Single- and multi-layer conductive patterns fabricated using M3D technology

B. Obliers-Hommrich (a), A. Fischer (b), H. Willeck (a), W. Eberhardt (a), H. Kück (b)

(a) Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Stuttgart, Germany
(b) University of Stuttgart, Institute of Micro and Precision Engineering, Germany

Abstract

The continual trend of miniaturization and increasing complexity in the field of microelectronic devices pose a challenge for today’s manufacturing technology. The novel Maskless Mesoscale Material Deposition (M3D) manufacturing technology offers the potential for printing superfine circuitry as well as for the building up of multi-layer systems. Therefore it could be an interesting technology to meet the requirements of miniaturized systems. The M3D process depends on aerosol formation and uses aerodynamic focusing of aerosol streams for a high resolution deposition of colloidal suspensions and liquid raw material. Since M3D is a contactless and maskless Direct Write Technology, it also offers new possibilities for 3D devices. This paper will report on first results of depositing conductive and non conductive materials onto glass substrates as well as onto typical MID (Moulded Interconnect Devices) substrates. Furthermore it will present first multi-layer systems that have been fabricated using the M3D technology.