4M2006 Conference on Multi-Material Micro Manufacture

Prime contractor : Conseil Général de l'Isère
Representative : Territoire 38 - Contracting Authority : Groupe 6, Setec Industrie, Faure Ingénierie et Adret

Date

20th – 22nd September 2006

Location

Minatec

The European Centre for Micro and Nano Technology, Grenoble, France

Conference Chair

Dr. Bertrand Fillon, CEA/LITEN, France

Conference Co-Chairs

Prof. Wolfgang Menz, Germany

Dr. Stefan Dimov, Cardiff University, UK

Aim and Themes

The main goal of the Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of micro-manufacturing capabilities. Papers are invited to present the latest advances in developing new processes and process chains for multi-material micro manufacture and their applications in microsystems-based products, in particular but not limited to:

• Novel materials: characterisation and processing;
• Process modelling and simulation;
• Process characterisation including process chains;
• Metrology: inspection and characterisation methods;
• Components: fabrication and assembly technologies;
• Systems: novel product and system designs.

4M2006 Proceedings

4M2006, the second annual conference of the 4M Network of Excellence (www.4m-net.org), will be held on 20th-22nd September 2006 at the largest centre in Micro-nanotechnologies in Europe "MINATEC", Grenoble, France.

The excellent response to the call for papers resulted in 100 papers being submitted to the conference. More than 250 authors coming from 20 countries and 50 organisations contributed to this event. In addition we are please to report that almost 25% of the submitted papers were not Partners in 4M. All the accepted papers are gathered together in these proceedings for your information.

The 4M2006 Conference Proceedings were published by Elsevier.

The Proceedings of 4M2006 are available for purchase now. Click on the picture of the proceedings to order your copy.

Selected papers may be considered for publication in the Proceedings of The Institution of Mechanical Engineers (IMechE),

• part B, Journal of Engineering Manufacture a special issue of the Proceedings of the IMechE,

  
  

 

About Grenoble



Although well noted as a winter play place with many alpine ski resorts nearby, Grenoble also offers numerous outdoor activities during the warmer parts of the year. The many universities located here add an intellectual and international feeling to this enchanting yet isolated city. Grenoble is home to one of the World Trade Centers and several strong international businesses. The Museum of Art and the many historical Napoleonic streets all contribute to the distinguishing character of this city. A mechanical lift takes visitors up the overlooking mountain to the old fort, offering a breathtaking view. The fort represents the highly interesting and important history of Grenoble during the Spanish Inquisition. After a full day of activities, visit either the Italian section on the left bank, or one of the many intimate and warm restaurants found along the narrow, old streets.

Grenoble Tourist Office
City Map

Le Téléphérique de Grenoble - Bastille
Since 1934, the Bastille site has been linked to the city by what at the time was Europe's first cable-car in a town centre. The short breathtaking ride in the "Eggs" sweeps visitors up to the viewing platforms, discovery trails around the fortifications, recreation areas, café, restaurant, footpaths and fitness circuits.

Fort de (la Bastille)
As early as 1934, La Bastille was connected to the city center by a teleferique. It was the first city teleferique in the world. A completely new teleferique was built in the 70s with 5 small cabins instead of a large one, locally known as "les Bulles" (the bubbles). The Bastille trip with the teleferique is a must. It offers a birds eye view on the roofs of the "quartier Saint Laurent", the oldest part of Grenoble and after a few minutes a panoramic view on the surrounding massifs and on the city. It is possible either to go down to the city by the teleferic or to take one of the trails that follow the fortifications and reach the valley.

Musée de Grenoble
Founded in 1796, this is one of the country's oldest art museums. It was the first French museum outside of Paris to focus on modern art, a fact appreciated by Picasso, who donated his Femme Lisant in 1921. The collection includes Flemish and Italian Renaissance works, but the Impressionist paintings generate the most interest.

Musée de l'Ancien Evêché
The fine collection of art here is made from wood and glass, which chronicles the historical development of the region's culture. Exhibits are further augmented by a series of photographs and brief documentaries.

Fontaine du Lion et du Serpent
Place de la Cymaise, Fontaine du Lion (Lion fountain), a bombastic statue by the sculptor Sappey and molted by Crozatier. It symbolize the fight between the winding Isère river (the snake) and its affluent, the torrential Drac river (the Lion), that has flooded Grenoble several times in the past. The snak is molted in bronze while the lion is carved in white lime stone from Sassenage.

Le Bois Francais Lake and Park
The park covers an area of 100 hectares and has a very large lake in the centre of it. There are a number of watersports on offer at the lake and there are always life guards on duty. The park has a number of facilities, including a swimming area; a beach area; canoeinf; water skiing; a cafe; picnic areas; fitness trails; and nature trails.

Chartreuse, Vercors and Belledonne mountains

 

Accomodation

Rooms have been reserved at the following hotels. When reserving a room please say you are attending the '4M Conference' as some of the costs listed are at a reduced rate.

The full accomodation information

 

Important Deadlines

• Submission site will open - 10 January 2006
• Submission deadline of full papers - 28 February 2006
• Feed back from the peer review to authors - 21 April 2006
• Submission of final full papers - 5 May 2006
• Notification of acceptance - 2 June 2006
• Authors final registration - 9 June 2006
• Public final registration - 8 September 2006
 

Invited Speakers

Dr. Fabien Sauter



Before joining the LETI in 2002 as the senior scientist, Dr. Fabien Sauter-Starace spent two years at Corning FRC where he developed MEMS (design and packaging) for optical telecom and biology. Since his arrival in the LETI, he has been in charge of cell on chip projects and packaging issues in the Biosystems on Chips department. In 2005, he became Project manager of a large european project. He is also a key member in several research program on medical devices.

Dr. Fabien Sauter-Starace has cumulated more than 5 years experience in silicon development dedicated to Biology and Healthcare. He is author of 15 scientific papers and holds 3 patents.

Dr. Fabien Sauter-Starace graduated from the Arts et Métiers in 1996 and he holds a Ph.D. in Mechanics (2001) from Nancy University with a grant from EDF R&D.

Prof. Dr. Sergej Fatikow



Born on March 5, 1960 in Ufa, Russia, studied computer science and electrical engineering at the Ufa Aviation Technical University in Russia, where he received his doc­toral degree in 1988 with work on intelligent control of complex non-linear systems. After two years of teaching at UATU he mo­ved to the Institute for Process Control and Robotics at the University of Karlsruhe in Germany, where he worked as a scientific researcher and since 1996 as an assistant professor. In 2000 he accepted an associate professor position at the University of Kassel (Germany) and in 2001 a full professor position at the University of Oldenburg (Germany). Prof. Fatikow is Head of the Institute for Micro­robotics and Control Engineering.

Prof. Fatikow accomplished research stays at different universities in the U.S.A., Canada and Great Britain. His research interests include different aspects of mic­ro- and nanorobotics, micro­actuators and micro­sensors, robot-based nanohandling automation, and neuro-fuzzy robot control. He is author of two books on microsystem technology, microrobotics and micro­assembly, published by Springer in 1997 and by Teubner in 2000

Dr. Philippe Roussel

Graduated from the University of LYON in Electronics and Microelectronics. He was granted a Ph-D in Integrated Electronics Systems from the Applied Sciences National Institute (INSA) in LYON. He is working at Yole Développement since 1998 and is involved in techno-economical market analysis in the fields of Compounds Semiconductors, Microsystems and Optoelectronics at a material, equipment and device level.

Dr. Wilhelm H. Bruenger

Studied physics at the Universities of Hamburg and Tuebingen, getting his PhD degree on the field of electron interferometry. For 2 years he worked as visiting scientist at the IBM – Thomas Watson Research Center, Yorktown Heights,NY, on the field of e-beam testing. Since 1981 he is with the Fraunhofer Institute for Silicon Technology where he is head of the e-beam and ion projection lithography group.

 

Invited Special Sessions

The Conference Programme will include two sessions with invited contributions:

• EC projects: papers reporting the latest research results of major FP6 projects in the area of 4M Technologies and Applications
  
  
  • MASMICRO, Mass-manufacture of Miniature/Micro-Products
    "A dynamics-driven approach to precision machines design for micro-manufacturing and its implementation perspectives"
    Prof. Kai Cheng, Leeds Metropolitan University, UK

  
  

  • SEMOFS, Surface Enhanced Micro Optical Fluidic Systems
    "A New Technology Platform for Fully Integrated Polymer based Micro Optical Fluidic Systems"
    Dipl-Ing. Jorg Nestler, Chemnitz University, Germany

  
  

  • NANOFUNPOLY, Nanostructured and Functional Polymer-Based Materials and Nonocomposities
    "An Innovation tool for Nanostructured Polymer materials and Nanocomposites"
    Prof. Jean Francois Gerald, INSA-LYON, France

  
  

  • SMART SSA Project
    "Material science and technogy roadmapping in the SMART SSA project"
    Pierre Juliet,CEA, France





• Market studies on 4M Technologies and Applications
  
  
  
  • 4M NoE
    "A roadmapping study in Multi-Material Micro Manufacture"
    Dr. Bernard Peat, MEC, UK

  
  

  • IDTechnEx
    "Market Forecasts for Roll-to-roll Electronics Manufacturing"
    Mr. Dan Lawrence, IDTechEx, UK

  
  

  • YOLE Développement
    "2003-2009 SiC market analysis for material, components and application"
    Mr. Philippe Roussel, PhD. YOLE, France

  
  

  • IVAM Microtechnology Network
    "SME’s Perspectives: 4M current capabilities and future requirements"
    Dr. Christine Neuy, IVAM, Germany
 

Invited Talks

The Conference Programme will include six invited keynote speakers:

• "Micro- and nano- structuring using Ion beams"
  Dr. Wilhelm Bruenger, Fraunhofer-ISiT, Germany




• “Automatic Nanohandling Station inside an SEM”
  Prof. Sergej Fatikow, University of Oldenburg, Germany




• “Recent Evolution of Electrical Discharge Machining”
  Prof. Naotake Mohri, University of Tokyo, Japan




• “Micromoulding - precision processing for controlled structure products”
  Prof. Phil Coates, University of Bradford, UK




• “Microfluidics : technologies, markets, business trends and expected evolution”
  Dr. Geraldine Andrieux, Yole, France




• Lab on a Chip" Advances in packaging for MEMS and Lab on a Chip”
  Dr. Fabien Sauter, CEA-LETI, France
To view the abstracts of the invited speakers, please click: Abstract

 

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Presentation Guidelines

Oral Presentation

Each participant will be allowed 15 minutes per presentation and at the end of the each session will be 10 minutes question time. Session chairs will make sure the schedule is respected.

In order to avoid technical and connection problems and the corresponding loss of time, a laptop will be provided by the organisers. Presentations must be saved on memory stick or CD in PowerPoint format exclusively (version 2002 or earlier but no earlier than 97) and pass on it to the technician during the registration on 20th September 2006. Please note that the papers must be presented by one of the authors and presentation can not be amended after above date. If you need any special facilities for your oral presentation, please consult the organiser as soon as possible but no later than by 31st August 2006.

