0.2 μm and 0.5 μm respectively. Compared to coarse grained aluminium, micro-EDM of ultrafine grained materials resulted in a 14% reduction of surface roughness for 0.2 μm grains and 6% reduction for 0.5 μm grains. Since these results have been obtained for only one set of micro-EDM parameters, further tests are required to find the optimum combination of these parameters. Keywords: micro-EDM, UFG metals, severe plastic deformation |
| PID368079 |
KMPR Photoresist for Fabrication of Thick MicrostructuresChen-Han Lee, Kyle Jiang AbstractPresented in this paper is an investigation on using KMPR, a new negative tone photoresist, to build thick micromoulds for electroforming. Compared with SU-8 photoresist, KMPR has the advantage to be removed after electroforming metallic microcomponents. Detailed process of KMPR mould fabrication and stripping is presented and nickel electroforming has been performed using the KMPR moulds. The results are compared with SU-8 moulds and the strip-ability of KMPR is clearly demonstrated. Keywords: KMPR, SU-8, micromoulding, thick photoresist, high aspect ratio |
| PID372060 |
Synthesis and Characterization of Cobalt Nanoparticles, Nanowires and their CompositesI. Markova – Deneva(a), K. Alexandrova, I. Dragieva AbstractCobalt (Co) nanoparticles and nanowires were synthesized at room temperature and atmospheric pressure by chemical reduction in aqueous solutions of Co salts with NaBH4. Two types of reactors were used ensuring various hydrodynamic conditions of mixing for both solutions (CoSO4.7H2O solution and NaBH4 solution). Co nanoparticles in amorphous state were synthesized using an ideal mixing conditions reactor Keywords: chemical reduction with NaNH4, Co nanoparticles, Co nanowires, supports, AlN nanocomposites, BET method, IR spectroscopy, SEM. |
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| PID366957 |
Metallographic Investigation and Solidification-Structure Modelling of Al Micro CastingsJ-F. Charmeux, R. Minev, S. Dimov, E. Minev AbstractProducing micro-castings trough vacuum investment casting is known to be associated with high cooling rates due to small scale of the castings. High cooling rates together with alloy composition might be the main factors affecting the final metallographic structure of castings’ alloys during the solidification process. When using Al-Si-Mg casting alloys, the size of the dendritic structure can be used for a non-destructive test to assess the mechanical properties and overall quality of the castings. Also the ability of the alloys to be structured by different mechanical and energy assisted processes is highly dependant on their metallographic structure. This paper investigates the structural changes occurring when shifting from conventional size castings to micro-castings. An empirical model describing the degree of dendrite cell refinement as a function of micro-castings aspect ratio is proposed. Additionally, the paper reports the changes in porosity and Si particles morphology observed on micro-castings produced with different flask temperatures. MHV measurements were also performed for different aspect ratio of the cast micro-features. Keywords: micro-casting, dendrite cell refinement, investment casting. |
| PID367152 |
An Approach for Predicting the Correct Geometry and Parameters of the Sprue System of an Optical Disc Mould by use a Computer Aided Design and SimulationD. S. Trifonov(a), Y.E. Toshev(b) Abstract3D CAD models of different variants of the sprue system design of an experimental optical disc mould are developed. The main purpose of the present work is to be predicted the correct geometry shape and parameters of the sprue system before these elements to be produced. The 3D CAD models are built as a combination of the polymer substrate and the sprue system, considered as one object. This approach allows achieving a precise design of the sprue system, before to import the 3D CAD model in the computer simulation program. Different variants of the sprue system design are defined and three parameters are chosen as variables: the gate length and depth and the sprue draft. By means of iterative steps in the frame of the mould filling simulation software, correct variants of the gate geometry and parameters and the processing conditions are achieved. The best results are obtained using the new proposed sprue system with symmetrical melt distribution area. Keywords: optical disc substrates, computer simulation, optical disc mould, 3D CAD model |
| PID367200 |
Demouldability of Microstructures in Polymer MouldingA De Grave, T. Eriksson, H.N. Hansen AbstractDemoulding micro structured surfaces and micro parts is an important issue in replication of micro technology based components. In this paper a state of the art on ways to improve demoulding of microstructured parts both in polymer moudling and metal injection moulding is presented. The approach is described and simulation methods are shown in relation to previously existing studies. The approach chosen is the investigation of the influence of the demoulding angle on the demouldability of polymer mouldings. The design is based on a number of micro sized cones with different slope angle placed on a flat metal surface. A mould design is proposed and simulated. The design is based on a number of micro sized cones with different slope angle placed on a flat metal surface. A method for characterization of the mould using Laser Scanning Confocal Microscopy (LSCM) and Atomic Force Microscopy (AFM) to verify the slope angle and the straightness quality of the slope is discussed. Initial mould filling simulations using a 2½ D mesh show that a real 3D simulation were performed. Keywords: demoulding of microstructures, polymer moulding, multi-scale simulation |
| PID367265 |
Numerical Simulation of the Compression Flow of a Polymer Disk for Modelling Hot Embossing ProcessesM. Sahli(a)(b)(c), C. Roques-Carmes(a), J.C. Gelin(b) and C. Khan Malek(c) AbstractThe modelling of the hot embossing process requires accurate determination of the polymer flows. In this work, we propose to use numerical models to describe the flow of a polymer disk in compression deformed at a constant temperature under a constant load in axisymmetric loading conditions. In the simulation, the polymers exhibit viscoelastic or viscoplastic behaviours depending on the experimental conditions. The relative displacements of the plates lead to important modifications of the radial and transversal flows. The experimental observations associated to this modelling analysis were conducted on cyclo-olefin-polymer (COP) and cyclo-olefin-copolymer (COC) that were respectively compressed at a temperature above the glass transition temperature of each polymer (Tg+30°C). Keywords: hot embossing, numerical modelling |
| PID372816 |
Material Modelling for the Simulation of Microforming Processes at Elevated TemperatureD. D’Addona, R. Teti AbstractThe main objectives of this paper are investigations on the usability of artificial neuronal networks for the calculation of material properties at elevated temperatures in case of microforming processes. Modelling of the rheological behaviour of diverse materials subjected to hot forging is attempted through a parallel distributed processing paradigm based on artificial neural network prediction of the metal material response. The evaluation of different feed-forward back-propagation neural networks for flow stress prediction was carried out on the basis of laboratory data of the stress-strain behaviour of nickel base superalloys and mild steel subjected to compression tests with different temperature and strain rate conditions. The results obtained displayed a good agreement with the experimental data, showing that the neural network approach can accurately describe the material flow stress under the considered processing conditions. Keywords: Material modelling, High temperature, Microforming |
| PID373208 |
Nano-Scale Aspects in Studying the Kinetics of Reactions over Zeolite CatalystsK.E. Kumbilieva(a), N.V. Nekrasov(b), L.A. Petrov(a) AbstractNotwithstanding the significant interest in the performance of reactions over zeolite-type catalysts, few are the kinetic studies of these processes. The scarcity of kinetic models of reactions over this large group of catalysts is usually ascribed to the masking effect of diffusion restrictions resulting from the narrowness of the zeolite channels. In Keywords: zeolite catalysts, kinetics, nano-structure effects |
| PID373232 |
Telemanipulation Control of Mechatronic Handling Devices for Micro/Nano OperationsK. Kostadinov(a), R. Kasper(b), T. Tiankov(a), M. Al-Wahab(b), D. Gotseva(a)(c) AbstractThe telemanipulation control approach is very wide used in the domain of micro/nano manipulation where it is necessary to realize complex handling tasks in very small spaces unnatural for humans. Visual, tactile, position or force feedbacks are used assisting the operator to see, sense and control the manipulation process. Without any of these feedbacks it is very difficult to work into the unknown micro/nano world. It is possible to create virtual working environment using the impedance parameters spring, damping and inertia to percept the human about its dynamics. For the improvement of the operator skills for handling the micro/nano operations an impedance scaling approach is used here. In this paper the development of a telemanipulation approach for mechatronic handling devices for micro/nano operations with three degrees of freedom (DoF) is presented. A virtual environment is created and it is sensed to the operator using spring and damping virtual force effects. The effectiveness of the teleoperation control was investigated experimentally upon the 3 degree of freedom robot for scanning operation and mechatronic handling device for biological investigations using inverted microscope and digital cameras Hitachi F110 and ISG-LW-5-C-1394. Keywords: telemanipulation control, impedance scaling, micro/nano handling operations. |
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| PID353570 |
Electro-Chemical Polishing: a Technique for Surface Improvements after Laser MillingT Dobrev, D T Pham and S S Dimov AbstractElectro-chemical polishing is a process of improving micro smoothness, micro topology, and material brightness by anodic dissolving of the substrate in an electrolyte with an external source of electricity. The resulting surface improvements depend on the uniformity of the material microstructure, the lack of surface inclusions, and the consistency of the surface finish all over the target area. In contrast, laser milled structures are mostly concave features; their roughness is usually higher than that achieved on the other surfaces of the component, and also there is a significant presence of foreign or recast particles on them. Thus, it is important to investigate systematically the effects of electro-chemical polishing on microstructures machined by laser milling. The paper discusses the effects of electro-chemical polishing on the surface finish of laser milled features. Although ECP displayed some limitations when polishing micro features, it still managed to achieve almost 30% improvements in omparison to the initial roughness after laser milling. Another benefit is that the process also improves the edge quality of the laser machined structures by removing the burrs. Keywords: electro-chemical polishing, laser milling, surface quality |
