RAS Reports and Case Studies

Grinding/pulverizing technology applicable to silicon


MEC, Cardiff

1

Confidential

No

The collaborating company is looking to recycle silicon wafer by dispersing silicon particulate through a polymer carrier.
They have a supply chain available for the used silicon in flat pieces (0.6mm thick, various sizes), but have not secured a technology/process or supplier who can grind the silicon into fine granules;
- the required particle size is around 30micron,
- the finished dry 'powder' will have to be 99% pure silicon,

Submitted on November 13, 2006 - 11:49.

Monitoring and control of CBN grinding of Ni base alloy jet engine components


University of Naples Federico II

25

Avio Group SpA

Yes

The 4M affiliated partner Avio Group is a leading producer of aircraft engines that has had long term collaborations with the University of Naples Federico II in fields as diverse as metal processing, welding and brasing non traditional manufacturing, metrology, nondestructive evaluation, material characterisation, etc. Avio Group recently submitted a technological enquiry regarding Ni base alloy CBN grinding and related metrology aspects with particular attention to the micro features of the products of interest: turbine blades for jet engines.

Submitted on October 27, 2006 - 07:31.

minam fp6
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