4M Knowledge base - papers
The ceramics substrates microprocessing by high precision laser technologies for microsystems, microsensors and actuators applications
Dr. Dumitru Ulieru (a), Dr. Ileana Cernica (b)
(a) ROMES S.A., 126 A, Iancu Nicolae Str, 77190, Voluntari (Bucharest), Romania,
(b) IMT – Bucharest, 32B, Erou Iancu Nicolae Str., 77190, Voluntari (Bucharest), Romania
Microsystems (MST) as MEMS, MOEMS, MCMs, microsensors and actuators uses the same techniques as microelectronics processing to create structural components that are essentially micronic or submicronic mechanical parts. These parts usually require high precision fabrication unless post-fabrication finishing. For various types of materials of which a great used for obtaining microsystems, micro and nanodevices the laser micro and nanoprocessing is the best solution for accuracy and roughness surface quality high precision technologies suitable for batch processing of ceramics and other MSN substrate materials.
- High precision microdrilling of microvias and different microholes configurations.
Technical features of microprocessing for microsystems application with RF MCM detailed presented in the paper as
shown on more tables with analyze of answers of more kind of support materials at laser radiation. The authors present also the detailed results of microprocessing of microholes realized by different lasers radiation as UV, Nd:YAG and CO2 for microvias of higher layers count for high density circuits ( HDI ) connection microholes as blind, through tapered holes, circular a/o squared areas etc.
- Microcutting and contouring processing by high precision laser technologies.
On the paper are presented the experiments and results studies obtained by the authors on the basis of high precision laser for chips separation and / or singulation on ceramics wafer processed including as individual extraction possibility.
- Surface patterning generation by laser microprocessing
The fine pattern generation of metal or alloy films on ceramic substrates can be structured directly with the laser direct patterning process. Our novel technology applications unless chemicals can resolve this problem by offering structuring processing of sensors and sensors systems able to fulfill these requirements.
G. Rius, J. Bausells, C. Martín, A. Llobera and F. Pérez-Murano
Institut de Microelectrònica de Barcelona, IMB-CNM-CSIC, Barcelona, SPAIN
We present the results of producing three dimensional micro- and nanostructures on an epoxy based resist. Epoxy based resists are very interesting in microsystems technology for their good mechanical properties, that allow to produce high aspect ratio microstructures. We have optimized the definition of free standing structures by either using electron beam lithography alone or combining electron beam lithography and UV optical lithography. To tune the energy and dose of the electron beam exposure properly, Monte Carlo simulations are used.
Georgi Lalev(a), Stefan Dimov(a), Jeff Kettle(a), Falco van Delft(b) and Roussi Minev(a)
a: Manufacturing Engineering Centre, Cardiff University, Queen's Buildings, The Parade, Newport Road, Cardiff, CF24 3AA, UK
b: Philips Research Europe, MiPlaza, High Tech Campus 4, 5656 AE Eindhoven, The Netherlands
The realization of complex three-dimensional structures at micro- and nano-meter scale in various materials is of great importance for a number of micromechanical, microoptical and microelectronic applications. Focused Ion Beam (FIB)patterning is one of the promising technologies for producing such 3D structures utilizing layer-by-layer fabrication methods. A novel and efficient data preparation approach is proposed in this paper for layer-based FIB processing. By applying it, complex surfaces can be designed easily in any 3D CAD package and then converted into GDSII streams for FIB sputtering or deposition. To validate the proposed CAD/CAM approach an experimental study was conducted.
The factors that can affect the accuracy of the structures produced by layer-based FIB processing are also discussed. By assessing all stages of the proposed approach and the results of its experimental validation, conclusions are drawn about its applicability.
Al. Cvetanovic(a), An. Cvetanovic(b), M. Socek(c), D. Andijacevic(a), W. Brenner(a)
a: Institute of Sensors and Actuator Systems, Vienna University of Technology, Floragasses 7/2 A-1040 Wien
b: Integrated Microsystems Austria, Victor Kaplan Strasse 2, A-2700 Wiener Neustast
c: Tomeckova 3, CZ-63800, Brno
This paper presents a concept for avoiding collisions during micro assembly processes in the camber of a Scanning Electron Microscope (SEM). Focus is the phase of approaching of a micro-gripper to the specimen holder and the phase of picking up the micro-components that are positioned on it. Although the 3D position of the gripper tips should be known exactly the current design of equipment in the SEN chamber does not allow an assesment of the position in the z-direction. This uncertainty of relative positions causes a high risk that tips of micro-crippers break if colliding with the speciment holder as the operator has no information about the distance
H.J. Jeon, A.N. Bramley
Department of Mechanical Engineering, University of Bath, Bath BA2 7AY, UK
For the simulation of metal forming processes, input data relating to the tool-workpiece interface is necessary. For microforming applications the tool/workpiece interface conditions tend to dominate the process and it has been found that traditional methods of modeling the interface are not realistic. This paper describes an approach that seeks to describe friction by modelling the geometric surface roughness of the tool as opposed to the use of the traditional empirical friction coefficient or factor. This finite element based model has been validated experimentally in terms of loads and metal flow using the ring test and actual surface measurements. It enables more accurate and also more flexible modeling of friction. As such it will be very suitable for microforming applications.
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