| PID360696 |
Water Jet Machined Thin Sheet Metal Electrodes for Micro Die-Sinking EDMO. Blatnik, J. Valentinčič, D. Kramar, B. Juriševič, H. Orbanić, A. Lebar and M. Junkar AbstractMicroproduction is one of the fastest growing fields of industry with increasing demands from the market. A key factor in microproduction is micro-tooling. There exist various micro-tooling techniques, such as LIGA, electroplating, etc., which are very accurate but on the other hand also very expensive and time consuming. This contribution presents an alternative, which cannot compete with the above-mentioned technologies regarding the accuracy, but is time efficient and far more cost effective. The proposed micro-tooling strategy consists of producing the electrode for Micro Sinking Electrical Discharge Machining (MEDM) using Water Jet (WJ) technology. The final tool is produced by MEDM to be used for replication processes like hot embossing, molding, and others. Results obtained during this investigation indicate the appropriateness of the proposed micro-tooling strategy for the development and design of microfluidic devices, due to the specific characteristics of the involved technologies. Keywords: Micro-tooling, Water Jet Machining, Micro Sinking Electrical Discharge Machining, EDM, microfluidics |
| PID365303 |
High Power DPSS Laser Micro-Machining of Stainless Steel and Silicon for Device SingulationD. Karnakis, G. Rutterford, M. R. H. Knowles AbstractWe describe high power diode-pumped solid-state (DPSS) laser micro-machining results of commonly used industrial materials such as stainless steel and silicon. Frequency up-converted lasers were used at 532nm and 355nm. We discuss the benefits of high laser intensity (~ GW/cm2) micro-machining for efficient laser microfabrication. At such high irradiance conditions material properties are approaching their critical limits and ablation mechanisms are complex. These can be exploited to our advantage in particular for micro-drilling and micro-cutting small feature sizes in the order 10-20 μm and high aspect ratios of up to 20:1. Etch rate data are presented and a comparative study of the ablation efficiency in these materials is discussed. Results of single shot and multiple shot ablation are also presented. The potential applications of this technology to device singulation for electronic and power generation devices will be described. Keywords: laser, micro-machining, steel, silicon, ablation |
| PID365552 |
Filling Analysis in Micro Injection Moulding using Weld Lines as Flow MarkersG. Tosello(a), A. Gava(b), H. N. Hansen(a), G. Lucchetta(b), M. Guarise(a) AbstractMicro injection moulding is one of the most used processes for the mass replication of polymer-based micro components. To enable its mass fabrication capability, an optimization of the process and a full understanding of the filling of the micro cavity are fundamental requirements to be fulfilled. In this paper, a novel approach based on the use of weld lines as flow markers able to trace the development of the flow front during the filling is proposed. The effects on the filling stage of process parameters such as temperature of the melt, temperature of the mould, injection speed, and packing pressure have been investigated. An optical coordinate measuring machine has been employed for the scope. The micro cavity, which presents micro features ranging from 600 μm down to 150 μm, has been manufactured by micro electrode discharge machining. A commercially available polystyrene grade polymer has been moulded using a high-speed injection moulding machine. Results show that the temperature of the mould and the injection speed are the most influencing process parameters during the injection moulding of a micro component. Keywords: Micro injection moulding, process parameter analysis, weld lines |
| PID367044 |
Short Pulse Laser Milling effects on Surface IntegrityP V Petkov, S S Dimov, R. Minev and D T Pham AbstractLaser milling of engineering materials is a viable alternative to conventional methods for machining complex micro components. The laser source employed to perform such micro structuring has a direct impact on achievable surface integrity. At the same time, the trade offs between high removal rates and the resulting surface integrity should be taken into account when selecting the most appropriate ablation regime for performing laser milling. In this paper the effects of pulse duration on surface quality and material microstructure are investigated when ablating a material commonly used for manufacturing micro tooling inserts. When performing ultra short pulsed laser ablation some heat is dissipated into the bulk but not sufficient to trigger significant structural changes. Keywords: Laser micro machining, Micro machining and Laser pulse duration |
| PID367110 |
Process Capabilities of Micro-EDM and its ApplicationsK. Liu, E. Ferraris, J. Peirs, B. Lauwers, D. Reynaerts AbstractThe Micro Electrical Discharge Machining (Micro-EDM) process has proved to be an appropriate nonconventional machining method for manufacturing accurate and complex three-dimensional structural microfeatures which are difficult to be produced by conventional processes. However, the miniaturisation of the EDM process requests special requirements on the machining equipments. Pulse generators, which can produce small input energy pulses, and high precision systems are the two major criterions. In this paper, newly developed advanced technologies regarding to these aspects are explored with the aid of a commercial micro-EDM machine. First of all, by examining the pulses, innovative strategies implemented in the pulse generator are studied. Indepth research also reveals the correlation between the discharge pulses and the machine parameters in order to provide an indicative overview of process capability. Secondly, precision machining, which is represented by producing a three-dimensional micro-structure such as a micro-compressor, is demonstrated. Accordingly, by examining the machining geometry and surface integrity, process characteristics of micro-EDM are discussed. Keywords: Micro-scale Manufacturing; Electrical Discharge Machining; micro-EDM; 3D EDM milling |
| PID367165 |
Investigations on Reel-to-Reel Hot EmbossingT. Velten, H. Schuck, W. Haberer, F. Bauerfeld AbstractReel to reel processes like rotary hot embossing allow micro patterning of flexible foil based polymer substrates. Such technologies have the potential to be the basis for extremely cheap micro products. This is due to the low price for poolymer foils as well as to the high throughput of reel-to-reel processes. An application field which could benefit of Keywords: hot embossing, reel-to-reel process, microfluidics, foil substrate |
| PID367195 |
Life Cycle Assessment of Micro Manufacturing Process Chains - Application to the Microfactory ConceptA. De Grave, S.I. Olsen, H.N. Hansen AbstractHistorically LCA has mainly been applied to products; however, it can be very useful in assisting the whole product development by identifying more sustainable options in process selection, design and optimisation. It has been shown that it is relevant to apply LCA to micro components and more specifically to the research area of micro manufacturing where both processes and products are stated to be environmentally friendlier because of their small size. It is assumed that environmental impacts can be reduced by reducing the size of the factory using the concept of microfactories. In this paper, first the typology of data used for performing an LCA is investigated in the context of micro technology, then an example of a micro injection moulding insert is given. The concept of microfactories is then addressed with and environmental impact paradigm. Keywords: Life-Cycle Assessment, Environmental impact, Microfactory |
| PID367252 |
Microinjection Moulding of Thermoplastic Polymers: From Theory to ExperimentJ. Giboz(a)(b), T. Copponnex(b), P. Mélé(a) AbstractMicroinjection moulding (μIM) appears to be one of the most efficient processes for large-scale production of thermoplastic polymer microparts. The microinjection moulding process is not just a scaling down of the conventional injection process; it often requires a rethinking of each parts of the process. Polymer is subject to extreme processing conditions. This paper proposes to analyze the influence of the conditions of microinjection moulding (μIM) on the microstructure of a high density polyethylene (HDPE). A process study was first performed to verify the machine stability and to determine the influence of the main processing parameters. The polymer structure and the properties of microparts were then analyzed and compared to those of a macroscopic part. Several methods were used to reveal the possible changes induced by the reduction of parts, such as Differential Scanning Calorimetry (DSC), Thermogravimetric analysis (TGA) and Fourier Transformed Infra Red (FTIR) spectroscopy. Surprising effects have been observed, such as an irreversible modification of the polymer structure. Keywords: Microinjection, Microstructure, Polyethylene, Process, Physico-chemical Characterizations |
| PID367260 |
Analysis of Micro-Structuring Polymer Replication by Micro-Injection Moulding and Hot EmbossingM. Sahli(a)(b)(c), C. Millot(a), C. Roques-Carmes(a), C. Khan Malek(b), J.C. Gelin(c) and T. Barriere(c) AbstractThis paper focuses on the comparison between two manufacturing techniques to realize micro-structural replications on a polymer substrate. The micro-technologies that are considered consist in replication through micro-injection moulding on one hand, and in replication through hot embossing in the other hand. The same mould with microstructured cavities produced by high-speed milling or indentation was used for both replication methods. The replication process parameters are analyzed in both cases, and the resulting polymeric shapes and surface states are characterized in using 3D scanning mechanical microscopy. It is shown that both replication processes give accurate results if the processing cycle as well as pressure and temperature are well adapted. This provides a comparative study between both processes and the validity domain of each one. Keywords: hot embossing, micro-injection molding, polypropylene, scanning mechanical microscopy (SMM) |
| PID367266 |
Influence of Microstructure on the Mechanical Properties and the Forming Behaviour of Very Thin Metal FoilsA. Diehl, U. Engel, M. Geiger AbstractThe demand for accurate process design of microforming processes is increasing steadily due to ongoing miniaturisation. Occurring size effects, however, prevent the transfer of existing know-how of standard sheet forming processes with conventional dimensions like blanking, bending and deep drawing on microforming processes. These size effects are either generally valid for all microforming processes, as the influence of the share of surface grains or are process specific like the influence of large strain gradients as they appear e.g. in bending processes. A decisive parameter for the occurrence of size effects is the ratio of material mean grain size to foil thickness. For a simulation based description of microforming processes the implementation of size dependent material behaviour in FEsimulation is essential. Hence a reliable determination of size dependent mechanical properties as input data for FEsimulation is needed to provide a broad fundamental database for a future theoretical description of microforming processes. In the present paper the influence of the material microstructure on the mechanical properties of metal foils with thicknesses ranging from 25 μm to 500 μm is discussed based on tensile tests and fundamental bending experiments. Challenges resulting from the small thickness of the metal foils are pointed out and future demands regarding determination of material characteristics of thin metal foils are presented. Keywords: metal foils, mechanical properties, bending |