The language of the conference will be English and no translation facilities will be provided. Only one oral and/or one poster presentation will be accepted from each participant.

4M2006 reserves the right to cancel a presenter’s poster session if the above requirements are not met.

Detailed conference programme for session times and room numbers will be available nearer the time.

Poster Presentation

Poster information

Poster Presentation Presenters must be available to discuss their displays throughout the Conference. Presenters can display their poster on the first day and have it displayed for the first two days. Authors may bring extra copies of their work to be used for handouts. The room numbers will be available nearer the time.

Poster material

The Poster Board/Panels for each presentation will be available, with approximate dimensions 90 cm wide and 116 cm high. Each poster board/panel is marked with a number on the upper left corner. Poster is recommended to be in A0 format, however the total space available for your poster is (app. 184cm x 89 cm). The presenter must provide pushpins to attach materials to the display board, along with any other supplies.

All posters must be in English with the paper title (2.5cm), author names and affiliations (1.5 cm) and the text easily readable. Poster should include introduction, development and conclusion with a contact point.

Illustration layout

Drawings, diagrams and photos are extremely helpful and often necessary to display results and conclusions. Please do not overload any chart or drawing with information.

The Organising Committee reserves the right to cancel a presenter’s poster session if the above requirements are not met.

 

Programme

Day 1: Wednesday, 20-Sept-06

Time
08:00h to 09:00h	Registration
09:00h to 09:45h	Opening J-C. Guibert, Director of Minatec B.Fillon, Conference Chair G. Fioraso, French political invited speaker
09:50h to 11:05h	Invited Talks
11:05h to 11:35h	Coffee Break/Poster Session
11:35h to 12:45h	Session 1 Process characterisation	Session 2 Components
12:45h to 13:45h	Lunch/Poster Session
13:45h to 15:15h	Session 3 Marketing/Roadmapping
15:15h to 15:45h	Coffee Break/Poster Session
15:45h to 17:00h	Panel Discussion 4M Industrial Board
19:00h to 22:30h	Banquet Chateau de la Baume

Day 2: Thursday, 21-Sept-06

Time
08:30h to 09:45h	Invited Talks
09:45h to 10:15h	Coffee Break/Poster Session
10:15h to 10:30h	H. Pedersen EC "Micro/Nano Manufacturing in FP7"
10:30h to 11:30h	Panel Discussion 4M Scientific Board
11:30h to 11:45h	Coffee Break/Poster Session
11:45h to 13:00h	Session 4 Novel materials	Session 5 Modelling/simulation
13:00h to 14:00h	Lunch/Poster Session
14:00h to 15:30h	Session 6 EC Projects
15:30h to 16:00h	Coffee Break/Poster Session
16:00h to 17:15	Session 7 Metrology	Session 8 Systems
19.00h to 20.30h	A cocktail reception hosted by the Mayor of Grenoble at Grenoble Museum

Day 3: Friday, 22-Sept-06

Time
09:00h to 10:15h	Invited Talks
10:15h to 10:45h	Coffee Break/Poster Session
10:45h to 12:00h	Session 9 Process characterisation	Session 10 Components
12:00h to 13:00h	Lunch/Poster Session

Please note that the Posters will be displayed from Wed 20th to Fri 22nd September 2006.

 

Day 1: Wednesday, 20-Sept-06

• Invited Talk

08:00h - 09:00h
Registration
09:00h to 09:45h
Opening J-C. Guibert, Director of Minatec B.Fillon, Conference Chair G. Fioraso, French political invited speaker
09:50h to 11:05h
Keynote Speakers Chair: B. Fillon, CEA/LITEN, France Micromoulding – Precision Processing for Controlled Products P. Coates, School of Engineering, Design & Technology, University of Bradford, UK Automatic Nanohandling Station inside a Scanning Electron Microscope S. Fatikow, Division Microrobotics and Control Engineering, University of Oldenburg, Germany
11:05h to 11:35h
Coffee Break/Poster Session
11:35h to 12:45h
Session 1 Process characterisation Chair: A. Schoth, IMTEK, Germany Micro-Injection Moulding: Factors Affecting the Replication Quality of Micro Features B. Sha, The Manufacturing Engineering Centre, Cardiff University, UK S. Dimov, The Manufacturing Engineering Centre, Cardiff University, UK C. Griffiths, The Manufacturing Engineering Centre, Cardiff University, UK M. S. Packianather, The Manufacturing Engineering Centre, Cardiff University, UK Microfluidics on foil T. Velten, Fraunhofer Institute for Biomedical Engineering (IBMT), Germany M. Richter, Fraunhofer Institute for Reliability and Microintegration (IZM), Germany G. Klink, Fraunhofer Institute for Reliability and Microintegration (IZM), Germany K. Bock, Fraunhofer Institute for Reliability and Microintegration (IZM), Germany C. Khan Malek, Laboratoire FEMTO-ST/Dpt. LPMO, UMR CNRS, France S. Polster, Bayrisches Laserzentrum, Erlangen, Germany P. Bolt, TNO Science & Industry, The Netherlands Large Area Plastic Replication with Modular Molding Tools M. Heckele, Institute for Microstructure Technoloyg (IMT), Karlsruhe Research Centre, Germany C. Mehne, Institute for Microstructure Technology, University of Karlsruhe, Germany R. Steger, IMTEK, Lab for MEMS Applications, University of Freiburg, Germany P. Koltay, IMTEK, Lab for MEMS Applications, University of Freiburg, Germany D. Warkentin, Hahn-Schickhard Institute for Microassembly Technology (HSG-IMAT), Germany Microforming of titanium – forming behaviour at elevated temperature B. Eichenhüller, University of Erlangen-Nuremberg, Germany U. Engel, University of Erlangen-Nuremberg, Germany	Session 2 Components Chair: M. Richter, IZM, Germany Polymer Based Multifunctional 3D-Packages for Microsystems W. Eberhardt, Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT, Germany D. Ahrendt, Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT, Germany U. Keßler, Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT, Germany D. Warkentin, Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT, Germany H. Kück, University of Stuttgart, Institute for Micro and Precision Engineering, Germany Dimensional tolerances of micro precision parts made by ceramic injection moulding M. Beck, Institute for Materials Research III, Forschungszentrum Karlsruhe Gmb, Germany V. Piotter, Institute for Materials Research III, Forschungszentrum Karlsruhe Gmb, Germany R. Ruprech, Institute for Materials Research III, Forschungszentrum Karlsruhe Gmb,Germany J. Haußelta, Institute of Microsystem Technology (IMTEK), University of Freiburg, Germany Automated tool exchange for ultraprecision diamond milling and turning applications C. Brecher, Fraunhofer-Institute for Production Technology IPT, Germany S. Lange, Fraunhofer-Institute for Production Technology IPT, Germany F. Niehaus, Fraunhofer-Institute for Production Technology IPT, Germany C. Wenzel, Fraunhofer-Institute for Production Technology IPT, Germany Membrane-less mass flow micro sensor T. Velten, Fraunhofer Institute for Biomedical Engineering (IBMT), 66386 St. Ingbert, Germany H. Schuck, Fraunhofer Institute for Biomedical Engineering (IBMT), 66386 St. Ingbert, Germany T. Knoll, Fraunhofer Institute for Biomedical Engineering (IBMT), 66386 St. Ingbert, Germany N.Graf, Fraunhofer Institute for Biomedical Engineering (IBMT), 66386 St. Ingbert, Germany W. Haberer, Fraunhofer Institute for Biomedical Engineering (IBMT), 66386 St. Ingbert, Germany
12:45h to 13:45h
Lunch/Poster Session
13:45h to 15:15h
Session 3 Market Studies Chair: B. Fillon, CEA/LITEN, France A roadmapping study in Multi-Material Micro Manufacture B. Peat, The Manufacturing Engineering Centre, Cardiff University, UK Market Forecasts for Roll-to-roll Electronics Manufacturing D.P. Lawrence, IDTechEx, Ltd. UK 2003-2009 SiC market analysis for material, components and applications J-C Eloy, YOLE DEVELOPPEMENT, France SME’s Perspectives: 4M current capabilities and future requirements C. Neuy, IVAM Microtechnology Network, Germany
15:15h to 15:45h
Coffee Break/Poster Session
15:45h to 17:00h
Panel Discussion 4M Industrial Board Chair: B. Fillon, CEA/LITEN, France and W. Menz, Germany C. Hanisch, Festo, Germany R. Wimberger-Friedl, Phillips Research Laboratories, The Netherlands D. Ulieru, Romes - SA, Romania J. Anjeby, Saab Ericsson Space AB, Sweden L. Cuccaro, AVIO, Italy U. Ljungblad, Micronic Laser Systems, Sweden D. Lawrence, IDTechEx, UK M. Knowles, Oxfrod Lasers, UK
19:00h to 22:30h
Banquet Chateau de la Baume

 

