4M Knowledge base - papers

The ceramics substrates microprocessing by high precision laser technologies for microsystems, microsensors and actuators applications

Dr. Dumitru Ulieru (a), Dr. Ileana Cernica (b)
(a) ROMES S.A., 126 A, Iancu Nicolae Str, 77190, Voluntari (Bucharest), Romania,
(b) IMT – Bucharest, 32B, Erou Iancu Nicolae Str., 77190, Voluntari (Bucharest), Romania

Abstract

Microsystems (MST) as MEMS, MOEMS, MCMs, microsensors and actuators uses the same techniques as microelectronics processing to create structural components that are essentially micronic or submicronic mechanical parts. These parts usually require high precision fabrication unless post-fabrication finishing. For various types of materials of which a great used for obtaining microsystems, micro and nanodevices the laser micro and nanoprocessing is the best solution for accuracy and roughness surface quality high precision technologies suitable for batch processing of ceramics and other MSN substrate materials.

  • High precision microdrilling of microvias and different microholes configurations.
    Technical features of microprocessing for microsystems application with RF MCM detailed presented in the paper as
    shown on more tables with analyze of answers of more kind of support materials at laser radiation. The authors present also the detailed results of microprocessing of microholes realized by different lasers radiation as UV, Nd:YAG and CO2 for microvias of higher layers count for high density circuits ( HDI ) connection microholes as blind, through tapered holes, circular a/o squared areas etc.

  • Microcutting and contouring processing by high precision laser technologies.
    On the paper are presented the experiments and results studies obtained by the authors on the basis of high precision laser for chips separation and / or singulation on ceramics wafer processed including as individual extraction possibility.
  • Surface patterning generation by laser microprocessing
    The fine pattern generation of metal or alloy films on ceramic substrates can be structured directly with the laser direct patterning process. Our novel technology applications unless chemicals can resolve this problem by offering structuring processing of sensors and sensors systems able to fulfill these requirements.
Submitted on May 20, 2008 - 08:26.

A New Approach to Qualitiy Assurance in Resistance Welding for Microsensors Packaging

D. Ulieru(a), Alina Matei(b), Elena Ulieru(c), A. Tantau(c)
a: ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, Romania
b: National Institute for Research and Development in Microtechnologies, 32B, Erou Iancu Nicolae Str., Bucharest, 077190, Romania
c: SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, Romania

Abstract

The permanent development of microelectronics technologies provide new challenges for miniaturization and complexity increasing for new packaging technologies. So the exciting applications for microsystems, sensors and actuators production are looking for the best quality hermetic sealing of metal packages. The paper showed our researches and experiments results for a new approach to quality assurance in resistance welding. These will analyze the main causes of weld failures and also our methods of determining its value. On the basis of this requirement have monitored through the weld sequence, integrated concept of power monitor. The technical features developed a modern concept applicable to a wider range of fields. Our monitor could be used to wide range of welding technologies like distributed spot and focused spot, projection, roller spot and mash welding machines, working with single or three phase, ac. or dc. The experiments with our equipment have proven its advantage for fast production assembly line.

Submitted on November 12, 2007 - 16:23.

A New Concept for an Absolutely Encoded Angular Resolver

V. Mayer, T. Botzelmann, K.-P. Fritz, J. Seybold, H. Kück
Hahn-Schickard-Gesellschaft, Institute of Micro Assembly Technology, Allmandring 9b, 70569 Stuttgart, Germany

Abstract

At HSG-IMAT a new concept for an absolutely encoded optical angular resolver has been developed. The key element of the sensor concept is a disc with a high precision solid measure which is fabricated using the well known manufacturing process for compact discs (CD-Technology). Using this process, it is possible to fabricate a high precision solid measure in high quantities and at low manufacturing costs. To detect the absolute angular position, a laser beam is focused onto the solid measure. The beam is deflected by the diffractive gratings of the solid measure, whereupon the different first orders fall onto separated elements of a photo diode array. To verify the principle of operation an experimental setup assembled under a microscope, with a CCD-chip instead of a photodiode array, was used to demonstrate the signal modulation. Based on these experiments, a small size demonstrator device was designed and assembled. The successful experimental results with this demonstrator device show the large potential of this new sensor concept for different applications.

Submitted on November 12, 2007 - 16:23.

Bimaterial Actuators and Sensor with Built-in Compensation of the Ambient Temperature Interference

J. Matović(a), Z. Jakšić(b)
a: ISAS, Technical University, 1040, Vienna, Austria
b: IHTM, University of Belgrade, 11000, Belgrade, Serbia

Abstract

We present a novel simple and efficient method for the full removal of the influence of ambient temperature variations to the operation of bimaterial-based MEMS actuators and sensors. The removal of the undesired interference is achieved through the very structure of the bimaterial cantilever, by reversing the order of bimaterial constituent materials at a certain length. Thus an extremely simple geometry is obtained for full self-compensation of the structures. We performed the full simulation of our devices by the finite element method. The structures require standard surface micromachining and utilize only Si-technology compatible materials like polyimides or SU-8. A simple rule for the determination of the zero-deflection condition is presented. The described compensation method enables a significantly reduced bimaterial device area and a much higher packaging density in element arrays, as well as an improved signal-to-noise ratio. The method is especially convenient for photodetector arrays for direct conversion of infrared radiation spatial distribution into a visible image.

Submitted on November 12, 2007 - 16:23.

Design and Optimization of Flat Solenoid MEMS Actuator by Selection of Proper Material Properties

G. Todorov, K. Kamberov, and L. Dimitrov
CAD/CAM/CAE Laboratory, Technical University of Sofia, Sofia 1000, Bulgaria

Abstract

MEMS actuators are widely used in modern industry. Their main advantage is the concentration of desired mechanical characteristics in a limited space. This paper presents a design and optimization of a flat solid MEMS actuator. The optimization is based of the selection of material properties needed for the achievement of the actuator mechanical characteristics required for good performance. The main goal is to reach necessary output mechanical force with minimal side force effects. The output mechanical force is evaluated by modeling and simulation of the magnetic field and its parameters by the use of FE Analyses. In order to make proper simulations, a finite element model of the complete actuator structure is made up suggested).

Another problem that has been solved in the paper is checking of actuator’s geometry and its dimensions in order to evaluate the effective use of the material. As a result of the study, the optimal output function of the mechanical force versus the stage position has been determined. This has been done on the basis of updated material specifications. The optimal design of a flat solenoid MEMS actuator is proposed.

Submitted on November 12, 2007 - 16:23.

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