| PID367309 |
FIB Milling and Characterization of CrC Coatings on Tool Steel SubstrateR.M. Minev(a), M. Ilieva(b), J. Kettle(a), G. Lalev(a), S.S. Dimov(a), I. Dermendjiev(b), R. Shishkov(b) AbstractIn microtools, the base of a die should be ductile, and its working surface should be hard, having low roughness, low wettability and high erosion resistance. To ensure this diverse range of properties, nano-crystalline CrC coatings were deposited onto 12% Cr tool steel with DC magnetron sputtering in a vacuum furnace with electrical graphite heating. Subsequently, these properties were studied by application of different metallographic techniques. Corrosion resistance as studied by means of potentiodynamic anodic polarization. A STEM analysis of the structure was performed on samples repared with Focused Ion Beam (FIB) using nano-manipulator. The mechanical properties and grain size were determined and statistically analyzed. Studies using X-ray diffraction and scanning electron microscopy were also performed. Rectangular trenches were produced in the coating using FIB XB1540 Carl Zeiss SEM/FIB system to study the effects of the target ion beam current, exposure time and ion fluence on the sputtering yield and roughness of the samples profile. Some essential parameter’ windows for productive milling with speed >1 μm/min and for best surface integrity were determined during the experiments. Keywords: PVD, SEM/FIB, micro-tooling, CrC, STEM analyses |
| PID367400 |
Characterization of Pulses in Micro EDM Milling Based on Wear and Material RemovalG. Bissacco(a), J. Valentincic(b), B.D. Wiwe(a), H.N. Hansen(a) AbstractThis paper presents an investigation on wear and material removal in micro EDM milling for selected process parameters combinations typical of rough and finish machining of micro features in steel using state of the art equipment. Based on discharge counting and volume measurements, electrode wear unit and material removal unit are measured for several energy levels. The influence of the accuracy of volume measurements on the electrode wear unit and material removal unit are discussed and the issues limiting the applicability of real time wear sensing in micro EDM milling are presented. Keywords: micro EDM, wear, pulse detection |
| PID367426 |
A Soft Lithography Process for Manufacture of Alumina Micro-ComponentsZhigang Zhu, Xueyong Wei and Kyle Jiang AbstractThis paper presents a soft lithography technique to fabricate alumina microcomponents. The process uses elastomer polydimethysiloxane (PDMS) and makes the green patterns in tact after demoulding. The five steps of the soft lithography process are: (I) fabricating thick SU-8 moulds using UV photolithography; (II) producing PDMS soft mould from the SU-8 masters; (III) making aqueous high solids loading alumina suspension; (IV) filling patterned PDMS moulds with the aqueous alumina suspension; (V) demoulding and sintering. The rheological properties (Zeta potential and viscosity) of aqueous alumina suspensions was characterized in relation with varying pH values and concentration of dispersant (D-3005). The optimal parameters of the alumina suspension for the mould filling have been achieved as pH value = 11; concentration of dispersant (D-3005) = 0.05 g/ml; amount of binder (B-1000+ B-1007) = 0.75%, the highest solid loading = 70 wt.%. After pressurised mould filling, the complete, dense and freestanding microcomponents have been achieved by using 70wt.% alumina suspension and optimum fabrication technique, while the overall shrinkage is found as ca. 22%. Keywords: SU-8 moulding, microceramics, soft lithography, UTSP, alumina microcomponents |
| PID371287 |
Polymer Inserts Tooling for Prototyping of Micro Fluidic Components in Micro Injection MouldingC. A. Griffiths(a), S. Bigot(a), E. Brousseau(a), M. Worgull(b), M.Heckele(b), J. Nestler(c) and J. Auerswald(d) AbstractThe increasing number of microfluidic applications linked with a strong demand for low-cost solutions has pushed research activities towards the development of polymer based microfluidic systems. Though it is possible for advanced injection moulding machines to accurately replicate polymer micro parts, the tooling costs remain significantly high. The purpose of this paper is to investigate the feasibility of using polymer inserts for prototype tooling in micro injection moulding, thus facilitating microfluidic system design and test approval prior to mass fabrication. Keywords: micro injection moulding, hot embossing, prototyping, polymer tool, polymer insert, microfluidic |
| Paper ID | Abstract |
|---|---|
| PID360679 |
A New Concept for an Absolutely Encoded Angular ResolverV. Mayer, T. Botzelmann, K.-P. Fritz, J. Seybold, H. Kück AbstractAt HSG-IMAT a new concept for an absolutely encoded optical angular resolver has been developed. The key element of the sensor concept is a disc with a high precision solid measure which is fabricated using the well known manufacturing process for compact discs (CD-Technology). Using this process, it is possible to fabricate a high precision solid measure in high quantities and at low manufacturing costs. To detect the absolute angular position, a laser beam is focused onto the solid measure. The beam is deflected by the diffractive gratings of the solid measure, whereupon the different first orders fall onto separated elements of a photo diode array. To verify the principle of operation an experimental setup assembled under a microscope, with a CCD-chip instead of a photodiode array, was used to demonstrate the signal modulation. Based on these experiments, a small size demonstrator device was designed and assembled. The successful experimental results with this demonstrator device show the large potential of this new sensor concept for different applications. Keywords: angular resolver, rotary encoder, optical sensor, absolutely encoded, low cost, compact disc, laser |
| PID361021 |
Design and Optimization of Flat Solenoid MEMS Actuator by Selection of Proper Material PropertiesG. Todorov, K. Kamberov, and L. Dimitrov AbstractMEMS actuators are widely used in modern industry. Their main advantage is the concentration of desired mechanical characteristics in a limited space. This paper presents a design and optimization of a flat solid MEMS actuator. The optimization is based of the selection of material properties needed for the achievement of the actuator mechanical characteristics required for good performance. The main goal is to reach necessary output mechanical force with minimal side force effects. The output mechanical force is evaluated by modeling and simulation of the magnetic field and its parameters by the use of FE Analyses. In order to make proper simulations, a finite element model of the complete actuator structure is made up suggested). Another problem that has been solved in the paper is checking of actuator’s geometry and its dimensions in order to evaluate the effective use of the material. As a result of the study, the optimal output function of the mechanical force versus the stage position has been determined. This has been done on the basis of updated material specifications. The optimal design of a flat solenoid MEMS actuator is proposed. Keywords: mini actuator, magnetic field, FEA, MEMS |
| PID366368 |
Polymer Lab-on-Chip Systems with Integrated Electrochemical Pumps suitable for Large Scale FabricationJ. Nestler(a), A. Morschhauser(a), K. Hiller(a), T. Otto(b), S. Bigot(c), T. Gessner(a)(b) AbstractA low-cost, polymer based microfluidic platform is described which not only includes passive microfluidic parts, but also pumps based on an on-chip electrochemical gas generation by electrolysis. A hydrogel is used as electrolyte material, which allows a simple fabrication process by screen printing or stencil printing. Test structures were designed and fabricated to illustrate the feasibility of the approach for batch processing. Microfluidic chips including reservoirs and channel structures were fabricated by micro injection moulding and used to demonstrate the movement of liquids inside micro channels by the proposed micro pumps. Keywords: micro pump, electrolysis, hydrogel, polymer, microfluidics, lab on chip, point of care |
| PID366525 |
New Technology for Setting Up the Working Coordinate System in MicromillingK. Popov(a), S. Dimov(a), A. Ivanov(a), D. T. Pham(a), E. Gandarias(b) AbstractA major issue in micro milling is the setting up of the origins of the Machine Working Coordinate Systems (MWCS). The existing methods for carrying out this operation have an unacceptably high error along the Z axis, due to the spindle thermal enlargement, and are effective only when the machining is “relative” to other surfaces milled with one cutting tool within one operation. Therefore, more efficient technical solutions are required for setting up MWCS and to reduce further uncertainties associated with micro-milling operations. This paper describes a new cost-effective method for setting up MWCS that applies a new technical solution for detecting the contact between the cutting tool and the workpiece. A prototype system was used to validate experimentally the accuracy and repeatability of the proposed method. The results obtained showed that the sensitivity of the system is sufficient to detect accurately the contact between the cutting tool and the workpiece, and thus to set up the MWCS origins. It was concluded that by applying this method it would be possible to minimise uncertainties introduced by the spindle thermal enlargement and touch probe run-outs in setting up micro machining operations. Also, the tests undertaken showed that the prototype system is reliable and convenient for use by machine operators. Keywords: micro-milling, on-line measuring systems, tool–workpiece coordinate system setting |
| PID366538 |
Development of a Dynamic High Precision Miniature Milling MachineC. Brecher(a)(b), R. Klar(b), C. Wenzel(b) AbstractOne of the main focuses in many research fields is the miniaturisation of work pieces and components. Micro fluidic, micro mechanic, micro electronic and micro optical functional groups are integrated into smallest space to microsystems for medical, information technology or automotive purposes. Directly opposed to the miniaturisation trend of these products are the machine tools used for the production becoming bigger and bigger, with the result that the proportion between the machining space and the needed floor space is more and more inefficient. To meet the process requirements as well as the requirements of the machine users of flexible and small high performance machine tools the Fraunhofer IPT developed and designed a compact high precision milling machine. The paper describes current trends in the field of compact machine tools under special consideration of the mechanical setup and the development of a small and high precise as well as high dynamic micro milling machine. Keywords: compact machine tool, high precision, mould and die making |
