4M Knowledge base - papers
Characterization of Pulses in Micro EDM Milling Based on Wear and Material Removal
G. Bissacco(a), J. Valentincic(b), B.D. Wiwe(a), H.N. Hansen(a)
a: Department of Manufacturing Engineering and Management (IPL), Technical University of Denmark (DTU), Produktionstorvet 2800 Kgs. Lyngby, Denmark
b: Laboratory for Alternative Technologies, Faculty of Mechanical Engineering, University of Ljubljana
Abstract
This paper presents an investigation on wear and material removal in micro EDM milling for selected process parameters combinations typical of rough and finish machining of micro features in steel using state of the art equipment. Based on discharge counting and volume measurements, electrode wear unit and material removal unit are measured for several energy levels. The influence of the accuracy of volume measurements on the electrode wear unit and material removal unit are discussed and the issues limiting the applicability of real time wear sensing in micro EDM milling are presented.
Non-Destructive Characterization of Multilayer Structures by Low-Coherence Interferometry
Z.V. Djinovic(a)(b), L. Manojlovic(b), M.C. Tomic(c)
a: Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna 1040, Austria
b: Integrated Microsystems Austria, Wiener Neustadt 2700, Austria
c: Institut Bezbednosti, Belgrade 11000, Serbia
Abstract
We present here a non-destructive technique for characterization of multilayer structures based on low-coherence interferometry. This technique is capable to give information of physical thickness and index of refraction of the subjected sample regardless of how many different layers exist along the optical trip. The main limitation is if the investigated materials are transparent for the used optical wavelength. We performed sensing set up in the form of single-mode fiber-optic Michelson interferometer composed of one 2×2 optical coupler. There were tested three and five layers foils composed of sandwich structure made by alternation of polyarilate (PAR) and glue layer. We achieved a success discriminate the interface between the two different materials with accuracy of about 40 nm by analyzing low-coherence interferograms.
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