A New Method for Directly Determining the Adhesive Strength of Conductors on Microstructured MID

H. Willeck(a), W. Eberhardt(a), H. Kück(b)
a: Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Stuttgart, Germany
b: University of Stuttgart, Institute of Micro and Precision Engineering, Germany

Abstract

Through miniaturisation and 3D capability moulded interconnect devices (MID) offer great opportunities for various applications in a broad industrial field. Especially, when applying the laser-direct-structuring process of the company LPKF (LPKF-LDS® process) fine conductors can be fabricated on thermoplastic substrates. A main criterion for the industrial application is the adhesive strength of the conductors. As for LDS MID there is currently no suitable test method for directly determining the adhesive strength of conductors. Therefore, a measuring device consisting of a sensor and peel off unit has been developed at HSG-IMAT. It has been used to investigate a measuring principle utilising a peel off chisel for adhesion determination. Promising and repeatable results have been obtained by testing conductors on thermoplastic substrates.