| PID366726 |
Photosensor of CDSSE for Fiber Optics ApplicationsPeter Shindov(a), Nasko Elektronov(b),Valery Serbezov(c), Franz Herbst(c) AbstractThe development of new generations of laser source for fiber optic’s applications require more fast new photosensors with spectral characteristics in visible range. The idea of this work is development of technology and device – fast photosensor with spectral range adapted to modern lasers for the quickly increasing needs of optoelectronics and fiber optics communications. By pulsed laser deposition (PLD) usage UV N2 Laser for ablation λ=337.1 nm, energy per pulse 8 mJ and CW 60 W CO2 Laser for heating are produced thin CdSxSe1-x films on quartz substrate. Polycrystalline thin films with thickness from 0.5 to 2.0 μm and dominant orientation – (002) are formed by energy density 4.5 J/cm2 and repetition rate 20 Hz .The thin films are investigated by EDAX and SEM. The films are additional thermo treatment for increasing ratio photocurrent – dark current. This ratio reaches 107. By means of TEA UV N2 Laser with energy per pulse-0.3 mJ, pulse duration 2 ns are formed planar Ohm contacts from CdO directly onto thin film. The contacts are investigated by XRD. By means of coordinate table the contacts are formed on the backside of the structure. The dimension of photosensitive structure is 250x250 μm. The distance between contacts areas is 10 μm. The spectral response of devices is measured. The maximum spectral sensitive is at λ=575 nm. Lux ampere characteristics are measured. The increasable fronts and decreаsаble fronts at the structure are measured. They are 2 ns, at ratio 1000. Keywords: Fast photosensor, visible range, PLD, planar Ohm contacts, EDAX, SEM, XRD. |
| PID367117 |
Thin Film Polymer Actuators for Micro-Fluid ApplicationsA. Boersma, R. de Zwart, R. Boot, P.J. Bolt AbstractThin film actuators have been manufactured for application in small devices, such as valves and (micro)pump. These actuators are based on new materials especially suited to be used as electro-active dielectric elastomers. The properties of these elastomers are tuned to the specific requirements. It was found that the electric voltage required for operating could be lowered by a factor of three to five. The thin film actuators were processed into small valves and pumps for the manipulation of gasses and liquids. It was shown that the actuators could be operated when immersed in a liquid (e.g. water) and can be used as valves in microfluidic sensor array devices. The next step in the development is fine-tuning of the valve setting in order to minimize leakage and optimize performance and durability. Keywords: polymer, actuator, microfluidics |
| PID367251 |
Automated Patch Clamping Systems Design using Novel MaterialsR. Voicu, D. Esinenco, R. Müller, L. Eftime, C. Tibeica AbstractPatch clamping is a highly sensitive technique used to measure the electrical activity of a cell. It is presently a low throughput cumbersome method which requires highly trained and skilled operators to obtain results of value. Patch Clamping is used in applications which include drug screening where there is demand for high throughput systems (HTS). While there are a few commercially available HTS patch clamping systems on the market using traditional patch clamping materials, there are no systems on the market using novel materials, or for dealing with cell networks – a physiologically important consideration for the developing fields of tissue engineering and understanding cell to cell interactions. This paper presents a summary of traditional patch clamping, mentions some commercially available high throughput patch clamping systems based on traditional materials then, using 4M technologies, introduces some novel materials and potential design approaches and processes for producing a polymer based automated patch clamping system. Keywords: patch clamping, polymer microsystem, high throughput screening |
| PID367253 |
New Approaches for an Automised Production in Ultraprecision MachiningC. Brecher, M. Weinzierl AbstractAutomation solutions are presented which ensure determinism and reproducibility for the handling and aligning of work pieces and tools in micro- and ultra precision technologies. Automation in this context means the handling and alignment of parts and tools within the entire process chain to achieve adjustment and alignment accuracies at a level well below 0.5 μm. The exact knowledge about the position and the condition of the work piece and its tool throughout the entire process chain, is the key issue in the automated production chain. This knowledge enables the exact referencing of the work piece within the machine tool coordinate system and an offset compensation by the machine tool axes as well as by active work piece clamping devices. The automation solutions which are presented enable a cost effective, ultra high quality production technology for the achievement of nanometre form accuracies and super smooth surface finishes. These are required for ultra precise components in bio-medical-, sensor- as well as consumer goods applications and are revolutionary throughout the worlds technologies. Keywords: micro optics, ultraprecision machining, sub-micrometer referencing |
| PID367347 |
Novel Piezoresistive e-NOSE Sensor Array CellV.Stavrov(a), P.Vitanov(b), E.Tomerov(a), E.Goranova(b), G.Stavreva(a) AbstractFuture of analytical and manufacturing methods based on micro-mechanical cantilevers, depends critically on the ability to implement parallel operation and fast signal processing [1]. There are two mean reasons: high throughput requirement and complexity (multidimensionality) of analyzed value. In order to get parallel function, any single device should be simultaneously: recognizable, autonomously actuated and independently accessible for readout. Devices, fulfilling these requirements, are suffering from a substantial increase in complexity of both layout and manufacturing technology. In present paper, we demonstrate a novel design of a MEMS (Micro-Electro-Mechanical Systems) cell designed for e-NOSE applications, using results of previous works [2,3], which solves above mentioned problems. The cell consists of four integrated cantilevers, each having a separate piezoresistor. Additionally, the cantilevers are designed to be different in length and thus having different resonance frequencies. Thus, individual cantilevers are frequency recognizable/addressable. Samples of self-actuated piezoresistive cantilever sensor have been fabricated on n-type, silicon, applying combined surface and bulk micromachining techniques. The cantilever dimensions were chosen to provide approx. 1.8 kHz resonance frequency gap between neighbor individual sensors. The new micro-machined cell is suitable for chemical and biological recognition as a micro-balance. Keywords: cantilever, cantilever array, e-nose, piezo-resistive detection |
| PID373215 |
New Systematic and Time-Saving Procedure to Design Cup Grinding Wheels for the Application of Ultrasonic Assisted GrindingC. Brecher(a)(b), R. Schug(b), A. Weber(b), C. Wenzel(b) AbstractSince glass and ceramic materials have beneficial properties they gain more importance in all technical applications during the last thirty years. For example nowadays ceramics are used as artificial hip joints or as seals for highest relative speeds. Glass components are used for multitude of optical applications like cameras and reflectors. But besides a lot of advantages the processing of these materials is very difficult. Particular, this contains the manufacturing of small components like micro-reactor plates or glass wafers with hundreds of small holes, too. Using ultrasonic assisted grinding the treatment can significantly be optimised and higher removal rates can be realised. For the generation of ultrasonic waves often piezo actors are used that excite the grinding tools with vibrations of 20 kHz and amplitudes of a few microns. Using an ultrasonic wave the tool geometry is strongly restricted to guarantee the hybrid functionality. The paper describes a new way to calculate the design of tools suitable for their use in ultrasonic assisted grinding. As a machining process the manufacturing of spherical optics with cup grinding wheels is selected. Keywords: ultrasonic assisted grinding, method to design vibrating components, coupling of simulation tools |
| PID374451 |
Characterization of Parylene-C Film as an Encapsulation Material for Neural Interface DevicesJui-Mei Hsu(a), Sascha Kammer(b), Erik Jung(c), Loren Rieth(d), A. Richard Normann(e), Florian Solzbacher(a)(d)(e) AbstractNeural interfaces, devices that interact with nervous system, have been developed to help patients with neural disorders to restore lost neural function. The neural interface device requires a conformal and biocompatible encapsulation layer to protect the device during chronic implantation, and to electrically isolate individual electrodes. Parylene-C thin films deposited by a chemical vapour deposition system were studied as an encapsulation layer for neural interface devices. Leakage current tests were used to investigate the encapsulation performance of Parylene-C films, and the results showed hermetic protection as well as long-term (>100 days) stability of the films. The adhesion between Parylene-C and the silicon substrate after several thermal treatments was studied by ASTM tape adhesion tests. Results from these tests suggested that thermal stress may degrade the adhesion force. Parylene samples were subjected to accelerated lifetime testing (85 % relative humidity (RH) and 85 °C) for 20 days, and the film did not show appearance changes as observed by optical microscopy. However, X-ray diffractograms show that the film crystallinity increased during this test. Keywords: Parylene adhesion, biomedical device encapsulation, conformal coating |
| PID374620 |
On the Development of an Implantable μ-Biomechatronic System for the Rehabilitation of Lower Limb Neuro-Muscular DisabilitiesV. N. Syrimpeis(a), L.L. Chiou(a), V.C. Moulianitis(a), N.A. Aspragathos(a), E.C Panagiotopoulos(b) AbstractOne of the current trends in the rehabilitation of lower limb neuromuscular disabilities is to use fully or partially implantable systems based on Functional Electrical Stimulation (FES). In this paper, the conceptual design of a possible fully or partially implantable system with submillimiter size is presented. The system presents increased flexibility, adaptability and comfortability. Preliminary results of the proposed control system in a simulation environment are presented and discussed. Keywords: FES, biomechatronics, lower limbs |
| Price per room/per night | ||
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Please book your room via email Samokov Hotel
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Please click 4M2007 Call for papers if you wish to print a copy for your information and use. The 4M2007 Call for Papers includes information as follows
Prof. Iovka Dragieva (DSc., Dr, Chemist) is one of the leading scientists in the field of nanoscale particles production by means of chemical processes in aqua solutions and metal particles applications with more than 150 scientific articles and 29 patents.
