Invited Keynote Speakers

PID180145

Lab on a Chip : Advances in packaging for MEMS and Lab on a Chip

Dr. Fabien Sauter-Starace(a), C. Pudda(a), C. Delattre(a), H. Jeanson(a), C. Gillot(b), N. Sarrut(a), O. Constantin(a), R. Blanc(a)

a: CEA, LETI, Department Microtechnology for Biology and Health-care, France
b: CEA-LETI, Department Heterogeneous Silicon Integration, France

Abstract

In the field of bioMems or Lab on a Chip, one may have to handle fluid exchanges even at high pressure, moving parts, temperature sensitive probes. This specificity triggers huge packaging issues because most of the packaging techniques inherited from the microelectronic require thermal cycles at temperature above 350°C. In this paper, we first present the requirement of representative lab on chip projects carried out at the LETI in order to introduce two specific solutions of this field. Afterwards we present a brief review of the packaging processes used in the MEMS facilities eventually and introduce low temperature packaging processes developed at the CEA Leti to process lab on chip with MEMS and BioMEMS. We intend to develop robust and collective solutions (wafer level packaging). The first solution relies on a thin film approach develop for MEMS using silicon nitride cap on a sacrificial layer. The second one was especially designed for temperature sensitive lab on chips hence can be carried out at room temperature.

Keywords: packaging, lab on chip, thin film, in line screen-printing

PID190079

Micro- and nano- structuring using ion beams

A. Dietzela , W.H. Bruengerb, H. Loeschnerc, E. Platzgummerc

a: Eindhoven University of Technology, 5600 MB Eindhoven, the Netherlands
b: Fraunhofer Institute for Silicon Technology (ISiT), Fraunhoferstr. 1, D-25524 Itzehoe, Germany
c: IMS Nanofabrication GmbH, Schreygasse 3, A-1210 Wien, Austria

Abstract

Ion beam techniques such as ion projection can be used to structure materials on micrometer and nanometer scales. It can complement current optical or e-beam lithography techniques for micro- or nanodevice fabrication. Besides ion beam lithography also direct ion beam structuring methods that do not rely on resist materials for the pattern transfer have been investigated. Local sputtering, magnetic nanopatterning and inducement of selective electroplating are examples for such resistless ion beam patterning techniques. A new type of instrument based on a parallel multibeam concept will allow combining high resolution with high throughput.

Keywords: ion beam lithography, direct ion beam structuring, nanopatterning

PID203679

Micromoulding - Precision Processing for Controlled Products

P D Coates, B R Whiteside, M T Martyn, R Spares, T Gough

Polymer IRC/ Polymer CIC, School of Engineering, Design & Technology, University of Bradford, Bradford BD7 1DP, UK

Abstract

Micromoulding is an emerging field which has seen the evolution of conventional polymer injection moulding techniques for the manufacture of 3-dimensional components of sub-milligramme masses and/or microscale surface features. Micromoulding incurs extremely high strain rates and temperature gradients, particularly at the gate of the cavity. A range of issues associated with this, including high strain rate rheology of polymers (including experimental observation of in-cavity flows) and effects on orientation, residual stress and property developments, including surface replications have been explored in our laboratories and with collaborators. A major aim is to achieve controlled, repeatable dimensions and properties in micromoulded products, and to model this process - including molecularfeature models. The key factors determining control of precision products are discussed.

Keywords: micromoulding, miniature, precision moulding

PID204302

Automatic Nanohandling Station inside a Scanning Electron Microscope

S. Fatikow, Th. Wich, St. Kray, H. Hülsen, T. Sievers, M. Jähnisch, V. Eichhorn

Division Microrobotics and Control Engineering, University of Oldenburg, D26111 Oldenburg, Germany

Abstract

Current research work on the development of an automated nanohandling cell in a scanning electron microscope (SEM) is presented. Two experimental setups are shown, in which nanohandling robots ooperate in the vacuum chamber of an SEM. A client-server control system that can integrate various microrobots and sensors has been developed and evaluated by automatic handling of TEM (transmission electron microscope) lamellae by two nanorobots. The robots are controlled in a closed-loop way by using images from several CCD cameras and from the SEM. Algorithms for real-time processing of noisy SEM images have been implemented and tested. The experiment on automatic handling of TEM lamellae inside an SEM is described. The other setup contains a nanohandling robot using the probe of an atomic force microscope (AFM) as an end-effector. The manipulation of individual multiwall carbon nanotubes (MW-CNTs) and the characterization of nanofilms by nanoindentation are the applications being investigated. The experimental setup includesf a nanopositioning piezo sample stage with three degrees of freedom (DoF) and a three-axes nanomanipulator. Piezoresistive AFM probes are applied as an end-effector. This way the acting forces can be detected allowing force feedback for the station's control system. First investigations have been carried out by bending of MWNTs and calculating their elastic modulus.

Keywords: microrobotics, nanohandling automation, SEM image processing, nanocharacterization

PID208010

Recent Evolution of Electrical Discharge Machining

N. Mohri(a), T. Tani(b)

a: Department of Precision Machinery Engineering, The University of Tokyo, Tokyo, Japan

b: Tsukuba University of Technology, Tsukuba, Japan

Abstract

Electrical Discharge machining (EDM) is a comparatively new machining method which has several decades of history since it has been invented. At its beginning, it was developed as a precision machining method for hard materials. In recent years, several researches and methods based on the electrical discharge phenomena have been proposed. Mirror like finish machining, surface modification of mold die, machining of insulating materials and micro products manufacturing are noted among these researches and methods in the EDM field. These methods are particularly concerned with control of surface characteristics of the work piece and with control of electrode motion. In this paper, we introduce and discuss surface machining methods, insulating ceramics machining by EDM and micro EDM with which we have been associated.

Keywords: Electrical discharge machining, Finishing, Surface modification, Insulating ceramics, Micro EDM