KMPR Photoresist for Fabrication of Thick Microstructures

Chen-Han Lee, Kyle Jiang
Centre for Microengineering and Nanotechnology School of Engineering, the University of Birmingham Edgbaston, Birmingham B15 2TT, UK

Abstract

Presented in this paper is an investigation on using KMPR, a new negative tone photoresist, to build thick micromoulds for electroforming. Compared with SU-8 photoresist, KMPR has the advantage to be removed after electroforming metallic microcomponents. Detailed process of KMPR mould fabrication and stripping is presented and nickel electroforming has been performed using the KMPR moulds. The results are compared with SU-8 moulds and the strip-ability of KMPR is clearly demonstrated.