4M Knowledge base - papers
The ceramics substrates microprocessing by high precision laser technologies for microsystems, microsensors and actuators applications
Dr. Dumitru Ulieru (a), Dr. Ileana Cernica (b)
(a) ROMES S.A., 126 A, Iancu Nicolae Str, 77190, Voluntari (Bucharest), Romania,
(b) IMT – Bucharest, 32B, Erou Iancu Nicolae Str., 77190, Voluntari (Bucharest), Romania
Microsystems (MST) as MEMS, MOEMS, MCMs, microsensors and actuators uses the same techniques as microelectronics processing to create structural components that are essentially micronic or submicronic mechanical parts. These parts usually require high precision fabrication unless post-fabrication finishing. For various types of materials of which a great used for obtaining microsystems, micro and nanodevices the laser micro and nanoprocessing is the best solution for accuracy and roughness surface quality high precision technologies suitable for batch processing of ceramics and other MSN substrate materials.
- High precision microdrilling of microvias and different microholes configurations.
Technical features of microprocessing for microsystems application with RF MCM detailed presented in the paper as
shown on more tables with analyze of answers of more kind of support materials at laser radiation. The authors present also the detailed results of microprocessing of microholes realized by different lasers radiation as UV, Nd:YAG and CO2 for microvias of higher layers count for high density circuits ( HDI ) connection microholes as blind, through tapered holes, circular a/o squared areas etc.
- Microcutting and contouring processing by high precision laser technologies.
On the paper are presented the experiments and results studies obtained by the authors on the basis of high precision laser for chips separation and / or singulation on ceramics wafer processed including as individual extraction possibility.
- Surface patterning generation by laser microprocessing
The fine pattern generation of metal or alloy films on ceramic substrates can be structured directly with the laser direct patterning process. Our novel technology applications unless chemicals can resolve this problem by offering structuring processing of sensors and sensors systems able to fulfill these requirements.
High Density Interconnections Fabrication by UV Lasers Microprocessing of Microvias and Microstructures
D. Ulieru (a), Alina Matei (b), Elena Ulieru (c), A. Tantau (c), Florin Babarada (d)
(a) ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, ROMANIA
(b) National Institute for Research and Development in Microtechnologies, 32B,Erou Iancu Nicolae Str., Bucharest, 077190, ROMANIA
(c) SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, ROMANIA
(d) “Politehnica” University of Bucharest, Splaiul Independentei Str., No. 313, Bucharest 060042, ROMANIA
The strong evolution of electronic packaging in the field of high performance hand held electronic products involves, from the fabrication point of view, to manufacture small, lightweight, reliable and, very important too, cost effective electronic modules. In the last years new techniques and technologies for production of rigid/flexible MCMtype multilayer were introduced. The manufacturers of laminate substrates are being challenged to realize boards with very good electrical and mechanical properties. In the past the biggest issues regarding vias and via capture pad sizes were only solderability and manufacturability. Today the vias density is also an important electrical issue. The more vias on a board are presented, the more discontinuities into PCB/MCM passive interconnection structure are placed. For High Density Interconnection (HDI) circuits design one solution is to reduce the via hole and the via capture pad, but still maintain manufacturability at board fabrication stage.The most indicated solution is to use UV laser microprocessing for HDI production.
D. Clausi, J. Peirs, D. Reynaerts
Katholieke Universiteit Leuven, Department of Mechanical Engineering, Division PMA
Shape Memory Alloys have a considerable potential for integration into microsystems, where scaling down of their size allows favorable exploitation of the intrinsic adaptive capabilities, providing an actuation mechanism for applications (e.g. micropneumatics) requiring large force control and large actuator stroke. However, the implementation of these materials into actual structures is rather complex and mostly confined to depositing thin NiTi films onto certain target substrates, resulting in devices having a relatively high cost-per-piece. This paper is aimed at investigating a novel approach for batch integration of SMA to microactuators, which might provide a cost-effective alternative to thin film technology while enhancing functional properties and design flexibility. Indicative requirements for the actuator design have been drawn from typical microvalve applications. In order to evaluate the actuator performance, brass microcantilevers have been produced, with prestrained SMA thin wires bonded on top of them, eccentrically with respect to the cantilever’s neutral plane. The activation of SMA element is obtained by direct heating through electrical current. The bending actuation of the cantilever leads to large strokes, expected to match the requirements of a wide range of applications.
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