High Power DPSS Laser Micro-Machining of Stainless Steel and Silicon for Device Singulation
D. Karnakis, G. Rutterford, M. R. H. Knowles
Oxford Lasers Ltd., Unit 8, Moorbrook Park, Didcot, Oxfordshire OX11 7HP, UK
We describe high power diode-pumped solid-state (DPSS) laser micro-machining results of commonly used industrial materials such as stainless steel and silicon. Frequency up-converted lasers were used at 532nm and 355nm. We discuss the benefits of high laser intensity (~ GW/cm2) micro-machining for efficient laser microfabrication.
At such high irradiance conditions material properties are approaching their critical limits and ablation mechanisms are complex. These can be exploited to our advantage in particular for micro-drilling and micro-cutting small feature sizes in the order 10-20 μm and high aspect ratios of up to 20:1. Etch rate data are presented and a comparative study of the ablation efficiency in these materials is discussed. Results of single shot and multiple shot ablation are also presented. The potential applications of this technology to device singulation for electronic and power generation devices will be described.
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