4M Knowledge base - papers

A Concept of Collision Prevention during Micro Assembly in a SEM Chamber

Al. Cvetanovic(a), An. Cvetanovic(b), M. Socek(c), D. Andijacevic(a), W. Brenner(a)
a: Institute of Sensors and Actuator Systems, Vienna University of Technology, Floragasses 7/2 A-1040 Wien
b: Integrated Microsystems Austria, Victor Kaplan Strasse 2, A-2700 Wiener Neustast
c: Tomeckova 3, CZ-63800, Brno


This paper presents a concept for avoiding collisions during micro assembly processes in the camber of a Scanning Electron Microscope (SEM). Focus is the phase of approaching of a micro-gripper to the specimen holder and the phase of picking up the micro-components that are positioned on it. Although the 3D position of the gripper tips should be known exactly the current design of equipment in the SEN chamber does not allow an assesment of the position in the z-direction. This uncertainty of relative positions causes a high risk that tips of micro-crippers break if colliding with the speciment holder as the operator has no information about the distance

Submitted on November 12, 2007 - 16:23.


Assembly & packaging | col

A New Approach to Qualitiy Assurance in Resistance Welding for Microsensors Packaging

D. Ulieru(a), Alina Matei(b), Elena Ulieru(c), A. Tantau(c)
a: ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, Romania
b: National Institute for Research and Development in Microtechnologies, 32B, Erou Iancu Nicolae Str., Bucharest, 077190, Romania
c: SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, Romania


The permanent development of microelectronics technologies provide new challenges for miniaturization and complexity increasing for new packaging technologies. So the exciting applications for microsystems, sensors and actuators production are looking for the best quality hermetic sealing of metal packages. The paper showed our researches and experiments results for a new approach to quality assurance in resistance welding. These will analyze the main causes of weld failures and also our methods of determining its value. On the basis of this requirement have monitored through the weld sequence, integrated concept of power monitor. The technical features developed a modern concept applicable to a wider range of fields. Our monitor could be used to wide range of welding technologies like distributed spot and focused spot, projection, roller spot and mash welding machines, working with single or three phase, ac. or dc. The experiments with our equipment have proven its advantage for fast production assembly line.

Submitted on November 12, 2007 - 16:23.

ASSEMIC: Research Advances in Microhandling and Assembly – “Special ASSEMIC Session”

Ana Almansa(a), S. Bou(a), Z. Rozynek(a) , W. Brenner(b)
a: Profactor R&S GmbH, Seibersdorf 2444, Austria
b: TU Wien – ISAS, Floragasse 7/2, Vienna 1040, Austria


Few technical fields are so multidisciplinary and present so challenging demands as microtechnologies. The Research and Training Network “Advanced Methods and Tools for Handling and Assembly in Microtechnology” (ASSEMIC) addresses this research field at a European scale. ASSEMIC brings together a consortium of 14 participants, focusing their efforts in microhandling and microassembly. This paper summarizes some of the latest results achieved in this project.

Submitted on November 12, 2007 - 16:23.

Batch Fabrication Methods for Polymer Based Active Microsystems using Hot Embossing and Transfer Bonding Technologies

T. Grund, M. Heckele and M. Kohl
Forschungszentrum Karlsruhe GmbH, Institute for Microstructure Technology (IMT),Postfach 3640, 76021 Karlsruhe, Germany


A batch compatible process flow to overcome the costly piece by piece assembly of hybrid microsystems is shown. Hot embossing is used to fabricate microstructured polymer layers. Wafer scale compatible bonding tasks are carried out by ultrasonic welding and heat activated bonding with micromachined bonding foils. As demonstrator device, a shape memory alloy (SMA) actuated polymer microvalve is introduced. The valve concept, fabrication technologies and device characteristics are discussed.

Submitted on July 29, 2008 - 11:51.

Concept for Packaging of a Silicon based Biochip

T. Velten (a), M. Biehl (a), T. Knoll (a), W. Haberer (a)
(a) Fraunhofer Institute for Biomedical Engineering, Ensheimer Strasse 48, 66386 Sankt Ingbert, Germany


We report on a concept for packaging of a silicon-based biochip for integration with a fluidic cartridge, thus forming a lab-on-chip (LOC). The biochip, which has dimensions of 2 mm x 2 mm, comprises a central membrane having a diameter of 200 μm, and 20 bond pads with metal tracks leading to the membrane. The packaged biochip provides a fluidic interface to the cartridge as well as electrical interfaces to the biochip electronics being located in a readout instrument. The packaging method ensures the strict separation between the wet sensing area and the electrical contacts. The challenge is that the biochip has a freely moving membrane, additionally with a delicate biological coating, and this membrane is positioned on the same side of the silicon chip as the bond pads for the electrical interconnection. For packaging, the biochip is mounted into a recess of a rigid printed circuit board (PCB). The biochip is electrically connected with the PCB using a proprietary MicroFlex interconnection (MFI) technology, thus resulting in a flat surface towards the reaction chamber of the fluid cartridge. After the realization of the electrical contacts between the sensor chip and the PCB, the entire chip is encapsulated with an epoxy layer, leaving the membrane of the biochip uncovered. To protect the membrane against the fluidic epoxy, a specially shaped silicone casting-mould is used. In a last step, the biochip with the epoxy layer is glued on the bottom side of the cartridge.

Submitted on July 29, 2008 - 15:41.

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