RAS Reports and Case Studies

Grinding/pulverizing technology applicable to silicon

MEC, Cardiff




The collaborating company is looking to recycle silicon wafer by dispersing silicon particulate through a polymer carrier.
They have a supply chain available for the used silicon in flat pieces (0.6mm thick, various sizes), but have not secured a technology/process or supplier who can grind the silicon into fine granules;
- the required particle size is around 30micron,
- the finished dry 'powder' will have to be 99% pure silicon,

Submitted on November 13, 2006 - 11:49.

minam fp6
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