Day 2: Thursday, 21-Sept-06

08:30h - 09:45h
Keynote speakers Chair: W. Menz, Germany Microfluidics: technology, market and business trends. What evolution is expected? G. Andrieux, YOLE Développement, France Lab on a Chip : Advances in packaging for MEMS and Lab on a Chip F. Sauter-Starace, CEA, LETI, Department Microtechnology for Biology and Health-care, France
09:45h - 10:15h
Coffee Break/Poster Session
10:15h - 10:30h
H. Pedersen EC Micro/Nano Manufacturing in FP7
10:30h - 11:30h
Panel Discussion 4M Scientific Board Chair: W. Menz, Germany and S. Dimov, MEC, UK S. Faticow, University of Oldenburg, Germany A. Dietzel, TU Eindhoven, Netherlands N. Mohri , University of Tokyo, Japan G. Andrieux,Yole, France F. Sauter, CEA-LETI, France P. Coates, School of Engineering, Design & Technology, University of Bradford UK
11:30h - 11:45h
Coffee Break/Poster Session
11:45h - 13:00h
Session 4 Novel materials Chair: P. Johander, IVF, Sweden Characterization of Molecularly Imprinted Polymers as Novel Materials for Biochemical Sensors N. Hosseinia, MC2, Chalmers Univ. of Technology, Sweden C. Rusu, Imego AB, Sweden A. Krozea, Imego AB, Sweden S. Haasl, Imego AB, Sweden K. Reimhult, Imego AB, Sweden J-O Lindgren, Imego AB, Sweden P. Enoksson, MC2, Chalmers Univ. of Technology, Sweden L. Yec, Applied Biotechnology, Lund University, Sweden Indirect Tooling Based on Micromilling, Electroforming and Selective Etching P.T. Tang, Technical University of Denmark, Denmark J. Fugl, Technical University of Denmark, Denmark L. Uriarte, Fundacion Tekniker, Spain G. Bissacco, Technical University of Denmark, Denmark H.N. Hansen, Technical University of Denmark, Denmark An Ultrathick SU-8 UV Lithographic Process and Sidewall Characterization K Jiang1, Centre for MicroEnigineering and NanoTechnology, The University of Birmingham, U.K C-H Lee, Centre for MicroEnigineering and NanoTechnology, The University of Birmingham, U.K P. Jin, Centre for MicroEnigineering and NanoTechnology, The University of Birmingham, U.K Influence of the process parameters on themicrostructure of screenprinted Ba0.6Sr0.4TiO3 (BST60) thick-films on alumina-substrates F. Paul, Forschungszentrum Karlsruhe, Institute for Materials Science III, Germany J.R. Binder, Forschungszentrum Karlsruhe, Institute for Materials Science III, Germany A. Berto, Forschungszentrum Karlsruhe, Institute for Materials Science III, Germany G. Link, Forschungszentrum Karlsruhe, Institute for Materials Science III, Germany H.-J. Ritzhaupt-Kleissl, Forschungszentrum Karlsruhe, Institute for Materials Science III, Germany	Session 5 Modelling/simulation Chair: U. Engel, Erlangen, Germany Modelling and simulation of piezoelectric actuation and reliability of micropumps Meiling Zhu, School of Industrial and Manufacturing Science, Cranfield University, UK Paul B. Kirby, School of Industrial and Manufacturing Science, Cranfield University, UK Martin Richter, Fraunhofer Institute for reliability and microintergration (IZM), Germany Yucel Congar, Fraunhofer Institute for reliability and microintergration (IZM), Germany Alexander Diehl, Chair of Manufacturing Technology, University Erlangen-Nuremberg, Germany Ralf Voelkl, Chair of Manufacturing Technology, University Erlangen-Nuremberg, Germany Mechanistic Modelling of the Micro- End Milling Operation L. Uriarte, Fundación Tekniker, Spain S. Azcarate, Fundación Tekniker, Spain A. Herrero, Fundación Tekniker, Spain L.N. Lopez de Lacalle, Dpto. Ing. Mecanica, ETSII, Spain A. Lamikiz, Dpto. Ing. Mecanica, ETSII, Spain Design procedure of planar compliant microgrippers with flexural joints F. Székely, Budapest University of Technology and Economics, Hungary T. Szalay, Budapest University of Technology and Economics, Hungary Finite Element Analysis of Glass Moulding C. Brecher, Fraunhofer Institute for Production Technology IPT, Germany M. Winterschladen, Fraunhofer Institute for Production Technology IPT, Germany S. Lange, Fraunhofer Institute for Production Technology IPT, Germany F. Klocke, Fraunhofer Institute for Production Technology IPT, Germany G. Pongs, Fraunhofer Institute for Production Technology IPT, Germany F. Wang, Fraunhofer Institute for Production Technology IPT, Germany
13:00h - 14:00h
Lunch/Poster Session
14:00h - 15:30h
Session 6 EC Projects Chair: S.Dimov, MEC, UK A dynamics-driven approach to precision machines design for micro-manufacturing and its implementation perspectives K. Cheng, Leeds Metropolitan University, UK A New Technology Platform for Fully Integrated Polymer based Micro Optical Fluidic Systems J. Nestler, Chemnitz University, Germany An Innovation tool for Nanostructured Polymer materials and Nanocomposites J.F. Gerald, INSA-LYON, France Material science and technogy roadmapping in the SMART SSA project P. Juliet,CEA, France
15:30h - 16:00h
Coffee Break/Poster Session
16:00h - 17:15
Session 7 Metrology Chair: L. Mattson, KTH, Sweden Measurement and characterisation of the microtopography in the contact area between workpiece and tool in microforming S. Weidel, University of Erlangen-Nuremberg, Germany U. Engel, University of Erlangen-Nuremberg, Germany Repeatability analysis of two methods for height measurements in the micrometer range C. Ferri, The Manufacturing Engineering Centre, Cardiff University,UK E. Brousseau, The Manufacturing Engineering Centre, Cardiff University,UK S. Dimov, The Manufacturing Engineering Centre, Cardiff University,UK L. Mattsson, Department of Production Engineering, Royal Institute of Technology, Sweden Comparison of the control of laser striation on lamellar cast iron with various techniques C. Vincenta, Institut FEMTO-ST, France G. Monteil, Laboratoire de Microanalyse des Surfaces, France T. Barrière, Institut FEMTO-ST, France J.C. Gelin, Institut FEMTO-ST, France Localizing micro-defects on rough metal surfaces. A. Témun, Dep. of Production Engineering, KTH – Royal Institute of Technology, Sweden L. Mattsson, Dep. of Production Engineering, KTH – Royal Institute of Technology, Sweden I. Heikkilä, KiMAB, Sweden	Session 8 Systems Chair: E. Jung, IZM, Germany Low Cost Capacitive Inclination Sensors based on selectively metallized polymer Benz Daniel, Institut für Zeitmesstechnik, Fein- und Mikrotechnik, Universität Stuttgart, Germany Botzelmann Tim, Hahn-Schickard-Gesellschaft, Institut für Mikroaufbautechnik, Germany Kück Heinz, Institut für Zeitmesstechnik, Fein- und Mikrotechnik, Universität Stuttgart, Germany Warkentin Danie, Hahn-Schickard-Gesellschaft, Institut für Mikroaufbautechnik, Germany High resolution low cost optical angular resolver V. Mayer, Hahn-Schickard-Gesellschaft, Institute for Micro Assembly Technology, Germany D. Warkentin, Hahn-Schickard-Gesellschaft, Institute for Micro Assembly Technology, Germany H. Kück, Hahn-Schickard-Gesellschaft, Institute for Micro Assembly Technology, Germany All Polymer Electrochemical Sensor M.Bengtsson, Department for Micro- and Nanotechnology, Technical University of Denmark, Denmark G.Thrastardottir, Department for Micro- and Nanotechnology, Technical University of Denmark, Denmark T.S.Hansen, Department of Chemical Engineering, Technical University of Denmark, Denmark O.Geschke, Department for Micro- and Nanotechnology, Technical University of Denmark, Denmark Polymer optical micro-array sensor P.J. Bolt, TNO Science & Industry, The Netherlands R. de Zwart, TNO Science & Industry, The Netherlands R. Houben, TNO Science & Industry, The Netherlands G. van Heck, TNO Science & Industry, The Netherlands F. Dennard, TNO Science & Industry, The Netherlands P. Rensing, TNO Science & Industry, The Netherlands J. van Veen, TNO Quality of Life, The Netherlands B. Langeveld, Holst Centre, The Netherlands M. Koetse, Holst Centre, The Netherlands H. Schoo, Holst Centre, The Netherlands
19:00h - 20.30h
A cocktail reception hosted by the Mayor of Grenoble at Grenoble Museum

 

Day 3: Friday, 22-Sept-06

09:00h - 10:15h
Keynote speakers Chair: S. Dimov, MEC, UK Recent Evolution of Electrical Discharge Machining N. Mohri, Department of Precision Machinery Engineering, The University of Tokyo, Japan Micro- and nano- structuring using Ion beams Dr. Wilhelm Bruenger, Fraunhofer-ISiT, Germany
10:15h - 10:45h
Coffee Break/Poster Session
10:45h to 12:00h
Session 9 Process Characterisation Chair: A. Schoth, IMTEK, Germany Mechanical properties and bending behaviour of metal foils A. Diehl, University of Erlangen-Nuremberg, Germany U. Engel, University of Erlangen-Nuremberg, Germany M. Geiger, University of Erlangen-Nuremberg, Germany Adapting ECF to steels used for micro mould inserts L. Staemmler, Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT), Germany K. Hofmann, University of Stuttgart, Institute of Micro- and Precision Engeneering (IZFM), Germany M.-H. Kim, University of Stuttgart, Institute of Micro- and Precision Engeneering (IZFM), Germany D. Warkentin, Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT), Germany H. Kück, University of Stuttgart, Institute of Micro- and Precision Engeneering (IZFM), Germany A Comparative Study of Three Technologies for Producing Castings with Micro/Meso-scale Features J-F. Charmeux, Manufacturing Engineering Center, Cardiff University, UK R. Minev, Manufacturing Engineering Center, Cardiff University, UK S. Dimov, Manufacturing Engineering Center, Cardiff University, UK E. Minev, Manufacturing Engineering Center, Cardiff University, UK U. Harrysson, Fcubic, Sweden Influence of EDM machining on surface integrity of WC-Co M.R Shabgard, Manufacturing Engineering Centre, Cardiff University, UK A. Ivanov, Manufacturing Engineering Centre, Cardiff University, UK A. Rees, Manufacturing Engineering Centre, Cardiff University, UK	Session 10 Components Chair: M. Richter, IZM, Germany Surface micromachined three-dimentional solenoid-type inductor D-M. Fang, Institute of Micro and Nano Science & Technology, China Y. Zhou, Institute of Micro and Nano Science & Technology, China W. Ding, Institute of Micro and Nano Science & Technology, China X-N. Wang, Institute of Micro and Nano Science & Technology, China X-L. Zhao, Institute of Micro and Nano Science & Technology, China Development of a MID LED housing R. M. de Zwart, TNO Science & Industry, The Netherlands R. A. Tacken, TNO Science & Industry, The Netherlands P.J. Bolt, TNO Science & Industry, The Netherlands Micropart manipulation by electrical fields for highly parallel batch assembly P. Lazarou, University of Patras, Greece N.A. Aspragathos, University of Patras, Greece E. Jung, Chip Interconnection Technologies, Fraunhofer IZM, Germany Laser Micro-milling of Ceramics, Dielectrics and Metals using nanosecond and picosecond lasers M.R.H Knowles, Oxford Lasers Ltd, UK G. Rutterford, Oxford Lasers Ltd, UK D. Karnakis, Oxford Lasers Ltd, UK T. Dobrev, MEC, Cardiff University, UK P.Petkov, MEC, Cardiff University, UK S.Dimov, MEC, Cardiff University, UK
12:00h - 13:00h
Lunch/Poster Session

 