The object of her interest is original technological processes and reactors for production of metal clusters, metal nanoparticles, ferromagnetic nanoparticles, hybrid nanoparticles as nanowires, core/shell products incl. metal clusters on carbon nanotubes. Their chemical composition could contain one, two or more elements selected from the list of 42 chemical elements.
She is co-ordinator of two NSF-USA /BAS - Bulgaria joint projects, leader-invest. for proposal (PROMETHEAS), national contact person of Bulgaria for Priority 3 and member of the program committee for Priority 3 "Nanotechnology and nanoscience, knowledge-based multifunctional materials, new production processes and devices" of the 6th Framework Program of European Communities. Furthermore she is president of the National Expert Council on Nanotechnologies of Bulgaria, member of American Chemical Society and IEEE Society, participant in "Network for Nanostructured Materials of ACC" (NENAMAT) and in coordination action "Co-ordination by Best Practice exchange and on Knowledge building by NMP-NCP’s in an Enlarged European Research Society" (COOREERS).
Prof. Dragieva is leader of a department "Nanoscale Materials" of Institute of Electro-chemistry and Energy Systems at Bulgarian Academy of Sciences (former Central Laboratory of Electrochemical Power Sources) and consists of 7 departments devoted to R&TD of batteries and fuel cells.
Prof. Kornel F. Ehmann is James N. and Nancy J. Farley Professor in Manufacturing and Entrepreneurship at Northwestern University,Evanston, Illinois, USA.
He obtained his M.S. in Mechanical Engineering from the University of Belgrade in 1974 and his Ph.D. in Mechanical Engineering from the University of Wisconsin-Madison in 1979. In 1985 he became Associate Professor at the Northwestern University, Evanston, Illinois, Professor at the Northwestern University in 1990, Distinguished Honorary Professor at Indian Institute of Technology (IIT), Kanpur, India and Adjunct Professor at University of Illinois at Urbana/Champaign in 2004 and Adjunct Chair Professor at Chung Yuan Christian University, Chung-Li, Taiwan in 2006.
Prof. Ehmann is a fellow of ASME (American Society of Mechanical Engineers) and SME (Society of Manufacturing Engineers) and has been Past President of NAMRI/SME (North American Manufacturing Research Institution of SME) and Past Chair of the Manufacturing Engineering Division of ASME.
His primary research activities lies in Micro/meso-scale manufacturing, Precision engineering, Machine tool dynamics and control, Material removal processes and Automation and robotics. The pervasive theme throughout Professor Ehmann’s research activities is the accuracy, precision and dynamic stability of shape generation and replication processes.
Hans Nørgaard Hansen is the Professor of Micro/Nano Manufacturing and Focus Area Manager in Micro/Nano and Precision Manufacturing at Technical University of Denmark. He received his M.Sc. in 1993, his Ph.D. in 1997 and the HD in 1999. Prof. Hansen has been awarded the Professor Wilkens Award, the Nordic Metrology Award, the CIRP F.W. Taylor Medal, as well as the HRH Prince Henrik’s award.
Hans Nørgaard Hansen has written more than 50 published papers in international journals and contributions to international conferences with referees. He serves on or has been a member of the European Society for Precision Engineering and nanotechnology (euspen), the International Academy for Producting Engineering (CIRP), the Dansk Maskinteknisk Selskab, the Scientific Technical Committee regarding Surfaces within CIRP and EUREKA Factoring Working Group.
The core activities of the research group comprise micro product design and development, tooling technologies for micro injection moulding and micro metal forming, mass production technologies, chemical and electrochemical processes and laser technologies. Finally the integration of processes into coherent process chains is a key activity.
Prof. Jan G. Korvink obtained his M.Sc. in computational mechanics from the University of Cape Town in 1987, and his Ph.D. in applied computer science from the ETH Zurich in 1993. After his graduate studies, he joined the Physical Electronics Laboratory of the ETH Zurich, where he established and lead the MEMS Modelling Group. This was followed by a move in 1997 to the Albert Ludwig University in Freiburg, Germany, where he holds a Chair position in microsystem technology and runs the Laboratory for Microsystem Simulation.
Currently, Prof. Korvink is dean of the Faculty of Applied Science. He has written more than 180 journal and conference papers in the area of microsystem technology, and co-edits the review journal Applied Micro and Nanosystems, see http://www.wiley-vch.de/ books/info/amn. His research interests cover the modelling and simulation and low cost fabrication of microsystems.
Brad Nelson is the Professor of Robotics and Intelligent Systems at ETH-Zürich and is the director of IRIS. His primary research direction lies in extending robotics research into emerging areas of science and engineering. He received a B.S. (Mechanical Engineering)from the University of Illinois at Urbana-Champaign in 1984, an M.S. (Mechanical Engineering) from the University of Minnesota in 1987, and the Ph.D. degree in Robotics (School of Computer Science) from Carnegie Mellon University in 1995. During these years he also worked as an engineer at Honeywell and Motorola, and served as a United States Peace Corps Volunteer in Botswana, Africa. In 1995 he became Assistant Professor at the University of Illinois at Chicago, Associate Professor at the University of Minnesota in 1998, and Professor at ETH in 2002.
He has been awarded a McKnight Land-Grant Professorship and is a recipient of the Office of Naval Research Young Investigator Award, the National Science Foundation Faculty Early Career Development (CAREER) Award, the McKnight Presidential Fellows Award, and the Bronze Tablet. He was elected as a Robotics and Automation Society Distinguished Lecturer in 2003 has been nominated for and/or won best paper awards at major robotics conferences and journals for 2004, 2005, 2006, and 2007. He was named to the 2005 "Scientific American 50," Scientific American magazine's annual list recognizing outstanding acts of leadership in science and technology from the past year.
Prof. Nelson serves on or has been a member of the editorial boards of the IEEE Transaction on Robotics, the IEEE Transactions on Nanotechnology, the Journal of Micromechatronics, the Journal of Optomechatronics, and the IEEE Robotics and Automation Magazine. He has chaired several international workshops and conferences.
He is currently the head of the Department of Mechanical and Process Engineering (D-MAVT).
Svetan Ratchev is a Professor in Manufacturing Engineering and Director of the Nottingham Centre of Excellence in Customised Assembly (CECA).
He researchs and consults in key areas of precision manufacture including assembly automation, precision machining and distributed design and manufacture. He has authored over 120 publications of which over 90 are in refereed journals, books and conferences. Svetan is a member of the IFAC technical committees TC5.1 and TC5.2 and the founding chair of the International Precision Assembly Seminar IPAS.
The Conference Programme will include two Invited Sessions with invited contributions. The Session will be 1.5 hours long and includes generally 4 speakers & time for discussion. The Special sessions should present the latest research results of each projects.
