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Hot embossing of high aspect ratio sub-μm structured surfaces for micro fluidic applications

M. Heckele (a), M. Worgull (a), T. Mappes (b), G. Tosello (c), T. Metz (d), J. Gavillet (e), P. Koltay (d), H. N. Hansen (c)

(a) Forschungszentrum Karlsruhe (FZK), Institute for Microstructure Technology (IMT), D-76344 Eggenstein-Leopoldshafen, Germany
(b) University of Karlsruhe (TH), Institute for Microstructure Technology (IMT), D-76344 Eggenstein-Leopoldshafen, Germany
(c) Technical University of Denmark (DTU), Department of Mechanical Engineering, DK-2800 Kgs. Lyngby, Denmark
(d) Laboratory for MEMS Applications, Department of Microsystems Engineering (IMTEK), University of Freiburg, George-Koehler-Allee 103,79110 Freiburg, Germany
(e) French Atomic Energy Commission (CEA), Laboratory of Innovation for New Energy Technologies and Nanomaterials (LITEN), 38054 Grenoble, France

Abstract

Sub-micro structured surfaces allow modifying the behaviour of polymer films or components. Especially in micro fluidics a lotus-like characteristic is requested for many applications. Structure details with a high aspect ratio are necessary to decouple the bottom and the top of the functional layer. Unlike to stochastic methods patterning with a LIGA-mould insert it is possible to structure surfaces very uniformly or even with controlled variations (e.g. with gradients). In this paper the process chain to realize polymer sub-micro structures with minimum lateral feature size of 400 nm and up to 4 μm height is presented.

Submitted on August 4, 2008 - 12:17.

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