Poster Presentations

Session 1 – Process characterisation
Laser polishing T. Dobrev, Manufacturing Engineering Centre, Cardiff University, UK D.T Pham, Manufacturing Engineering Centre, Cardiff University, UK S. Dimov, Manufacturing Engineering Centre, Cardiff University, UK Challenging the sustainability of micro products development A. De Grave, Technical University of Denmark, Denmark S.I. Olsen, Technical University of Denmark, Denmark Process parameter analysis on surface roughness and process forces in micro cutting J. Fleischer, Institute of Production Science (wbk),Universität Karlsruhe (TH), Germany G. Lanza, Institute of Production Science (wbk),Universität Karlsruhe (TH), Germany M. Schlipf, Institute of Production Science (wbk),Universität Karlsruhe (TH), Germany J. Kotschenreuther, Institute of Production Science (wbk),Universität Karlsruhe (TH), Germany J. Peters, Institute of Production Science (wbk),Universität Karlsruhe (TH), Germany On the use of hot embossing for the reproduction of the surface topography of mould microreliefs M. Sahli, Laboratoire de Microanalyse des Surfaces (LMS),Laboratoire FEMTO-ST, France C. Millot, Laboratoire de Microanalyse des Surfaces (LMS), France C. Roques-Carmes, Laboratoire de Microanalyse des Surfaces (LMS), France C. Khan Malek, Laboratoire FEMTO-ST, France J.C. Gelin, Laboratoire FEMTO-ST, France Application of SOI based sensors for MEMS wafer-level packaging F. Ghavanini, Chalmers University of Technology, Sweden C. Rusu, The Imego Institute. Sweden K. Persson, The Imego Institute. Sweden P. Enoksson, Chalmers University of Technology, Sweden Protective Coating of Zinc and Zinc Alloys for Industrial Applications Y. Toshev, Bulgarian Academy of Sciences (BAS), Bulgaria V. Mandova, TDP Group Ltd, Sofia, Bulgaria N. Boshkov, Bulgarian Academy of Sciences (BAS), Bulgaria D. Stoychev, Bulgarian Academy of Sciences (BAS), Bulgaria P. Petrov, Bulgarian Academy of Sciences (BAS), Bulgaria N. Tsvetkova, Bulgarian Academy of Sciences (BAS), Bulgaria G. Raichevski, Bulgarian Academy of Sciences (BAS), Bulgaria Ch. Tsvetanov, Bulgarian Academy of Sciences (BAS), Bulgaria A. Gabev, Gabex Ltd, Sofia, Bulgaria R. Velev, TDP Group Ltd, Sofia, Bulgaria K. Kostadinov, Bulgarian Academy of Sciences (BAS), Bulgaria Size effects in the production of micro strip by the flat rolling of wire K. van Putten, Metal Forming Institute, RWTH Aachen University, Germany R. Kopp, Metal Forming Institute, RWTH Aachen University, Germany G. Hirt, Metal Forming Institute, RWTH Aachen University, Germany Manufacturing and characterization of water repellent surfaces A. De Grave, Technical University of Denmark, Denmark P. Botija, Technical University of Denmark, Denmark H.N. Hansen, Technical University of Denmark, Denmark P.T. Tang, Technical University of Denmark, Denmark Experimental study on the free-sintering process of a micro-porous HDPE membrane D.B. Trifonov, Institute of Information Technologies, Bulgarian Academy of Sciences, Bulgaria Y.E. Toshev, Institute of Information Technologies, Bulgarian Academy of Sciences, Bulgaria Hybrid Tooling: A Review of Process Chains for Tooling Microfabrication within 4M S. Azcarate, Fundación Tekniker, Spain L. Uriarte, Fundación Tekniker, Spain S. Bigot, School of Engineering, Cardiff University, UK P. Bolt, TNO Industrial Technology, The Netherlands L. Staemmler, HSG-IMAT, Germany G. Tosello, Department of Manufacturing Engineering and Management, DTU, Denmark S. Roth, The Bayerisches Laserzentrum, BLZ, Germany A. Schoth, IMTEK, University of Freiburg, Germany
Session 2 – Components
Force fields with one stable equilibrium for micropart 2D manipulation E.K. Xidiasa, University of Patras, Greece N.A. Aspragathosa, University of Patras, Greece Laser transmission welding of micro plastics parts E. Haberstroh, Institute of Plastics Processing (IKV), Germany W.-M. Hoffmann, Institute of Plastics Processing (IKV), Germany Developments in Micro Ultrasonic Machining (MUSM) J. Boy, FEMTO-ST/LCEP, France M. Aiguillé, TEMIS Innovation (Projet µUSM, France A. Boulouize, TEMIS Innovation (Projet µUSM, France C. Khan-Malek, FEMTO-ST / LPMO, France Manufacture of recessed rotating microelectrodes for mass transport investigations in the LIGA process M. Lisinenkova, Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe GmbH, Germany L. Hahn, Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe GmbH, Germany J. Schulz, Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe GmbH, Germany Fabrication of a solenoid-type inductor with electroplated NiFe magnetic Core by MEMS C. Lei, Institute of Micro and Nano Science & Technology, China W. Ding, Institute of Micro and Nano Science & Technology, China Y. Zhou, Institute of Micro and Nano Science & Technology, China X-Y Gao, Institute of Micro and Nano Science & Technology, China H Choi, Samsung Advanced Institute of Technology (SAIT), Korea J Won, Samsung Advanced Institute of Technology (SAIT), Korea The effects of material microstructure in micro-milling K. Popov, MEC, Cardiff University, UK S. Dimov, MEC, Cardiff University, UK D. T. Pham, MEC, Cardiff University, UK R. Minev, MEC, Cardiff University, UK A. Rosochowski, University of Strathclyde, UK L. Olejnik, Warsaw University of Technology, Poland M. Richert, AGH - University of Science and Technology, Poland Replication of micrometric pattern by hot embossing of silica based feedstock L. Federzoni, CEA-Grenoble, France O. Fourcade, CEA-Grenoble, France P. Lourdin, ECAM, France Off-Axis Machining of NURBS Freeform Surfaces by Fast Tool Servo Systems C. Brecher, Fraunhofer Institute for Production Technology IPT, Germany S. Lange, Fraunhofer Institute for Production Technology IPT, Germany M. Merz, Fraunhofer Institute for Production Technology IPT, Germany F. Niehaus, Fraunhofer Institute for Production Technology IPT, Germany M. Winterschladen, Fraunhofer Institute for Production Technology IPT, Germany Prototyping of multilayer waveguides with V-grooves in COC/Topas® F. Bundgaard, Technical University of Denmark, Denmark J. Ducrée, HSG-IMIT, Germany R. Zengerlec, Germany O. Geschke, Technical University of Denmark, Denmark An integrated solenoid-type inductor with Fe-based soft magnetic core C. Lei, Institute of Micro and Nano Science & Technology, China Y. Zhou, Institute of Micro and Nano Science & Technology, China W. Ding, Institute of Micro and Nano Science & Technology, China X-Y. Gao, Institute of Micro and Nano Science & Technology, China Y. Cao, Institute of Micro and Nano Science & Technology, China H. Choi, Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co, Korea J. Won, Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co, Korea In-process assembly of micro metal inserts in a polymer matrix G. Tosello, Technical University of Denmark, Denmark H. N. Hansen, Technical University of Denmark, Denmark Low Temperature Adhesive Bonding in MEMS D. Andrijasevic, Vienna University of Technology, Vienna W. Smetana, Vienna University of Technology, Vienna D. Esinenco, The National Institute for R&Development in Microtechnologies, Romania W. Brenners, Vienna University of Technology, Vienna Design and Manufacturing of Micro Heaters for Gas Sensors P. Johander, IVF- Industrial Research and Development Corporation, Sweden, I. Goenaga, Fundacion Tekniker, Micro and Nanotechnology Department, Spain D. Gomez, Fundacion Tekniker, Micro and Nanotechnology Department, Spain C. Moldovan, The National Institute for R&D in Microtechnologies, Romania O. Nedelcu, The National Institute for R&D in Microtechnologies, Romania P. Petkov, Manufacturing Engineering and Multidisciplinary Technology Centre, Cardiff University, Wales U. Kaufmann, Forschungszentrum Karlsruhe, Institut für Materialforschung III, Germany H.-J. Ritzhaupt-Kleissl, R. Dorey, Nanotechnology Group, Cranfield University, Cranfield, UK K. Persson, IMEGO, Sweden
Session 4 – Novel materials
Forming and machining of the nano-crystalline alloys Gy. Krállics, Budapest University of Technology and Economics, Hungary M. Horváth, Budapest University of Technology and Economics, Hungary J. Nyirőb, Budapest University of Technology and Economics, Hungary Micro EDM parameters optimisation S. Bigot, Manufacturing Engineering Centre, Cardiff University, UK J. Valentinčič, Faculty of Mechanical Engineering, University of Ljubljana, Slovenia O. Blatnik, Faculty of Mechanical Engineering, University of Ljubljana, Slovenia M. Junkar, Faculty of Mechanical Engineering, University of Ljubljana, Slovenia Hard Tooling by μEDM-milling for Injection Molding R. Jurischka, IMTEK, Laboratory for Process Technology University of Freiburg, Germany A. Schoth, for Process Technology University of Freiburg, Germany C. Müller, for Process Technology University of Freiburg, Germany D. Thiebaud, Sarix SA, Micro EDM Technology, Switzerland R. Gallera, Sarix SA, Micro EDM Technology, Switzerland H. Reinecke, for Process Technology University of Freiburg, Germany Modelling and design of GaN based piezoelectric MEMS C.R. Bowen, Materials Research Centre, Department of Mechanical Engineering, University of Bath, UK, D.W.E. Allsopp, Department of Electronic and Electrical Engineering, University of Bath, UK R. Stevens, Materials Research Centre, Department of Mechanical Engineering, University of Bath, UK, P.Shields, Department of Physics, University of Bath, UK W.N. Wang, Department of Physics, University of Bath, UK Systematic Interaction of Sedimentation and Electrical Field in Electrophoretic Deposition S. Bonnasa, IMTEK, University of Freiburg, Germany J. Tabellion, IMTEK, University of Freiburg, Germany H.-J. Ritzhaupt-Kleissl, Institute for Materials Research III, Forschungszentrum Karlsruhe,Germany J. Haußelt, Institute for Materials Research III, Forschungszentrum Karlsruhe,Germany Particle size dependent viscosity of polymer-silica-composites T. Hanemann, Albert-Ludwigs-Universität Freiburg, Institut f. Mikrosystemtechnik (IMTEK), Germany R. Heldele, Forschungszentrum Karlsruhe, Institut f. Materialforschung III, Germany J. Hausselt, Albert-Ludwigs-Universität Freiburg, Institut f. Mikrosystemtechnik (IMTEK), Germany Structuring of phosphorescent pigments by two-step hot embossing for signaletic applications M. Sahli, Laboratoire FEMTO-ST, Département LMARC, France F. Legay, Laboratoire de Microanalyse des Surfaces (LMS), France C. Roques-Carmes, Laboratoire de Microanalyse des Surfaces (LMS), France C. Khan Malek, Laboratoire FEMTO-ST, Département LPMO, France J.C. Gelin, Laboratoire FEMTO-ST, Département LMARC, France Fabrication of nano-dimensional features in FOTURAN using focused ion beam technology P.T. Docker, Department of Mechanical Engineering and Manufacturing, University of Birmingham, UK J Teng, Department of Mechanical Engineering and Manufacturing, University of Birmingham, UK P. D. Prewett, Department of Mechanical Engineering and Manufacturing, University of Birmingham, UK K. C. Jiang, Department of Mechanical Engineering and Manufacturing, University of Birmingham, UK Self-assembled nanostructured polymer films from concentrated solutions of block copolymers N. Didier, Ecole Nationale Supérieure de Physique de Grenoble, France P. Panine, European Synchrotron Radiation Facility, France
Session 5 – Modelling/Simulation
On Forces and Interactions at Small Distances in Micro and Nano Assembly Process D. Dantchev, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria K. Kostadinov, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria Unified Approach For Functional Task Formulation In Domain Of Micro/Nano Handling Operations. K. Kostadinov, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria R. Kasper, University “Otto-von Guericke” – Institute of Mobile systems, Germany T. Tiankov, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria M. Al-Wahab, University “Otto-von Guericke” – Institute of Mobile systems, Germany D. Chakarov, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria D. Gotseva, Technical University, Faculty of Computer Systems and Control, Bulgaria Thermally induced stresses in an adhesively bonded multilayer structure with 30-micron thick film piezoelectric ceramic and metal components R.Jourdain, School of Industrial and Manufacturing Science, Cranfield University, UK S.A.Wilson, School of Industrial and Manufacturing Science, Cranfield University, UK
Session 7 – Metrology
Mechanical Testing of Laser Welded Micro Seams C.B. Nielsen, Danish Technological Institute, Denmark D. Buccoliero, Danish Technological Institute, Denmark T. Ussing, Fluimedix ApS, Denmark Micro particle sizing by using of ray optics Monte Carlo code M.D. Mikrenska, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria P.I. Koulev, Institute of Mechanics, Bulgarian Academy of Sciences, Bulgaria J.-B. Renard, Laboratoire de Physique et Chimie de l'Environnement, France Fiber optic temperature sensor based on spectral transmitivity of CdTe Z.V. Djinovic, Vienna University of Technology, Austria M.C. Tomic, Institut Bezbednosti, Serbia and Montenegro S. Ivankovic, Institut Bezbednosti, Serbia and Montenegro A. Vujanic, Integrated Microsystems Austria, Austria Reactive magnetron sputtering deposited ITO thin films : influence of O2 admixture on microstructure and optical properties C. Secouard, CEA Grenoble, Laboratoire des Technologies des Surfaces, France C. Ducros, CEA Grenoble, Laboratoire des Technologies des Surfaces, France P. Roca i Cabarrocas, Laboratoire de Physique des Interfaces et des Couches Minces, France S. Noël, CEA Grenoble, Laboratoire des Composants Hybrides, France F. Sanchette, CEA Grenoble, Laboratoire des Technologies des Surfaces, France
Session 8 – Systems
Ultrasonic Plasticising for Micro Injection Moulding W. Michaeli, Institute of Plastics Processing at RWTH Aachen University, Germany D. Opfermann, Institute of Plastics Processing at RWTH Aachen University, Germany Micro EDM: Accuracy of on-the-machine dressed electrodes A. Rees, Manufacturing Engineering Centre, Cardiff University, U.K. S. Dimov, Manufacturing Engineering Centre, Cardiff University, U.K. A. Ivanov, Manufacturing Engineering Centre, Cardiff University, U.K. A. Herrero, Tekniker, Spain L.G. Uriarte, Tekniker, Avda, Spain Design and testing of a d31 mode piezoelectric unimorph for direct power generation by coupling with a microcombustor G. Liu, Nanotechnology Centre in the Department of Materials, Cranfield University, UK R.W. Whatmore, Tyndall National Institute, Cork, Ireland Water jet machining of MEDM tools O. Blatnik, University of Ljubljana, Slovenia H. Orbanic, University of Ljubljana, Slovenia C. Masclet, University of Grenoble, France H. Paris, University of Grenoble, France M. Museau, University of Grenoble, France J. Valentincic, University of Ljubljana, Slovenia B. Jurisevic, University of Ljubljana, Slovenia M. Junkar, University of Ljubljana, Slovenia Sensor-less measurement of rotational speed for piezoelectric micro-motors A. Venturi, School of Industrial and Manufacturing Science, Cranfield University,UK S. A. Wilson, School of Industrial and Manufacturing Science, Cranfield University,UK The micro-machining evaluation of non-metallic materials – by a fluid guided laser P. Snowdon, School of Engineering, Durham University, UK D. Wood, School of Engineering, Durham University, UK P. Maropoulos, Department of Mechanical Engineering, University of Bath, UK A Novel Protective Cover for Microcomponents A. Cvetanovic, Vienna University of Technology, Institute of Sensor and Actuator Systems, Austria A. Cvetanovic, Vienna University of Technology, Institute of Sensor and Actuator Systems, Austria D. Andrijasevic, Vienna University of Technology, Institute of Sensor and Actuator Systems, Austria I. Gioroudi, Vienna University of Technology, Institute of Sensor and Actuator Systems, Austria W. Brenner, Vienna University of Technology, Institute of Sensor and Actuator Systems, Austria Micro injection moulding: the effects of tool surface finish on melt flow behaviour C.A. Griffiths, Manufacturing Engineering Centre, Cardiff University, UK S. Dimov, Manufacturing Engineering Centre, Cardiff University, UK D.T. Pham, Manufacturing Engineering Centre, Cardiff University, UK Flow control for high-pressure micro hydraulics A.J.M. Moers, Department of Mechanical Engineering, Katholieke Universiteit Leuven, Belgium D. Reynaerts, Department of Mechanical Engineering, Katholieke Universiteit Leuven, Belgium