ASSEMIC: research advances in microhandling and -assembly – “Special ASSEMIC Session”
A. Almansa, S. Bou, Z. Rozynek, Profactor R&S GmbH, Austria
W. Brenner, TU Wien – ISAS, Austria
Method for overcoming the unwanted displacements of an electro-thermally actuated microgripper
R. Voicu, D. Esinenco, R. Müller, L. Eftime, C. Tibeica
National Institute for Research and Development in Microtechnologies – IMT, Romania
A simple bonding process of SU-8 to glass to seal a microfluidic device
S. G. Serra, A. Schneider, S. E. Huq, Rutherford Appleton Laboratory,Technology, UK
K. Malecki, W. Brenner, Institute of Sensor and Actuator Systems Vienna University of Technology, Austria
Technologies for microassembly: selected methods
S. Bou, D. Fratila, A. Almansa, W. Palfinger, W. Mann, PROFACTOR R&S GmbH, Austria
A. Boglea, A. Olowinsky, Institute for Laser Technology – ILT, Germany
D. Andrijasevic, W. Brenner, TU Wien – ISAS, Austria
R. Möst, PICO Dosiertechnik GmbH & Co. KG, Germany
The Conference Programme will include two quest speakers and six invited keynote speakers:
Cardiff University requests a formal written Licence agreement from the copyright owners for each article published. To avoid any delay in the publication of your article, please read the terms of this agreement, sign in the space provided and return the complete form to us by 22nd June 2007.
The conference will take place at the Hotel Samokov, Borovets, Bulgaria. The hotel is situated in the centre of the mountain resort of Borovets (1300 m above the sea level). Attendees should fly to Sofia, from where a bus transfer to the hotel will be provided by the organisers.
| Sofia Airport - Borovets - Sofia Airport |
||
|---|---|---|
| Return ticket by minibus | 69.00 levs (~35.00€) | |
| Individual transfers by car | 109.00 levs (~56.00€) |
The bus journey will take about one hour and the payment regarding your bus ticket will be added into your hotel bill at the end.
The bus driver will be waiting you at the arrivals and will direct you to the bus.The sign that he will be having is "4M2007 - Borovets"
Please find the bus timetable here ARRIVALS Please check updated arrivals list 1st Oct. 2007!
Please find the bus timetable here DEPARTURE Please check updated departure list 1st Oct. 2007!
Please note that these timetables are only for attendees who requested the transportation.
Please note that it is required that you will inform us about your Arrival/Departure times by 26th September 2007 so that we can reserve your place in advance. Please note that without providing us your Arrival/Departure times we cannot reserve your place and therefore it is required that you will organise your own trasportation.
For any urgency, the conference organisers can be contacted via Tel: +359 (0)886665663 (between 1st-5th Oct.)
Please reserve your place via: Marika Takala
Each participant will be allowed 15 minutes per presentation and at the end of the each session will be 10 minutes question time. Session chairs will make sure the schedule is respected.
In order to avoid technical and connection problems and the corresponding loss of time, a laptop will be provided by the organisers. Presentations must be saved on memory stick or CD in PowerPoint format exclusively (version 2002 or earlier but no earlier than 97) and pass on it to the technician during the registration on 3rd October 2007. Please note that the papers must be presented by one of the authors and presentation can not be amended after above date. If you need any special facilities for your oral presentation, please consult the organiser as soon as possible but no later than by 31st August 2007.
The language of the conference will be English and no translation facilities will be provided. Only one oral and/or one poster presentation will be accepted from each participant.
4M2007 reserves the right to cancel a presenter’s poster session if the above requirements are not met.
Detailed conference programme for session times and room numbers will be available nearer the time.
Poster Presentation Presenters must be available to discuss their displays throughout the Conference. Presenters can display their poster on the first day and have it displayed for the first two days. Authors may bring extra copies of their work to be used for handouts. The room numbers will be available nearer the time.
The Poster Board/Panels for each presentation will be available, with approximate dimensions 80 cm wide and 140 cm high. Each poster board/panel is marked with a number on the upper left corner. Poster is recommended to be in A0 format, however the total space available for your poster is (app. W 80cm x H 140cm). The presenter must provide pushpins to attach materials to the display board, along with any other supplies.
All posters must be in English with the paper title (2.5cm), author names and affiliations (1.5 cm) and the text easily readable. Poster should include introduction, development and conclusion with a contact point.
Drawings, diagrams and photos are extremely helpful and often necessary to display results and conclusions. Please do not overload any chart or drawing with information.
The Organising Committee reserves the right to cancel a presenter’s poster session if the above requirements are not met.
4M2007 Proceedings will be published by Whittles Publishing. The Proceedings plus a CD-ROM will be available in November 2007 at the price of £150.
Edited by
With over 80 papers and six keynote contributions, this volume details the state-of-the-art with regard to numerous aspects of advanced micro technologies with respect to metals, polymers, and ceramics, and the development of new production platforms for micro systems-based products.
The contributions from leading authors from universities, independent research and corporate organizations provide an invaluable overview of this rapidly moving subject and an insight into key developmental areas. This comprehensive collection of indexed and peer reviewed articles is also contained on a CD with search functionality.
Contents
Keynote speakers
and sections on:
Readership
This volume will be of interest to all engineers and scientists, whether in academia or industry, working in the field of nanotechnology and micro manufacture.
Selected papers may be considered for publication in Special Issues.
| Time | ||
|---|---|---|
| 08:00h to 09:00h | Registration | |
| 09:00h to 09:30h | Opening
|
|
| 09:30h to 10:45h | Invited Talks | |
| 10:45h to 11:15h | Coffee Break/Poster Session | |
| 11:15h to 12:30h | Thematic Session 1 |
Thematic Session 2 |
| 12:30h to 14:00h | Lunch |
|
| 14:00h to 15:30h | MINAM, Dr. Pieter Bolt, TNO, The Netherlands and Industrial Problem Statements/Panel Discussion |
|
| 15:30h to 16:00h | Coffee Break | |
| 16:00h to 17:30h | Assemic Invited Session |
|
| 19:00h to 22:30h | Banquet | |
| Time | ||
|---|---|---|
| 08:30h to 09:45h | Invited Talks | |
| 09:45h to 11:15h | Poster Session/Coffee break | |
| 11:15h to 12:30h | Thematic Session 3 |
Thematic Session 4 |
| 12:30h to 14:00h | Lunch | |
| 14:00h to 15:30h | MicroSapient Invited Session | |
| 15:30h to 16:00h | Coffee break/Poster Session |
|
| 16:00h to 17:15h | Thematic Session 5 | Thematic Session 6 |
| 19:00h to 20:30h | Cocktail | |
| Time | ||
|---|---|---|
| 08:30h to 09:45h | Invited Talks | |
| 09:45h to 10:30h | Coffee Break | |
| 10:30h to 12:00h | Thematic Session 7 | Thematic Session 8 |
| 12:00h to 13:00h | Lunch | |
Please note that the Posters will be displayed from Wed 3rd to Fri 5th October 2007. In addition a poster session have been organised
| 08:00h - 09:00h | |
|---|---|
| Registration | |
| 09:00h to 09:30h | |
Opening (Bulgaria Hall)
|
|
| 09:30h to 10:45h | |
| Keynote Speakers (Bulgaria Hall) Chair: S. Dimov, MEC, UK 09:30h SPH simulation of the embossing and injection moulding of micro-parts: Softening and aggregation aspects 10:00h A synopsis of U.S. micro-manufacturing research and development activities and trends |
|
| 10:45h to 11:15h | |
| Coffee Break/Poster Session | |
| 11:15h to 12:30h | |
| Session 1 Process characterisation (Bulgaria Hall) Chair: A. Schoth, IMTEK, Germany 11:15h Filling analysis in micro injection moulding using weld lines as flow markers 11:30h Short pulse laser milling effects on surface integrity 11:45h Process capabilities of micro-EDM and its applications 12:00h Investigations on reel-to-reel hot embossing |
Session 2 Components (Rodina Hall) Chair: M. Richter, IZM, Germany 11:15h Investigations in injection moulding of micro structures and microstructured surfaces 11:30h Fabrication of highly precise fiber optical array products by use of laser based micro alignment 11:45h Rapid prototyping of 3D micro- nanostructures to explore cell behaviour 12:00h A novel approach for batch production of micro holes by micro EDM |
| 12:30h to 14:00h | |
| Lunch |
|
| 14:00h to 15:30h | |
| MINAM, Pieter Bolt, TNO, The Netherlands/ Industrial Problem Statements Panel Discussion (Bulgaria Hall) Chair: W. Menz, Germany and S. Dimov, MEC, UK 4M Industrial Board |
|
| 15:30h to 16:00h | |
| Coffee Break/Poster Session | |
| 16:00h to 17:30h | |
| Assemic Special Session (Bulgaria Hall) Chair: A.Schneider, RAL, UK 16:00h ASSEMIC: research advances in microhandling and -assembly – “Special ASSEMIC Session” 16:20h Method for overcoming the unwanted displacements of an electro-thermally actuated microgripper 16:40h A simple bonding process of SU-8 to glass to seal a microfluidic device 17:00h Technologies for microassembly: selected methods |
|
| 19:00h to 22:30h | |
| Banquet (Restaurant on the ground floor) | |
| 08:30h - 09:45h | |
| Keynote Speakers (Bulgaria Hall) Chair: W. Menz, Germany 08:30h Microassembly processes and microassembled devices 09.00h Dimensional metrology in micro manufacturing |
|
| 09:45h - 11:15h | |
| Poster Session/Coffee break (Exhibition area) | |
