Layer Manufacturing as a Generic Tool for Microsystem Integration

Per Johander(a), Sjoerd Haasl(b), Katrin Persson(b) and Urban Harrysson(c)
a: IVF- Industrial Research and Development Corporation; Argongatan 30, 431 53 Mölndal, Sweden,
b: IMEGO AB; Arvid Hedvalls Backe 4, 411 33 Göteborg, Sweden;
c: FCubic AB; Källarlyckevägen 6, 429 35 Kullavik, Sweden

Abstract

Nearly every microsystem application requires specific packaging solutions. In this paper we suggest a new approach to use layer manufacturing as a generic tool for microsystem integration. Three different methods to produce 3D electrical interconnects are presented. Ink jet printing is used for the ceramic layer manufacturing process, as well as for the printing of silver for circuit patterns. The technique is demonstrated for an Inertial Measurement Unit(IMU) platform. A four-sided pyramid was manufactured with layer manufacturing in ceramics and four gyroscopes were mounted on the sides of the pyramid. A demonstrator with three light diodes was also manufactured to demonstrate the possibility to produce 3D electrical interconnects in the volume of the pyramid.