 

Programme Committee

Programme Committee



Dr. Bertrand Fillon, CEA/LITEN, France (Conference Chair)

Prof. Wolfgang Menz, Germany (Conference Co-Chair)

Prof. Stefan Dimov, Cardiff University, UK (Conference Co-Chair)

Dr. Andreas Schoth, IMTEK, University of Freiburg, Germany

Prof. Lars Mattsson, Royal Institute of Technology, Stockholm, Sweden

Mr. Erik Jung, The Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Prof. Ulf Engel, University of Erlangen-Nuremberg, Germany

Dr. Per Johander, IVF Industrial Research and Development Corporation, Sweden

Dr. Sven Carsten Lange, Fraunhofer Institute of Production Technology, Aachen, Germany

Dr. Martin Richter, The Fraunhofer Institute for Reliability and Microintegration, Munich, Germany

Dr Paul Kirby, University of Cranfield, UK


Conference Secretary

Jeanette Whyte

Manufacturing Engineering Centre, Cardiff University

Tel: +44-(0)29-20874641

Fax: +44-(0)29-20874880

E-mail: whytejc@NOSPAMcf.ac.uk


 

Registration Information

Registration Fees and form for Authors

	Paid before June, 9 2006
4M NoE Partners and Delegates from NMS & ACC	175 €
Non-partners in 4M NoE	325 €
Accompanying guest	50 €
Student fee	175 €

Please note that the registration form above is only for authors who have submitted a paper(s)to be filled. The registration deadline for author's is 9th June 2006. Payment made after this date may result in your paper not being included in the 4M2006 Proceedings.

Registration form for Authors

Registration Fees and form for Attendees

	Paid before August, 12 2006	Paid after August, 12 2006
4M NoE Partners and Delegates from NMS & ACC	175 €	225 €
Non-partners in 4M NoE	325 €	375 €
Accompanying guest	50 €	70€
Student fee	175 €	225 €

Please note that the registration form above is only for people who wish to attend the 4M2006 Conference and have not submitted a paper(s)to be filled. The registration deadline for attendees at the discounted price is 12th August 2006. Please note that after 12th August 2006 the prices will increase.

Registration form for attendees

Email, Fax or Post completed form with payment to:
Mrs M Matthews (4M Finance Officer), Manufacturing Engineering Centre, Cardiff University, Cardiff CF24 0YF, E-mail: matthewsm2@cardiff.ac.uk, Telephone: +44(029)20870253, Facsimile: +44(029)20874695

 

Scope

Micro-manufacturing is now a key value-adding element for many sectors of industry - and the predicted nanotechnology future will also be largely delivered by micro-technologies. The silicon-based microelectronics revolution of the late 20th Century is about to be overtaken in its scope. Micro- and nanomanufacturing technologies in the 21st Century need to be directed to take advantage of the variety of materials, components and knowledge-based technologies now emerging. These provide functionality and intelligence to highly miniaturised systems for personal, portable and wireless products, and sensors for health, environment and transport-related applications. The present suite of micro-technologies alone will not be able to meet the manufacturing demands for high-aspect-ratio structures, enhanced-force micro actuators, improved environmental resistance and high precision micro components. These are the biggest challenges to micro product development that also represent promising research and development areas for innovation and value creation. In this context, the main goal of the Conference is to provide a forum for experts from industry and academia to share the results of their in-depth investigations and engage in interdisciplinary discussions about the creation of manufacturing capabilities for:

o Product miniaturisation through innovative integration and development of knowledge-based technologies and production concepts (especially micro and nano) for processing of non-silicon materials.

o Prediction of product and process performance to reduce/manage the risk during product development and production, and reduce time to market for the next generation of microsystems-based products.

o Future product platforms to meet the requirements of the next generation of microsystems-based products, and of more stringent regulations and environmental legislation.

o Production scale-up to ensure an effective and efficient transfer of product and technology ideas from laboratories to serial production.

 

