RAS Reports and Case Studies
Grinding/pulverizing technology applicable to silicon
MEC, Cardiff
1
Confidential
No
The collaborating company is looking to recycle silicon wafer by dispersing silicon particulate through a polymer carrier.
They have a supply chain available for the used silicon in flat pieces (0.6mm thick, various sizes), but have not secured a technology/process or supplier who can grind the silicon into fine granules;
- the required particle size is around 30micron,
- the finished dry 'powder' will have to be 99% pure silicon,
Monitoring and control of CBN grinding of Ni base alloy jet engine components
University of Naples Federico II
25
Avio Group SpA
Yes
The 4M affiliated partner Avio Group is a leading producer of aircraft engines that has had long term collaborations with the University of Naples Federico II in fields as diverse as metal processing, welding and brasing non traditional manufacturing, metrology, nondestructive evaluation, material characterisation, etc. Avio Group recently submitted a technological enquiry regarding Ni base alloy CBN grinding and related metrology aspects with particular attention to the micro features of the products of interest: turbine blades for jet engines.
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