4M Knowledge base - papers

S. Wilson (a),(b), W.Pfleging (c), A. Welle (d), P.Kirby (b), M.Przylbyski (e)

(a) Institute for Microstructure Technology, Forschungszentrum Karlsruhe, 76344 Eggenstein-L, DE
(b) School of Applied Sciences., Cranfield University, Cranfield, Beds. MK43 0AL, UK
(c) Institute for Materials Research 1, Forschungszentrum Karlsruhe, 76344 Eggenstein-L, DE
(d) Institute for Biological Interfaces, Forschungszentrum Karlsruhe, 76344 Eggenstein-L, DE
(e) ATL Lasertechnik GmbH, Burger Str. 48, 42929 Wermelskirchen, Germany

Abstract

Laser patterning is of interest for MST applications; direct ablation of polymer material for generating 2D and 3D shapes such as microfluidic channels, curved shapes or micro-holes and alternatively photo-induced change of chemical or physical surface properties. Correct laser choice and process parameters enables new approaches for the fabrication of lab-on-chip devices with integrated functionalities. Laser-assisted ablation and modification of polystyrene (PS) is introduced with respect to the fabrication of polymer devices for high throughput planar patch clamping - a method of measuring the electrical activity of a cell currently a focus for high throughput systems (HTS). There are currently no marketed systems using novel materials that have surface modifications for either individual cell placement, or for dealing with cell networks, a physiologically important consideration for tissue engineering and understanding cell to cell interactions.
Within 4M, a design jointly proposed by FZK and Cranfield University for the fabrication of a polymer patch clamping system, laser micro-drilling of PS and subsequent surface functionalisation for cell adhesion has been investigated as a function of laser and process parameters. High power ArF laser with a pulse of 20 ns as well as high repetition ArF excimer laser sources with pulse lengths of 4-6 ns were used in order to study the influence of laser pulse length on laser drilling and laser induced surface modification. Micro-drilling of PS with diameters down to 1.5 μm have been demonstrated. Furthermore, localized formation of chemical structures suitable for improved single cell and cell network adhesion has been achieved on PS surfaces.

M.R.H Knowles, G. Rutterford, D. Karnakis, A. Ferguson
Oxford Lasers Ltd, Unit 8, Moorbrook Park, Didcot, OX11 7HP, UK

Abstract

Laser micro-processing is an enabling technology that facilitates component minaturization and improved performance characteristics. It is being applied across many industries – semiconductor, electronics, medical, automotive, aerospace, instrumentation, and communications. Laser ablation of metals, ceramics and polymers is a complex process and the exact nature of the interaction is specific to the material and laser processing parameters used. Ablation is usually a combination of evaporation and melt expulsion. In order to achieve the highest quality results it is often desirable to minimize the degree of melting involved and short pulse lasers show certain advantages in this respect. We discuss the benefits of high laser intensity (GW/cm)^2 on target for efficient laser micro-fabrication in metals and ceramics. At such high irradiance conditions, material properties are approaching their critical limits and ablation mechanisms are becoming even more complicated but can be exploited to our advantage in particular for high aspect ratio micro-drilling and micro-cutting.

W. O’Neill, K. Li, Q. Hu, P. Chopra, J. Kanghee, A. Buntardjo
Institute for Manufacturing, University of Cambridge, Cambridge, CB2 1RX, UK

Abstract

The advances in design, performance, cost reduction, and brightness for the modern Yb fiber laser have opened up the possibility of redefining the micro processing options for a range of semiconductor materials and micro fabrication production techniques at a wavelength of 1064nm. The usual laser of choice for micro electronics processing is the 532, 355, or 266 nm DPSS system. The provision of a new MOPA high brightness Yb based fiber laser configuration has provided a range of pulse parameters (10-200 ns FWHM), peak powers approaching ~ 2G Wcm^(-2) , and pulse repetition rates up to 500 kHz. These processing parameters offer a broad range of material response characteristics. This paper provides a preliminary analysis of the use of a Yb based fiber laser in the production of Si and Glassy Carbon microstructures and explores the potential of this source for low cost micromachining solutions.