Sponsors

	Minatec, European Centre for Micro and Nano Technology, France The Minatec micro and nanotechnologies innovation center was founded by Grenoble IT and French Commission for Atomic Energy of Grenoble on January 18th, 2002, with support from the State and local government authorities. It works to bring together major organizations in the Grenoble area working in micro and nanotechnology development.
	Llywodraeth Cynulliad Cymru / Welsh Assembly Government, WAG, UK The Welsh Assembly Government are proud to sponsor the 2006 4M Network of Excellence on Multi-Material Micro Manufacture. Our Technology and Innovation Team support businesses and academia and encourage and recognise innovation to embrace the technological change needed to meet the competitive challenges of manufacturing in the 21st Century. The assistance we provide includes: Professional and impartial advice from specialist advisers Networking opportunities and strategic sector support Support for new product and process development Access to specialist equipment, facilities and expertise Links to internationally respected academic resources
	IBS Precision Engineering, France IBS Precision Engineering, specialised in precision engineering and high precision measurement in the field of micrometer and nanometre, offers a complete range of innovative products from sensor to complete measuring machine: Non-contact high resolution capacitive and eddy current sensors. Machine tool calibration and inspection systems. Real time dynamic measurement and analysis of linear and rotation axis. ISO norms. Porous media air bearings to get very high mechanical stability, stiffness and accuracy. ISARA. The most accurate 3D measuring machine of the market. Volumetric accuracy: 30 nm in the measuring range of 100 x 100 x 40 mm. Special turnkey machines for measurement of dimension, e.g. form, surface quality, roundness, diameter, circularity, thickness, positioning…with or without contact.
	SARIX SA, MICRO EDM TECHNOLOGY, LOSONE High precision 3D Micro EDM Milling Technology SARIX always at leading edge of the highest Micro-machining performance offers now a new Micro EDM machining concept, the 3D Micro EDM Milling Machining. Complete 3D cavities can be achieved down to real micro scale of 10 micron with accurate tolerance down to 0.3 micron within high surface finishing of Ra 50 Nano. With its reliable machine concept using in once the Micro-Drilling, Micro-sinking and the 3D Micro EDM Milling, SARIX contribute on the development of new high-tech products and Micro-device. Micro EDM is now utilized for high-performance applications in electronics, automotive, medical, textiles, aerospace, and industrial equipment. Difficult-to-machine materials such as titanium, hardened steel, tungsten carbide, PCD and even some ceramics can be machined by micro EDM on SARIX machines.
	Oxfordlasers, UK Oxford Lasers specialise in the integration of Laser Micro Machining Systems for a variety of applications where parts or features require to be fabricated on a micron scale. The systems offered employ lasers which range in wavelength from the UV through to the Infrared, with pulse lengths in either the nano, pico or femtosecond range. Materials capable of being processed range from metals and ceramics through to polymers and glasses using a variety of techniques, including drilling, milling, scribing and cutting. These lasers are integrated with vision or measuring systems, manual or automatic part handling, software and all necessary safety features.
	PLASTIPOLIS, France
	Ville de Grenoble, France The City of Grenoble encourages and supports innovation, source of creation and preservation of jobs and wealth. Grenoble benefits from a powerful environment favouring innovation: •First research centre after Paris, More than 60 000 students of which 12% are foreigners, 10 engineering schools, renowned universities 2 business schools, More than 20 000 public and private researchers, Exceptional facilities (European Synchrotron Radiation Facility, Laüe Langevin Institute, …) Examples of ambitious projects for innovation and job creation set up: •Minalogic: worldwide cluster, gathering 52 actors of industry, research, education and local authorities •Alliance: most important industrial investment of the last ten years, R&D common project involving Freescale, STMicroelectronics and Philips •Minatec: first European pole in micro and nanotechnologies, led by the CEA and the National Polytechnics Institute of Grenoble •Nanobio: European innovation pole dedicated to bio-nanotechnology, led by the CEA Grenoble and University of Sciences (UJF), in partnership with the Grenoble academic hospital.
	Conseil Général de l'Isère, France
	Grenoble Alpes Métropole, France
	Conseil Régional Rhône Alpes, France
	CEA/LITEN, France CEA/LITEN is developing all aspects of nanomaterials from manufacture and handling techniques through to safety considerations and applications. CEA/LITEN is developing all integration aspect through different generation of processes (PECVD, µ-replication,...).CEA/LITEN is especially focused on the study of nano-objects (nanotubes, nanowires, and super nets), nanopowders (advanced ceramics, nanotracers) and nanostructured surfaces. CEA/LITEN is also heavily involved in portable applications of µ-power sources (fuel cells, batteries, solar cells,...) making full use of the potential advantages of nanotechnology.
	The Manucacturing Engineering Centre, MEC, UK The Manufacturing Engineering Centre (MEC) is an award-winning R&D Centre of Excellence for Advanced Manufacturing and Information Technology. The ISO 9001:2000 accredited Manufacturing Engineering Centre (MEC) offers specialist services in Time Compression Technologies to companies of all sizes. The Manufacturing Engineering Centre (MEC) has an international reputation for its leading-edge research in Advanced Manufacturing and Information Technology spanning a broad spectrum of subjects.
	Innovative Manufacturing Research Centre, IMRC, UK

 

Submission of Full Papers

Important documents

• Guidelines for preparing full papers
• A MS Word template for preparing the camera ready manuscripts

Papers must follow the provided templates in order to be included in the Conference Proceedings

Submission Site for Full Papers

Submission site is now closed!

Author File Submission and Approval Steps

1. Go to the 4M2006 conference paper submission website"(Submission site is now closed!)
2. If it is your first visit, follow the New users link. Follow the on-site instructions
3. Otherwise login, providing your email-address password and the Conference Id - 4m2006.
4. Upload a full paper
5. Approve the PDF of submitted paper
6. Paper is released into Peer Review (for assessment by the referees)
7. A decision will be made (Accept with Revision or Reject) and emails will be sent out by the system to the authors
8. For those papers that revision has been requested authors may go through the process again of uploading their revised final paper
9. Authors who are invited to submit a revised full paper will re-enter the Author Submission site to upload a full paper
10. Approve the PDF of the revised full paper
11. Revised paper is released into Peer Review (for assessment by referees)
12. Programme Chairs and Themes Chairs will assess referees comments and make the decision on the full paper (Accept or Reject) and emails will be sent out by the system
14. Papers will be collected and processed for publication

The accepted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Conference Proceedings.

Questions may be sent by e-mail to: 4m_conference@*NOSPAM*4m-net.org

 

Themes

The below six sub-topics represent the intended topics of the thematic sessions of the Conference to which the authors are invited to submit papers

Novel materials: characterisation and processing

Process modelling and simulation

Process characterisation including process chains

Metrology: inspection and characterisation methods

Components: fabrication and assembly technologies

Systems: novel product and system designs

In addition, the Conference Programme will include two sessions with invited contributions:

EC projects: papers reporting the latest research results of major FP6 projects in the area of 4M Technologies and Applications

Market studies on 4M Technologies and Applications

 

Travel Directions

 

By car, coming from:

Geneva or Chambéry on A41 motorway

Take Rocade Sud ringroad and follow signs marked "Lyon par l'autoroute". Exit motorway at Europole turn-off and follow signs to Minatec

Lyon on A48 motorway

Exit motorway at Europole turn-off and follow signs to Minatec

By car - distance from Grenoble:

Lyon: 100 km
Geneva: 145 km
Torino: 240 km
Nice: 330 km
Paris: 570 km
Barcelona: 625 km


By plane:

Airport Lyon-St. Exupéry airport

- 1 hour drive by car.
- Taxi costs: approx. 140 € - Tel 0826 800 826
- Airport shuttle bus SATOBUS www.satobus.com (every hour hh.30 from 7.30 am to 21.30 pm directin Grenoble, every hour hh.00 from 5.00 am to 20.00 pm direction Lyon-St. Exupéry) - Tel + (33) 4 72 68 72 17

Airport Geneva-Cointrin

1,5 - 2 hours drive
Taxi costs: approx. 220 € - Tel + (41) 22 798 20 00


Airport Paris

Take the railway TGV directly to Grenoble railway station.
(From airport take the RER subway to gare de Lyon station and take the TGV to Grenoble).


Airport Grenoble Isère

35 min drive from Grenoble
Tel. (33) (0)4 76 65 55 32


By train

High Speed Train (TGV) Grenoble-Paris 3 hours – 7 trains every day (other TGV from Lille, Nantes,...)
Grenoble Gare SNCF -: Tel : + (33) (0)8.92.35.35.35 (registration) -www.sncf.fr
 

Abstracts



 

Invited Keynote Speakers

pid	abstract
PID180145	Lab on a Chip : Advances in packaging for MEMS and Lab on a Chip Dr. Fabien Sauter-Starace(a), C. Pudda(a), C. Delattre(a), H. Jeanson(a), C. Gillot(b), N. Sarrut(a), O. Constantin(a), R. Blanc(a) a: CEA, LETI, Department Microtechnology for Biology and Health-care, France b: CEA-LETI, Department Heterogeneous Silicon Integration, France Abstract In the field of bioMems or Lab on a Chip, one may have to handle fluid exchanges even at high pressure, moving parts, temperature sensitive probes. This specificity triggers huge packaging issues because most of the packaging techniques inherited from the microelectronic require thermal cycles at temperature above 350°C. In this paper, we first present the requirement of representative lab on chip projects carried out at the LETI in order to introduce two specific solutions of this field. Afterwards we present a brief review of the packaging processes used in the MEMS facilities eventually and introduce low temperature packaging processes developed at the CEA Leti to process lab on chip with MEMS and BioMEMS. We intend to develop robust and collective solutions (wafer level packaging). The first solution relies on a thin film approach develop for MEMS using silicon nitride cap on a sacrificial layer. The second one was especially designed for temperature sensitive lab on chips hence can be carried out at room temperature. Keywords: packaging, lab on chip, thin film, in line screen-printing
PID190079	Micro- and nano- structuring using ion beams A. Dietzela , W.H. Bruengerb, H. Loeschnerc, E. Platzgummerc a: Eindhoven University of Technology, 5600 MB Eindhoven, the Netherlands b: Fraunhofer Institute for Silicon Technology (ISiT), Fraunhoferstr. 1, D-25524 Itzehoe, Germany c: IMS Nanofabrication GmbH, Schreygasse 3, A-1210 Wien, Austria Abstract Ion beam techniques such as ion projection can be used to structure materials on micrometer and nanometer scales. It can complement current optical or e-beam lithography techniques for micro- or nanodevice fabrication. Besides ion beam lithography also direct ion beam structuring methods that do not rely on resist materials for the pattern transfer have been investigated. Local sputtering, magnetic nanopatterning and inducement of selective electroplating are examples for such resistless ion beam patterning techniques. A new type of instrument based on a parallel multibeam concept will allow combining high resolution with high throughput. Keywords: ion beam lithography, direct ion beam structuring, nanopatterning
PID203679	Micromoulding - Precision Processing for Controlled Products P D Coates, B R Whiteside, M T Martyn, R Spares, T Gough Polymer IRC/ Polymer CIC, School of Engineering, Design & Technology, University of Bradford, Bradford BD7 1DP, UK Abstract Micromoulding is an emerging field which has seen the evolution of conventional polymer injection moulding techniques for the manufacture of 3-dimensional components of sub-milligramme masses and/or microscale surface features. Micromoulding incurs extremely high strain rates and temperature gradients, particularly at the gate of the cavity. A range of issues associated with this, including high strain rate rheology of polymers (including experimental observation of in-cavity flows) and effects on orientation, residual stress and property developments, including surface replications have been explored in our laboratories and with collaborators. A major aim is to achieve controlled, repeatable dimensions and properties in micromoulded products, and to model this process - including molecularfeature models. The key factors determining control of precision products are discussed. Keywords: micromoulding, miniature, precision moulding
PID204302	Automatic Nanohandling Station inside a Scanning Electron Microscope S. Fatikow, Th. Wich, St. Kray, H. Hülsen, T. Sievers, M. Jähnisch, V. Eichhorn Division Microrobotics and Control Engineering, University of Oldenburg, D26111 Oldenburg, Germany Abstract Current research work on the development of an automated nanohandling cell in a scanning electron microscope (SEM) is presented. Two experimental setups are shown, in which nanohandling robots ooperate in the vacuum chamber of an SEM. A client-server control system that can integrate various microrobots and sensors has been developed and evaluated by automatic handling of TEM (transmission electron microscope) lamellae by two nanorobots. The robots are controlled in a closed-loop way by using images from several CCD cameras and from the SEM. Algorithms for real-time processing of noisy SEM images have been implemented and tested. The experiment on automatic handling of TEM lamellae inside an SEM is described. The other setup contains a nanohandling robot using the probe of an atomic force microscope (AFM) as an end-effector. The manipulation of individual multiwall carbon nanotubes (MW-CNTs) and the characterization of nanofilms by nanoindentation are the applications being investigated. The experimental setup includesf a nanopositioning piezo sample stage with three degrees of freedom (DoF) and a three-axes nanomanipulator. Piezoresistive AFM probes are applied as an end-effector. This way the acting forces can be detected allowing force feedback for the station's control system. First investigations have been carried out by bending of MWNTs and calculating their elastic modulus. Keywords: microrobotics, nanohandling automation, SEM image processing, nanocharacterization
PID208010	Recent Evolution of Electrical Discharge Machining N. Mohri(a), T. Tani(b) a: Department of Precision Machinery Engineering, The University of Tokyo, Tokyo, Japan b: Tsukuba University of Technology, Tsukuba, Japan Abstract Electrical Discharge machining (EDM) is a comparatively new machining method which has several decades of history since it has been invented. At its beginning, it was developed as a precision machining method for hard materials. In recent years, several researches and methods based on the electrical discharge phenomena have been proposed. Mirror like finish machining, surface modification of mold die, machining of insulating materials and micro products manufacturing are noted among these researches and methods in the EDM field. These methods are particularly concerned with control of surface characteristics of the work piece and with control of electrode motion. In this paper, we introduce and discuss surface machining methods, insulating ceramics machining by EDM and micro EDM with which we have been associated. Keywords: Electrical discharge machining, Finishing, Surface modification, Insulating ceramics, Micro EDM