| 11:15h - 12:30h | |
| Session 3 Novel materials (Bulgarian Hall) Chair: P. Johander, IVF, Sweden 11:15h Non-fouling thin polymeric films synthesized by PECVD 11:30h DLC based BioMEMS probe for electrical activity recording of tissues and cells 11:45hMicro Milling of High Aspect Ratio Micro Structures in Ceramics 12:00h Rapid hybrid tooling based on CNC- and μEDM-milling to fabricate lab-on-a-chip systems | Session 4 Process Modelling/simulation (Rodina Hall) Chair: U. Engel, Erlangen, Germany 11:15h Metallographic investigation and solidification-structure modelling of al micro castings 11:30h Numerical simulation of the compression flow of a polymer disk for modelling hot embossing processes 11:45h Material modelling for the simulation of microforming processes at elevated temperature 12:00h Telemanipulation Control of Mechatronic Handling Devices for Micro/Nano Operations |
| 12:30h - 14:00h | |
| Lunch | |
| 14:00h - 15:30h | |
| MicroSapient Special Session (Bulgaria Hall) Chair: S.Ratchev, University of Nottingham, UK 14:00h Design of generic modular reconfigurable platforms (GMRP) for future micro manufacturing 14:20h A CAD/CAM approach for layer-based FIB processing 14:40h Application of different process chains for polymer microfluidics fabrication including hybrid tooling technologies, standardization and replication: a benchmark investigation within 4M Polymer Division 15:00h Structure-property relationship of dispersants used in ceramic feedstock development | |
| 15:30h - 16:00h | |
| Coffee Break/Poster Session | |
| 16:00h - 17:15 | |
| Session 5 Metrology (Rodina Hall) Chair: L. Mattson, KTH, Sweden 16:00h Impact of liquid lubricant on the flattening behaviour of single asperities 16:15h A new method for directly determining the adhesive strength of conductors on microstructured MID 16:30h Non-destructive characterization of multilayer structures by low-coherence interferometry 16:45h On the development of a universal and flexible coordinate metrology for micro and nano components production | Session 6 Systems (Bulgaria Hall) Chair: N. Aspragathos, University of Patras, Greece 16:00h Automated patch clamping systems design using novel materials 16:15h Novel Piezoresistive e-NOSE Sensor Array Cell 16:30h Characterization of Parylene-C film as an encapsulation material for neural interface devices 16:45h On the development of an implantable μ-biomechatronic system for the rehabilitation of lower limb neuro-muscular disabilities |
| 19:00h - 20.30h | |
| A Cocktail Reception | |
| 08:30h - 09:45h | |
|---|---|
| Keynote Speakers (Bulgaria Hall) Chair: Y. Toshev, BAS, Bulgaria 08:30h Chemical bonds of nanoscale materials – reasons for various applications 09:00h Design for Microassembly – Capturing Process Characteristics | |
| 09:45h - 10:30h | |
| Coffee Break/Poster Session | |
| 10:30h to 12:00h | |
| Session 7 Process Characterisation (Rodina Hall) Chair: A. Schoth, IMTEK, Germany 10:30h Microinjection moulding of thermoplastic polymers: from theory to experiment 10:45h Analysis of micro-structuring polymer replication by micro-injection moulding and hot embossing 11:00h FIB milling and characterization of CrC coatings on tool steel substrate 11:15h Polymer inserts tooling for prototyping of micro fluidic components in micro injection moulding |
Session 8 Components (Bulgaria Hall) Chair: M. Richter, IZM, Germany 10:30h Multi-Component Micro Injection Moulding – Trends and Developments 10:45h High Precision Placement of Solar Cell Assemblies on large Base Plates for Concentrator Photovoltaics 11:00h Layer Manufacturing as a Generic Tool for Microsystem Integration 11:15h Bimaterial actuators and sensor with built-in compensation of the ambient temperature interference |
| 12:00h - 13:00h | |
| Lunch | |
| Process Characterisation including Process Chains | ||
|---|---|---|
| Electro-chemical polishing: a technique for surface improvements after laser milling T. Dobrev, D.T. Pham and S. Dimov, Manufacturing Engineering Centre, Cardiff University, UK Water jet machined thin sheet metal electrodes for micro die-sinking EDM High power DPSS laser micro-machining of stainless steel and silicon for device singulation Life cycle assessment of micro manufacturing process chains - application to the microfactory concept Influence of microstructure on the mechanical properties and the forming behaviour of very thin metal foils Characterization of pulses in micro EDM milling based on wear and material removal A soft lithography process for manufacture of alumina micro-components |
||
| Components: Fabrication and Assembly Technologies | ||
| A new approach to qualitiy assurance in resistance welding for microsensors packaging D. Ulieru, ROMES S.A. Romania A. Matei, National Institute for Research and Development in Microtechnologies, Romania E. Ulieru and A. Tantau, SITEX 45 SRL, Romania Design of a micro injection moulding machine for thermosetting moulding materials Laser transmission welding of transparent plastics parts in micro technology Different influences on the ECF process Application of EDM to the Production of Micro Tooling Simulation of micropart motion under 2D force fields implemented on a cilia microactuator array New methods for selective metallization of 3-D polymer microparts An investigation on development of MEMS in LTCC by embossing technique |
||
| Novel Materials: Characterisation and Processing | ||
| Plasmons in nanospherical metallic systems: RPA description L. Jacak and M. Krzyżosiak, Institute of Physics, Wrocław University of Technology, Poland J. Krasnyj, Institute of Mathematics, University of Opole, Poland Phase transition in nanocomposites LixCuySnz as anode material in recharcheable lithium batteries Micro-EDM of UFG aluminium KMPR photoresist for fabrication of thick microstructures Synthesis and characterization of cobalt nanoparticles, nanowires and their composites |
||
| Process Modelling and Simulation | ||
| An approach for predicting the correct geometry and parameters of the sprue system of an optical disc mould by use a computer aided design and simulation D. S. Trifonov, Institute of Information Technology, Bulgarian Academy of Sciences, Bulgaria Y.E. Toshev, Institute of Mechanics and Biomechanics, Bulgarian Academy of Sciences, Bulgaria Demouldability of microstructures in polymer moulding Nano-scale aspects in studying the kinetics of reactions over zeolite catalysts |
||
| Metrology: Inspection and Characterisation and Processing | ||
| Critical analysis of an existing calibration procedure built in a white light interferometer microscope and proposal of an alternative spline-based approach C. Ferri and E. Brousseau, Manufacturing Engineering Centre, Cardiff University, UK |
||
| Systems: Novel Product and Process Designs | ||
| A new concept for an absolutely encoded angular resolver V. Mayer, T. Botzelmann, K.-P. Fritz, J. Seybold and H. Kück, Hahn-Schickard-Gesellschaft, Institute of Micro Assembly Technology, Germany Design and optimization of flat solenoid MEMS actuator by selection of proper material properties Polymer Lab-on-Chip systems with integrated electrochemical pumps suitable for large scale fabrication New technology for setting up the working coordinate system in micromilling Development of a dynamic high precision miniature milling machine Photosensor of CDSSE for fiber optics applications Thin film polymer actuators for micro-fluid applications New Approaches for an Automised Production in Ultraprecision Machining New systematic and time-saving procedure to design cup grinding wheels for the application of ultrasonic assisted grinding |
||
| MicroSapient | ||
| Pneumatic contactless microfeeder design refinement through CFD simulation M. Turitto and S. Ratchev, School of M3,The University of Nottingham, UK X. Xue, M. Hughes and C. Bailey, School of Computing and Mathematical Sciences, University of Greenwich, UK SMART : a tool to set the Materials EuroRoads |
||
| Assemic | ||
| A concept of collision prevention during micro assembly in a SEM chamber Al. Cvetanovic, D. Andrijasevic and W. Brenner, Institut of Sensors and Actuators systems, Vienna University of Technology, Wien An. Cvetanovic and M. Soucek, Integrated Microsystems Austria |
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| 15:00h to 18:00h | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SEMOFS Workshop | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Title | Presenter |
|---|---|
| Introduction | J. Gavillet (CEA) |
| General Presentation of SEMOFS Project | K. Hiller (TUC) |
| Micro-Optical Platform for Plasmon Sensing | J. Söchtig / G. Voirin (CSEM) |
| Micro-Fluidic Platform for Sample Handling | J. Nestler (TUC) |
| Bio-Compatibility and Bio-Sensing | M.-C. Beckers (EUROGENTEC) |
| Micro-Manufacturing Challenges | S. Bigot (CU) |
| Open Questions & Posters | All + Attendees (1 hour) |
POSTER SESSION
| Paper Title | EC Project | Partners |
|---|---|---|
| Consortium, Concept & Technologies | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| System Design and Cost Aspects | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-Optical Platform for plasmon Sensing | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-Plasmonics for Surface Sensing | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-and Nanostructured Surfaces for the Liquid and Gas Management in Microstructured Flowfields | 4M - XDP (Invited) | FZK, DTU, IMTEK, CEA |
| Micro and Nanomanufactoring in the Next Ten Years | µ-Sapient (Invited) | CEA, U. Nottingham, FZK |
| Paid before August, 31 2007 |
Paid after August, 31 2007 |
|
|---|---|---|
| 4M NoE Partners and Delegates from NMS & ACC | 100 € | 150 € |
| Non-partners in 4M NoE | 200 € | 250 € |
| Students | 100 € | 150 € |
| Accompanying guest | 50 € | 70 € |
Find out more about Sponsorship Opportunities at the 4M2007 Conference.
