4M Knowledge base - papers

Georgi Lalev(a), Stefan Dimov(a), Jeff Kettle(a), Falco van Delft(b) and Roussi Minev(a)
a: Manufacturing Engineering Centre, Cardiff University, Queen's Buildings, The Parade, Newport Road, Cardiff, CF24 3AA, UK
b: Philips Research Europe, MiPlaza, High Tech Campus 4, 5656 AE Eindhoven, The Netherlands

Abstract

The realization of complex three-dimensional structures at micro- and nano-meter scale in various materials is of great importance for a number of micromechanical, microoptical and microelectronic applications. Focused Ion Beam (FIB)patterning is one of the promising technologies for producing such 3D structures utilizing layer-by-layer fabrication methods. A novel and efficient data preparation approach is proposed in this paper for layer-based FIB processing. By applying it, complex surfaces can be designed easily in any 3D CAD package and then converted into GDSII streams for FIB sputtering or deposition. To validate the proposed CAD/CAM approach an experimental study was conducted.

The factors that can affect the accuracy of the structures produced by layer-based FIB processing are also discussed. By assessing all stages of the proposed approach and the results of its experimental validation, conclusions are drawn about its applicability.

Al. Cvetanovic(a), An. Cvetanovic(b), M. Socek(c), D. Andijacevic(a), W. Brenner(a)
a: Institute of Sensors and Actuator Systems, Vienna University of Technology, Floragasses 7/2 A-1040 Wien
b: Integrated Microsystems Austria, Victor Kaplan Strasse 2, A-2700 Wiener Neustast
c: Tomeckova 3, CZ-63800, Brno

Abstract

This paper presents a concept for avoiding collisions during micro assembly processes in the camber of a Scanning Electron Microscope (SEM). Focus is the phase of approaching of a micro-gripper to the specimen holder and the phase of picking up the micro-components that are positioned on it. Although the 3D position of the gripper tips should be known exactly the current design of equipment in the SEN chamber does not allow an assesment of the position in the z-direction. This uncertainty of relative positions causes a high risk that tips of micro-crippers break if colliding with the speciment holder as the operator has no information about the distance

D. Ulieru(a), Alina Matei(b), Elena Ulieru(c), A. Tantau(c)
a: ROMES S.A., 126A, Iancu Nicolae Str., Bucharest, 72996, Romania
b: National Institute for Research and Development in Microtechnologies, 32B, Erou Iancu Nicolae Str., Bucharest, 077190, Romania
c: SITEX 45 SRL, 114, Ghica Tei Blvd., bl. 40, ap. 2, Dept. 2, Bucharest 72235, Romania

Abstract

The permanent development of microelectronics technologies provide new challenges for miniaturization and complexity increasing for new packaging technologies. So the exciting applications for microsystems, sensors and actuators production are looking for the best quality hermetic sealing of metal packages. The paper showed our researches and experiments results for a new approach to quality assurance in resistance welding. These will analyze the main causes of weld failures and also our methods of determining its value. On the basis of this requirement have monitored through the weld sequence, integrated concept of power monitor. The technical features developed a modern concept applicable to a wider range of fields. Our monitor could be used to wide range of welding technologies like distributed spot and focused spot, projection, roller spot and mash welding machines, working with single or three phase, ac. or dc. The experiments with our equipment have proven its advantage for fast production assembly line.

V. Mayer, T. Botzelmann, K.-P. Fritz, J. Seybold, H. Kück
Hahn-Schickard-Gesellschaft, Institute of Micro Assembly Technology, Allmandring 9b, 70569 Stuttgart, Germany

Abstract

At HSG-IMAT a new concept for an absolutely encoded optical angular resolver has been developed. The key element of the sensor concept is a disc with a high precision solid measure which is fabricated using the well known manufacturing process for compact discs (CD-Technology). Using this process, it is possible to fabricate a high precision solid measure in high quantities and at low manufacturing costs. To detect the absolute angular position, a laser beam is focused onto the solid measure. The beam is deflected by the diffractive gratings of the solid measure, whereupon the different first orders fall onto separated elements of a photo diode array. To verify the principle of operation an experimental setup assembled under a microscope, with a CCD-chip instead of a photodiode array, was used to demonstrate the signal modulation. Based on these experiments, a small size demonstrator device was designed and assembled. The successful experimental results with this demonstrator device show the large potential of this new sensor concept for different applications.

H. Willeck(a), W. Eberhardt(a), H. Kück(b)
a: Hahn-Schickard-Institute of Microassembly Technology HSG-IMAT, Stuttgart, Germany
b: University of Stuttgart, Institute of Micro and Precision Engineering, Germany

Abstract

Through miniaturisation and 3D capability moulded interconnect devices (MID) offer great opportunities for various applications in a broad industrial field. Especially, when applying the laser-direct-structuring process of the company LPKF (LPKF-LDS® process) fine conductors can be fabricated on thermoplastic substrates. A main criterion for the industrial application is the adhesive strength of the conductors. As for LDS MID there is currently no suitable test method for directly determining the adhesive strength of conductors. Therefore, a measuring device consisting of a sensor and peel off unit has been developed at HSG-IMAT. It has been used to investigate a measuring principle utilising a peel off chisel for adhesion determination. Promising and repeatable results have been obtained by testing conductors on thermoplastic substrates.