 

EU Projects (invited contributions)

pid	abstract
PID190055	A dynamics-driven approach to precision machines design for micro-manufacturing and its implementation perspectives D.H. Huo, K. Cheng AMTRG, School of Technology, Leeds Metropolitan University, Leeds LS1 3HE, UK Abstract Precision machines are essential elements in fabricating high quality micro product or micro feature and directly affect the machining accuracy, repeatability and efficiency. Some design issues of precision machines are presented in this paper, and emphasis is placed on the mechanical and structural design of precision machine and relevant design methodology. In the discussion of mechanical and structural design of precision machine, particular emphasis is placed on the machining dynamics issue to identify the major structural factors affecting the performance of the machining. This paper begins with a brief review of the design principles of precision machine tools, including tool-workpiece loops and machine tool vibration, and stiffness, mass and damping issues with emphasis in the machining dynamics; Then design processes of precision machine are discussed; And finally two case studies about design of a fast tool servo system and a 5-axis micro milling machine tool are given. Keywords: precision machines, machining dynamics, design, modelling
PID205496	A new technology platform for fully integrated polymer based micro optical fluidic systems J. Nestler(a), K. Hiller(a), T. Gessner(a), L. Buergi(b), J. Soechtig(b), R. Stanley(b), G. Voirin(b) , S. Bigot(c), J. Gavillet(d), S. Getin(d), B. Fillon(d), M. Ehrat(e), A. Lieb(e), M.-C. Beckers(f), D. Dresse(g) a: Center for Microtechnologies, Chemnitz University of Technology, Chemnitz, Germany b: CSEM Centre Suisse d'Electronique et de Microtechnique SA, Zurich, Switzerland c: Cardiff University, Cardiff, United Kingdom d :Comissariat à l'énergie atomique (CEA), Grenoble, France e: Zeptosens - a division of Bayer (Schweiz) AG, Witterswil, Switzerland f: Eurogentec S.A.,Seraing, Belgium g: Centre Hospitalier Regional de la Citadelle, Liège, Belgium Abstract This paper describes a new technology platform for polymeric micro optical fluidic systems. The platform consists of active and passive optical and fluidic elements for a surface plasmon resonance (SPR) biosensor for the detection of proteins. The platform includes the integration of polymer light emitting diodes, polymer photodiodes as well as polymer based fluidic valves and pressure generation elements. Surface functionalization for micro optical and micro fluidic parts as well as advanced manufacturing methods are other important parts of the presented technology platform. Keywords: Lab-on-Chip, Point-of-Care, Micro Optics, Micro Fluidics, Surface Plasmon Resonance, polymer LED,B iosensor, Hydrogels, Microspheres, Micro Actuators, Polymer MEMS

 

Market Studies

pid	abstract
PID193180	Market Forecasts for Roll-to-roll Electronics Manufacturing D.P.Lawrencec IDTechEx, Ltd. Far Field House, Albert Road, Stow-cum-Quy, Cambridge, UK Abstract The significant developments in printed organic and molecular electronics will have a profound effect on the market for consumer and industrial products. By allowing the continuous production of functional electronic devices on roll-to-roll assembly lines, two fundamental changes are taking place in manufacturing. First, existing, costly< processes may be replaced by more efficient production methods enabling widespread development of lower cost electronics. Second, entirely new markets may emerge that were not feasible prior to these developments. Several of these markets and applications are described along with their significance in reinforcing knowledge driven manufacturing bases within the European Community. Keywords: Roll-to-Roll Electronics, Market Forecasts
PID202099	SME's Perspectives: 4M current capabilities and future requirements C. Neuy IVAM Microtechnology Network, Dortmund, Germany Abstract The participation of small and medium sized enterprises (SME) in research and development is essential given their role in promoting innovation in this field. This is especially true in the field of microtechnology. The paper looks at different surveys and studies to analyse the potential for growth of SME in Europe especially in the 4M technologies. The bottom up survey within IVAM membership gives an overview on the technologies and application fields of European SME. These results are reflected in relation to the market reports of Yole Developpement and the NEXUS III report. Keywords: SME, Europe, global competitiveness
	A roadmapping study in Multi-Material Micro Manufacture S.S. Dimov a, C.W. Matthews a, A. Glanfield b, P. Dorrington b a Manufacturing Engineering Centre, Cardiff University, Cardiff CF10 3XQ, UK b Cardiff Business School, Cardiff University, Cardiff CF10 3XQ, UK Abstract This paper reports findings from a roadmapping study conducted by the FP6 Network of Excellence in Multi-Material Micro Manufacture (4M). The main aim of this study is to help inform European research and industry about current trends and application requirements in the development of Micro- and Nano-manufacturing Technologies (MNT) for the batch-manufacture of micro- components and devices. The results are based on a roadmapping workshop attended by 30 senior researchers and parallel questionnaires administered to 38 associated industrialists. Primary application areas addressed were micro-fluidics, micro-sensors & actuators, and micro-optics, while the technologies covered were surface modification and structuring processes, energy assisted and mechanical processes, and replication processes. Reported results include the main market sectors for these three application areas as perceived by the industrialists together with the main application requirements for developing/manufacturing micro products and the important current and future micro manufacturing technologies. Generic and specific conclusions are derived about the existing trends in developing micro technologies and their applications. Keywords: micro manufacture, multi-material, roadmap

 