Email, Fax or Post completed form with payment to:
Mrs M Matthews (4M Finance Officer), Manufacturing Engineering Centre, Cardiff University, Cardiff CF24 0YF, E-mail: matthewsm2@cardiff.ac.uk, Telephone: +44(029)20870253, Facsimile: +44(029)20874695
Date: October 2, 2007
Time: 15:00 - 18:00
Location: Hotel Samokov, Borovets, Bulgaria
DESCRIPTION
The aim of the SEMOFS project is to carry out research at the frontier of knowledge for the development of a next generation of biosensor: a polymer-based card type integrated solution of "Plasmonics enhanced SPR"-sensor.
This will be achieved thanks to the combination of innovative concepts of plasmonics, integrated optics (light source, detection) and micro-fluidics, and will be a real significant breakthrough since it will be totally integrated on a polymer-based chip.
This new biosensor concept will go far beyond the existing technology platforms and will provide increased sensitivity and diagnosis possibilities, cost effectiveness, and disposability, which is required to enable the emergence of new healthcare models.
SHORT TALKS
| Title | Presenter |
|---|---|
| Introduction | J. Gavillet (CEA) |
| General Presentation of SEMOFS Project | K. Hiller (TUC) |
| Micro-Optical Platform for Plasmon Sensing | J. Söchtig / G. Voirin (CSEM) |
| Micro-Fluidic Platform for Sample Handling | J. Nestler (TUC) |
| Bio-Compatibility and Bio-Sensing | M.-C. Beckers (EUROGENTEC) |
| Micro-Manufacturing Challenges | S. Bigot (CU) |
| Open Questions & Posters | All + Attendees (1 hour) |
POSTER SESSION
| Paper Title | EC Project | Partners |
|---|---|---|
| Consortium, Concept & Technologies | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| System Design and Cost Aspects | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-Optical Platform for plasmon Sensing | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-Plasmonics for Surface Sensing | SEMOFS | TUC, CSEM, ZEPTOSENS, EUROGENTEC, CU, CEA |
| Micro-and Nanostructured Surfaces for the Liquid and Gas Management in Microstructured Flowfields | 4M - XDP (Invited) | FZK, DTU, IMTEK, CEA |
| Micro and Nanomanufactoring in the Next Ten Years | µ-Sapient (Invited) | CEA, U. Nottingham, FZK |
 |
The Technical University of Sofia, Bulgaria The Technical University of Sofia is a major educational research and production complex offering highly qualified trainers, engineers and technical staff, with modern laboratory facilities and considerable capacities for experimentation and production. It is the largest higher engineering school in Bulgaria. Contemporary engineering trends in mechanical and electrical engineering, electronics, power generation, transport, automation, computer science and telecommunications, textile engineering, industrial management are taught at the Technical University. The Technical University of Sofia carries out dynamic research activities, their scientific products being competitive on the world market. |
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SARIX SA, MICRO EDM TECHNOLOGY, LOSONE High precision 3D Micro EDM Milling Technology SARIX always at leading edge of the highest Micro-machining performance offers now a new Micro EDM machining concept, the 3D Micro EDM Milling Machining. Complete 3D cavities can be achieved down to real micro scale of 10 micron with accurate tolerance down to 0.3 micron within high surface finishing of Ra 50 Nano. With its reliable machine concept using in once the Micro-Drilling, Micro-sinking and the 3D Micro EDM Milling, SARIX contribute on the development of new high-tech products and Micro-device. Micro EDM is now utilized for high-performance applications in electronics, automotive, medical, textiles, aerospace, and industrial equipment. Difficult-to-machine materials such as titanium, hardened steel, tungsten carbide, PCD and even some ceramics can be machined by micro EDM on SARIX machines. |
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SEMOFS, Surface Enhanced Micro Optical Fluidic Systems Surface Enhanced Micro Optical Fluidic Systems The aim of the SEMOFS project is to carry out research at the frontier of knowledge for the development of a next generation of biosensor: a polymer-based card type integrated solution of ”Plasmonics enhanced SPR”-sensor. This will be achieved thanks to the combination of innovative concepts of plasmonics, integrated optics (light source, detection ) and micro-fluidics, and will be a real significant breakthrough since it will be totally integrated on a polymer-based chip. This new biosensor concept will go far beyond the existing technology platforms and will provide increased sensitivity and diagnosis possibilities, cost effectiveness, and disposability, which is required to enable the emergence of new healthcare models. |
 |
Oxfordlasers, UK Oxford Lasers specialise in the integration of Laser Micro Machining Systems for a variety of applications where parts or features require to be fabricated on a micron scale. The systems offered employ lasers which range in wavelength from the UV through to the Infrared, with pulse lengths in either the nano, pico or femtosecond range. Materials capable of being processed range from metals and ceramics through to polymers and glasses using a variety of techniques, including drilling, milling, scribing and cutting. These lasers are integrated with vision or measuring systems, manual or automatic part handling, software and all necessary safety features. |
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PLASTIPOLIS, France |
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The Manucacturing Engineering Centre, MEC, UK The Manufacturing Engineering Centre (MEC) is an award-winning R&D Centre of Excellence for Advanced Manufacturing and Information Technology. The ISO 9001:2000 accredited Manufacturing Engineering Centre (MEC) offers specialist services in Time Compression Technologies to companies of all sizes. The Manufacturing Engineering Centre (MEC) has an international reputation for its leading-edge research in Advanced Manufacturing and Information Technology spanning a broad spectrum of subjects. |
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MINOS MINOS-EURONET is devoted to stimulating, encouraging and facilitating the participation of New Member States (NMS) and the Associated Candidate Countries (ACC) in the activities of IST. The proposal has a pan-European focus on one strategic objective in IST, namely micro- and nanosystems. In strictly conformity with the call, the proposal is addressing the following objectives: (1) Revealing and promoting the research competences from NMS and ACC, namely competences which are relevant for the development of the field of micro-nanosystems at the European scale; (2) Facilitating the participation of NMS and ACC organisations to EU programmes and other activities in the field of micro-nanosystems; (3) Performing extensive networking at the pan-European scale in the field of micro-nanosystems. |
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Minatec, European Centre for Micro and Nano Technology, France The Minatec micro and nanotechnologies innovation center was founded by Grenoble IT and French Commission for Atomic Energy of Grenoble on January 18th, 2002, with support from the State and local government authorities. It works to bring together major organizations in the Grenoble area working in micro and nanotechnology development. |
The main goal of the Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of micro-manufacturing capabilities. Papers are invited to present the latest advances in developing new processes and process chains for multi-material micro manufacture and their applications in microsystems-based products.
The 4M Conference will be one of the most prestigious and well attended events of its kind in Europe during 2007. Becoming a sponsor of 4M2007 Conference provides an excellent opportunity to market your organization and services further, as the conference attracts a wide variety of attendees from the emerging micro-manufacturing community.
Stand out from the rest in front of more than 150 Micromanufacturing experts.
As a sponsor you can promote your company’s mission even more effectively to the assembled individuals and organisations attending 4M2007 while learning about the latest advances in micro-manufacturing research.
We are offering four sponsorship levels:
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Please note that the deadline having an advert in 4M2007 Proceedings and your Company logo on back cover of 4M2007 Proceedings is 6th June 2007. After this deadline the advert opportunities in 4M2007 Proceedings are no longer included in the sponsorship packages and the package prices vary.
Get the most from your marketing budget and take advantage of these sponsorship packages.
For further information, to discuss your sponsorship interests and to get information regarding the exhibition please contact us at 4M_Info
Jeanette Whyte
Manufacturing Engineering Centre, Cardiff University
Tel: +44-(0)29-20874641; Fax: +44-(0)29-20874880; E-mail: whytejc[@]cf.ac.uk