Components: Fabrication and Assembly Technologies

PID183452	Replication of micrometric pattern by hot embossing of silica based feedstock L. Federzoni a, O. Fourcade a , P. Lourdin b a CEA-Grenoble, DTNM//LCE, F38054 Grenoble cedex 9 b ECAM, 40 montée saint Barthélémy F69321 Lyon cedex Abstract The CEA is developing a new forming technique derived from the hot embossing of polymers. This technique consists in replacing the polymer by a feedstock composed on binders and inorganic nanopowders. The process consists in three stages that are forming/pressing, debinding and sintering, similarly to the micro Powder Injection molding. This process has been optimized for the replications of micrometric patterns. This work has led to the development of a feedstock composed of water-soluble binder and nanometric fumed silica. It was possible to replicate gratings of ~1 micron after sintering. The replication of sub-micronic plots is not possible at this stage. It is expected that the use of smaller particle size could allow reaching this objective. Keywords: hot embossing, gratings, silica
PID189090	Force fields with one stable equilibrium for micropart 2D manipulation E.K. Xidias a, N.A. Aspragathos a a Department of Mechanical Engineering & Aeronautics, University of Patras, Patras 26500, Greece Abstract This paper proposes an approach for structuring a two dimensional (2D) force field with just one stable equilibrium at the desired location for the manipulation of microparts without sensing. The derived force field induces a unique stable equilibrium for any convex or non-convex polygonal micropart on the plane with arbitrary shape and size, where the equilibrium pose is the desired location of the micropart. Extensive simulations show the efficiency of the proposed method in the formulation of the force fields for 2D manipulation of microparts. Keywords: stable equilibrium, force field, micropart manipulation
PID189540	Off-Axis Machining of NURBS Freeform Surfaces by Fast Tool Servo Systems Prof. Dr.-Ing. C. Brecher, Dr. S. Lange, M. Merz, F. Niehaus, M. Winterschladen Fraunhofer Institute for Production Technology IPT, Steinbachstraße 17, 52074 Aachen,Germany Abstract The manufacturing of optical components with complex geometries like freeform surfaces is getting more and more important. Mass production of these optics is enabled by replication methods like injection moulding. For the machining of the required mould inserts with freeform geometries ultraprecision technologies like Fast Tool Servo turning can be applied to achieve the appropriate optical surface quality. For the mathematical description of freeform surfaces NURBS (Non Uniform Rational Basis Splines) are highly applicable. To avoid interpolation errors and to create set points with a continuous and smooth path of motion a trajectory generator directly based on NURBS data has been developed for Fast Tool Servo assisted turning [1], which evaluates the NURBS surface in each position control cycle. An approach of increasing the efficiency of manufacturing freeform surfaces is the off-axis machining of multiple workpieces at the same time. The paper presents the different process steps in simulation and off-axis machining of freeform surfaces using Fast Tool Servo assisted turning in conjunction with NURBS based data processing. Keywords: Ultraprecision Machining, Fast Tool Servo System, Freeform Surfaces (NURBS), Off-Axis Turning
PID189565	Automated tool exchange for ultraprecision diamond milling and turning applications Prof. Dr.-Ing. Christian Brecher, Dr.-Ing. Sven C. Lange, Frank Niehaus, Christian Wenzel Fraunhofer-Institute for Production Technology IPT, Steinbachstrasse 17, 52074 Aachen, Germany Abstract Active tool wear control is a crucial factor for fulfilling the high shape and surface requirements in the large area ultraprecision diamond surface structuring of optical components. The Fraunhofer IPT has developed opto-mechanical setups for a fully automated in situ tool characterisation and a reproducible tool exchange. The systems embody a submicron accuracy for both, the machining of planar masters for replication by means of planing and fly-cutting operation as well as for the turning of large rollers for embossing applications. Keywords: diamond turning, ultra-precision machines, automated referencing and tool exchange, tool wear control
PID189658	Polymer Based Multifunctional 3D-Packages for Microsystems W. Eberhardt a, D. Ahrendt a, U. Keßler a, D. Warkentin a, H. Kück b a Hahn-Schickard-Institute for Microassembly Technology HSG-IMAT, Stuttgart, Germany b University of Stuttgart, Institute for Micro and Precision Engineering, Germany Abstract Multifunctional 3D-packages can be fabricated with nearly any geometry using injection moulding. 3D line patterning can be performed on injection moulded parts with very flexible laser techniques. Finest line pitches can be realized with subtractive patterning as well as with additive laser direct structuring (LDS). For mounting of SMD and bare dies different assembly techniques can be used. Keywords: MID, laser patterning, assembly, bare die, SMD
PID189798	Laser transmission welding of micro plastics parts E. Haberstroh, W.-M. Hoffmann Institute of Plastics Processing (IKV), RWTH Aachen University, Aachen, Germany Abstract Only few welding processes for plastics meet the special demands of microtechnology. Laser transmission welding has distinctive advantages like low mechanical and thermal load of the joining parts. Thus the laser is a joining tool which is particularly suitable for the welding of micro plastics parts. Contour welding is a process variant of laser transmission welding enabling the welding of complex and even three-dimensional weld contours. In addition to that, this is a very flexible process which can be easily adapted to changing part geometries. So far it is only applied for welding plastics parts of macroscopic scale in the industrial practice. Recent research at the Institute of Plastics Processing in Aachen shows that it is also possible to use this process to weld filigrane micro parts. Thus another promising welding process has proven its suitability for the microtechnology. Welding trials with different thermoplastics show, however, that there are big differences in the material behaviour that make some platics more suitable than others for the contour welding in microtechnology. Keywords: laser transmission welding, contour welding, tear-out force, weld seam morphology
PID189909	Prototyping of multilayer waveguides with V-grooves in COC/Topas® F. Bundgaard a, J. Ducrée b, R. Zengerle c, O. Geschke a a MIC - Department of Micro and Nanotechnology, Technical University of Denmark, DTU Building 345 East, DK-2800 Kgs. Lyngby, Denmark b HSG-IMIT, Institute for Micromachining and Information Technology,Villingen-Schwenningen, Germany c IMTEK - University of Freiburg, Laboratory for MEMS Applications, Georges-Köhler-Allee 106, 79110 Freiburg, Germany Abstract A number of fast and low-cost methods are used for prototyping of optical waveguides in the cyclic olefin copolymer Topas®. This polymer has a number of advantages compared to polymers traditionally used for micro systems. The advantages include good chemical resistance, good optical properties, and low water absorption, making it well-suited for lab-on-a-chip systems. Using micro milling, spin coating, and thermal bonding, and exploiting the different refractive indices of different grades of Topas®, waveguides with a width and heigth of 130 μm are created. 45° V-grooves at both ends of the waveguides are used for coupling light in and out of the waveguides, using the principle of total internal reflection. In this manner light can be coupled into the waveguides perpendicularly from above or below the structure, depending on the groove orientation. This coupling scheme has a large potential for rotating microfluidic system, the so-called lab-on-a-disk systems. Keywords: COC/Topas®, micro milling, waveguides, prototyping, V-grooves
PID189953	An integrated solenoid-type inductor with Fe-based soft magnetic core Chong Lei a, Yong Zhou a, Wen Ding a, Xiao-Yu Gao a, Ying Cao a, Hyung Choi b,Jonghwa Won b a National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Institute of Micro and Nano Science & Technology, Shanghai Jiao Tong University, Shanghai 200030, China (corresponding author: yzhou@sjtu.edu.cn) b Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd., 416 Maetan-Dong, Yeongtong-Gu, Suwon, Kyungki-Do 442-742, Korea Abstract This paper reports on a technological process that combines copper as conductor, soft FeCuNbCrSiB magnetic thin film prepared by magnetron sputtering as magnetic core and polyimide as the insulation material to complete a solenoid-type inductor with high inductance and high quality factor. The shape of the magnetic core scheme is rectangular, and the size of the inductor is 4 mm × 4 mm × 0.084 mm. The results show that the fabricated solenoid-type inductor has high inductance and high quality factor in the frequency range of 1-20 MHz, the inductance is 1.19 μH at a frequency of 1 MHz and the maximum quality factor is around 4.5 with an inductance value of 1.1 μH at a frequency of 12 MHz. Keywords: high inductance, high quality factor, Fe-based magnetic thin film, solenoid-type inductor
PID189972	In-process assembly of micro metal inserts in a polymer matrix G. Tosello, H. N. Hansen Department of Manufacturing Engineering and Management, Technical University of Denmark, Produktionstorvet, Building 427S, DK-2800 Kgs. Lyngby, Denmark Abstract New functionalities and smaller dimensions of micro products can be achieved by means of a higher degree of integration of both materials and components. Smart micro assembly techniques (such as on-the-machine assembly) together with hybrid structures (as metal inserts in polymer matrix) are suitable solutions to manufacture new micro products with several integrated functionalities, reduced number of components and assembly phases, as well as the possibility to be replicated in a high number of specimens. Innovative manufacturing systems, as well as new design rules and testing methodologies, have to be established in order to be able to develop new and more integrated micro products. In this paper a method for testing the bonding between micro thickened metal inserts and the polymer matrix they are moulded in is presented. A specific demonstrator has been manufactured by means of a hot embossing-like process which allows fast developing time and the possibility of batch process. Different levels of surface roughness and metal insert thickness were applied in a systematic design of experiments. The results show a strong influence of surface texture on bonding strength. The testing procedure assists the designer in giving data to be used when dimensioning micro products involving integrated metal parts in a polymer product. Keywords: bond strength testing, micro metal inserts, polymer hybrid structures, in-process assembly
PID190091	Low Temperature Adhesive Bonding in MEMS D. Andrijasevic a, W. Smetana a, D. Esinenco b, W. Brenners a a Institute of Sensor and Actuator Systems, Vienna University of Technology, 1040 Vienna, AUT b The National Institute for Research and Development in Microtechnologies, 077190 Bucharest, RO Abstract A new concept for adhesive bonding of components with dimensions less than 300 μm in complex 3D structures is presented in this paper. Two different kinds of adhesives - polyurethane adhesive foil and polyethylene hot melt glue - were applied to the basic substrate by different techniques. The focused stream of hot gas directed to the substrate softens glue which had been applied as a solid. Afterwards, micro-parts were embossed in the softened glue, or covered and shielded by it. After cooling down at room temperature, a rigid and compact bond was formed. The parameters which induce the heat transfer and the process performance generally are considered through various experiments. The advantages of this new approach are compact system which can be easily integrated in existing production lines, low capital costs, partial reversibility, applicability to many material combinations, localized heating with reduced thermal stresses, etc. In order to confirm the advantages of proposed bonding technique, a single mode glass optical fiber (core diameter 9 μm; cladding diameter 125 μm) was positioned in V-grooves to achieve requested alignment and positioning precision. V- grooves were made by chemical etching of silicon in the “111” plane. Bonding glass to glass was also successfully demonstrated. Keywords: adhesives, low temperature bonding, hot gas stream
PID190112	Manufacture of recessed rotating microelectrodes for mass transport investigations in the LIGA process M. Lisinenkova, L. Hahn, J. Schulz Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe GmbH, Postfach 3640, D-76021 Karlsruhe, Germany Abstract The enhancement of the knowledge of mass transport during the different manufacturing stages of high aspect ratio microstructures is important for further progress in the LIGA technology. The information about mass transport characteristics is essential in order to find the optimal processing parameters for the development and the electroforming. A new construction and fabrication method for recessed rotating microelectrodes (RRME) for mass transport investigations in micro technology is presented. The manufacturing of these electrodes based on the LIGA process is described. This technology was tested in practice, its deficiencies were discovered and a new improved technology was presented. The improvement includes a substitution of electrochemical gold deposition to vapor deposition and using an alternative glue, which provides sufficient PMMA to gold adhesion. The fabricated RRMEs were tested in electrochemical ferro/ferricyanide system and the first test results are reported. It has been shown that RRME, produced by improved technology, meet qualifying requirements and can be used for mass transfer investigations in micro technology Keywords: fabrication technology, recessed rotating microelectrodes (RRME), LIGA process
PID190360	Fabrication of a solenoid-type inductor with electroplated NiFe magnetic Core by MEMS Chong Lei a, Wen Ding a, Yong Zhou a, Xiao-Yu Gao a, Hyung Choi b, Jonghwa Won b a National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Institute of Micro and Nano Science & Technology, Shanghai Jiao Tong University, Shanghai 200030, China (corresponding author: yzhou@sjtu.edu.cn) b Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd., 416 Maetan-Dong, Yeongtong-Gu, Suwon, Kyungki-Do 442-742, Korea Abstract A solenoid-type inductor was fabricated by MEMS (Microelectromechanical Systems) technique. NiFe film was electroplated as the magnetic core, and polyimide with a low relative permittivity was used as the insulation material. In the fabrication process, UV-LIGA, dry etching, fine polishing and electroplating technique have been adopted to achieve high performance of the solenoid-type inductor. The inductor was in size of 3.9 mm × 2.66 mm × 80 μm with coil width of 20 μm, space of 35 μm and aspect ratio of approximately 4:1. The inductance was 1.973 μH at a frequency of 1 MHz, and the maximum quality factor was 1.52 at a frequency of 2.14 MHz with an inductance of 1.82 μH, which is attractive for the applications of micro DC/DC converter. Keywords: Inductance, NiFe magnetic core, MEMS, solenoid-type inductors, quality factor
PID190369	Fabrication of a solenoid-type inductor with electroplated NiFe magnetic Core by MEMS Chong Lei a, Wen Ding a, Yong Zhou a, Xiao-Yu Gao a, Hyung Choi b, Jonghwa Won b a National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Institute of Micro and Nano Science & Technology, Shanghai Jiao Tong University, Shanghai 200030, China (corresponding author: yzhou@sjtu.edu.cn) b Samsung Advanced Institute of Technology (SAIT), Samsung Electronics Co., Ltd., 416 Maetan-Dong, Yeongtong-Gu, Suwon, Kyungki-Do 442-742, Korea Abstract A solenoid-type inductor was fabricated by MEMS (Microelectromechanical Systems) technique. NiFe film was electroplated as the magnetic core, and polyimide with a low relative permittivity was used as the insulation material. In the fabrication process, UV-LIGA, dry etching, fine polishing and electroplating technique have been adopted to achieve high performance of the solenoid-type inductor. The inductor was in size of 3.9 mm × 2.66 mm × 80 μm with coil width of 20 μm, space of 35 μm and aspect ratio of approximately 4:1. The inductance was 1.973 μH at a frequency of 1 MHz, and the maximum quality factor was 1.52 at a frequency of 2.14 MHz with an inductance of 1.82 μH, which is attractive for the applications of micro DC/DC converter. Keywords: Inductance, NiFe magnetic core, MEMS, solenoid-type inductors, quality factor
PID190376	Surface micromachined three-dimentional solenoid-type inductor Dong-Ming Fang, Yong Zhou, Wen Ding, Xi-Ning Wang, Xiao-Lin Zhao National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Institute of Micro and Nano Science & Technology, Shanghai Jiao Tong University, Shanghai 200030, China (corresponding author: yzhou@sjtu.edu.cn) Abstract Miniaturized integrated inductor of high performance is very important in mobile communications and microwave integrated circuits. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large area. In this paper, We present the design, fabrication, and performance of surface micromachined on-chip three-dimentional (3-D) aircore solenoid microinductors. The fabricated microinductors are characterized at high frequencies from Sparameter measurements. The resulting 7-turn air-core solenoid inductors have inductances between 1.03 to 1.81 nH, peak qu